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US20150223335 |
PRINTED CIRCUIT BOARD WITH COEXTENSIVE ELECTRICAL CONNECTORS AND CONTACT PAD AREAS
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure... |
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US20130100624 |
CIRCUIT BOARD CONTACT PADS
The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom... |
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US20150245466 |
PADDLE CARD WITH IMPROVED PERFORMANCE
A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged... |
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US20140151106 |
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section... |
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US20130319749 |
PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD
Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting... |
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US20130153269 |
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such... |
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US20110157808 |
Patch on interposer through PGA interconnect structures
Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a... |
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US20130213705 |
METHOD OF FABRICATING PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD
A method of fabricating a printed-wiring board, includes: forming a through-hole across a thickness of a printed-wiring board, the forming of the through-hole including forming a first opening... |
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US20140225152 |
WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME, AND MANUFACTURING METHOD FOR BOTH
A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically... |
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US20110132651 |
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric... |
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US20130175077 |
PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least... |
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US20120292091 |
CIRCUIT BOARD HAVING BYPASS PAD
An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a... |
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US20120129011 |
Printed circuit board and battery pack using the same
A printed circuit board includes a base substrate, at least one through-hole in the base substrate, a connection tab extending through the through-hole, an electrical element on the base substrate... |
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US20120175157 |
WIRING BOARD AND METHOD OF PRODUCING THE SAME
A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an... |
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US20130008704 |
BRIDGING STRUCTURE OF A TOUCH PANEL
A bridging structure of a touch panel is provided, which includes a transparent conducting layer, an insulating layer, and a conducting layer sequentially stacked on a transparent substrate. The... |
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US20100012357 |
Printed Circuit Board With Improved Via Design
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive... |
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US20140069704 |
Method and structure for forming contact pads on a printed circuit board using zero under cut technology
A method and an apparatus for forming a contact pad on a printed circuit board over a filled plate via or blind in which an additional metallic or a non metallic coating is applied to a final... |
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US20140153200 |
PRINTED CIRCUIT BOARD
A printed circuit board includes a ground layer, a metal board, a via, and a power layer. The metal board is arranged between the ground layer and the power layer. The via is electrically... |
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US20130319738 |
MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH THICKNESS COAXIAL STRUCTURES
A multilayer electronic structure comprising a plurality of dielectric layers extending in an X-Y plane and comprising at least one coaxial pair of stacked posts extending through at least one... |
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US20110079419 |
WIRING BOARD
The wiring board includes: a base material; a copper pattern which is formed in one surface of the base material, and made of a first metal; and a first nickel land and a second nickel land which... |
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US20130133939 |
WIRED CIRCUIT BOARD
A wired circuit board includes an insulating layer formed with a first opening and a second opening, a conductive layer formed on the insulating layer and including a terminal overlapping the... |
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US20100294555 |
Arrangement for Energy Conditioning
Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences. |
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US20130106459 |
3D-IC INTERPOSER TESTING STRUCTURE AND METHOD OF TESTING THE STRUCTURE
An interposer for a 3D-IC is provided with a plurality of functional metal wiring segments where the plurality of functional metal wiring segments are connected in series by a plurality of dummy... |
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US20120043123 |
PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD
[Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. [Solution(s)] To lower... |
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US20150223336 |
CIRCUIT COMPONENT BRIDGE DEVICE
A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the... |
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US20140209369 |
PRINTED CIRCUIT BOARD
A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and... |
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US20110253427 |
PARALLEL LIGHT-EMITTING CIRCUIT OF PARALLEL LED LIGHT-EMITTING DEVICE AND CIRCUIT BOARD THEREOF
A circuit board of a parallel light-emitting circuit of parallel LED light-emitting device has an electrical insulation board, two wire patterns and at least two power wires. The two wire patterns... |
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US20150138742 |
BUTTONED SOLDERING PAD FOR USE WITH FINE-PITCH HOT BAR SOLDERING
A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a... |
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US20150264804 |
PCB BACK DRILL DETECTION METHOD AND PCB PLATING
A method for detecting back-drilled holes in a PCB and a PCB panel are provided. The method comprises: forming, on a metal layer of a first inner layer of a multi-layer PCB, metal rings according... |
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US20150189754 |
PRINTED CIRCUIT BOARD COPPER PLANE REPAIR
A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of... |
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US20130176692 |
METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD
For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base... |
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US20130021739 |
Multi-layer Printed Circuit Board With Power Plane Islands To Isolate Noise Coupling
Multi-layer printed circuit boards (PCB) with power plane islands to isolate noise coupling are provided. In addition, methods and computer program products for manufacturing multi-layer PCBs with... |
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US20120039053 |
SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM
A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into... |
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US20110111264 |
PRINTED CIRCUIT BOARD AND FUEL CELL
A rectangular collector portion is formed on each of a first insulating portion and a second insulating portion. A cover layer is provided on the first insulating portion to cover the collector... |
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US20140360770 |
PRINTED CIRCUIT BOARD
An exemplary printed circuit board includes a planar base, a first signal via defined in the base, a second signal via defined in the base, a first ground via defined in the base adjacent to the... |
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US20110290545 |
THROUGH WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
A through wiring board provided with through wiring extending through the through hole of the board. The through wiring board comprises a through hole made through the board, through extension... |
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US20130269995 |
PRINTED CIRCUIT BOARD
A printed circuit board is provided. The printed circuit board includes a number of welding points in a row for soldering of a series of welding feet of a component thereto. Each welding point... |
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US20150211837 |
SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED VIA IN A PRINTED CIRCUIT BOARD
In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the... |
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US20110104948 |
SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE
An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a... |
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US20120228017 |
WIRING BOARD FOR ELECTRONIC PARTS INSPECTING DEVICE AND ITS MANUFACTURING METHOD
A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with a few number of jigs is provided. In certain embodiments the... |
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US20140284092 |
SPLIT PAD FOR CIRCUIT BOARD
An electronic device such as a circuit board has a contact pad for connection to a contact of a component, and a pad portion interconnection. The contact pad has physically separate pad portions.... |
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US20140332258 |
DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
An object of the present invention is to provide a double-sided printed wiring board in which a blind via hole can be easily and reliably formed, which can be accurately applied to lands of a... |
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US20150156875 |
WIRING BOARD
An wiring board of the present invention includes an insulating board, a pair of signal external connection pads, a pair of ground external connection pads, a pair of signal through-hole... |
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US20140268614 |
COUPLED VIAS FOR CHANNEL CROSS-TALK REDUCTION
Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT)... |
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US20140353025 |
PRINTED CIRCUIT BOARD
A printed circuit board includes a first insulating layer; a pad formed on the first insulating layer; a second insulating layer covered on the first insulating layer having the pad thereon; and a... |
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US20110024177 |
METHOD FOR SOLDERING ELECTRONIC COMPONENTS OF CIRCUIT BOARD AND CIRCUIT BOARD STRUCTURE THEREOF
A method for soldering electronic components of a circuit board and a circuit board structure thereof are presented. The method includes providing a circuit board first; disposing at least one... |
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US20120255769 |
PRINTED CIRCUIT BOARD
A printed circuit board including: a first insulation layer; a second insulation layer stacked over the first insulation layer; a circuit pattern and a via land buried in the second insulation... |
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US20130081870 |
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming... |
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US20120234591 |
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive... |
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US20110100698 |
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
A wiring board has a first rigid wiring board having a substrate with a penetrating hole, a first insulation layer formed on the substrate to cover at least one opening of the penetrating hole,... |