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US20150223335 PRINTED CIRCUIT BOARD WITH COEXTENSIVE ELECTRICAL CONNECTORS AND CONTACT PAD AREAS  
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure...
US20130100624 CIRCUIT BOARD CONTACT PADS  
The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom...
US20150245466 PADDLE CARD WITH IMPROVED PERFORMANCE  
A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged...
US20140151106 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD  
An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section...
US20130319749 PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD  
Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting...
US20130153269 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such...
US20110157808 Patch on interposer through PGA interconnect structures  
Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a...
US20130213705 METHOD OF FABRICATING PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD  
A method of fabricating a printed-wiring board, includes: forming a through-hole across a thickness of a printed-wiring board, the forming of the through-hole including forming a first opening...
US20140225152 WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME, AND MANUFACTURING METHOD FOR BOTH  
A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically...
US20110132651 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric...
US20130175077 PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK  
A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least...
US20120292091 CIRCUIT BOARD HAVING BYPASS PAD  
An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a...
US20120129011 Printed circuit board and battery pack using the same  
A printed circuit board includes a base substrate, at least one through-hole in the base substrate, a connection tab extending through the through-hole, an electrical element on the base substrate...
US20120175157 WIRING BOARD AND METHOD OF PRODUCING THE SAME  
A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an...
US20130008704 BRIDGING STRUCTURE OF A TOUCH PANEL  
A bridging structure of a touch panel is provided, which includes a transparent conducting layer, an insulating layer, and a conducting layer sequentially stacked on a transparent substrate. The...
US20100012357 Printed Circuit Board With Improved Via Design  
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive...
US20140069704 Method and structure for forming contact pads on a printed circuit board using zero under cut technology  
A method and an apparatus for forming a contact pad on a printed circuit board over a filled plate via or blind in which an additional metallic or a non metallic coating is applied to a final...
US20140153200 PRINTED CIRCUIT BOARD  
A printed circuit board includes a ground layer, a metal board, a via, and a power layer. The metal board is arranged between the ground layer and the power layer. The via is electrically...
US20130319738 MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH THICKNESS COAXIAL STRUCTURES  
A multilayer electronic structure comprising a plurality of dielectric layers extending in an X-Y plane and comprising at least one coaxial pair of stacked posts extending through at least one...
US20110079419 WIRING BOARD  
The wiring board includes: a base material; a copper pattern which is formed in one surface of the base material, and made of a first metal; and a first nickel land and a second nickel land which...
US20130133939 WIRED CIRCUIT BOARD  
A wired circuit board includes an insulating layer formed with a first opening and a second opening, a conductive layer formed on the insulating layer and including a terminal overlapping the...
US20100294555 Arrangement for Energy Conditioning  
Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.
US20130106459 3D-IC INTERPOSER TESTING STRUCTURE AND METHOD OF TESTING THE STRUCTURE  
An interposer for a 3D-IC is provided with a plurality of functional metal wiring segments where the plurality of functional metal wiring segments are connected in series by a plurality of dummy...
US20120043123 PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD  
[Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. [Solution(s)] To lower...
US20150223336 CIRCUIT COMPONENT BRIDGE DEVICE  
A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the...
US20140209369 PRINTED CIRCUIT BOARD  
A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and...
US20110253427 PARALLEL LIGHT-EMITTING CIRCUIT OF PARALLEL LED LIGHT-EMITTING DEVICE AND CIRCUIT BOARD THEREOF  
A circuit board of a parallel light-emitting circuit of parallel LED light-emitting device has an electrical insulation board, two wire patterns and at least two power wires. The two wire patterns...
US20150138742 BUTTONED SOLDERING PAD FOR USE WITH FINE-PITCH HOT BAR SOLDERING  
A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a...
US20150264804 PCB BACK DRILL DETECTION METHOD AND PCB PLATING  
A method for detecting back-drilled holes in a PCB and a PCB panel are provided. The method comprises: forming, on a metal layer of a first inner layer of a multi-layer PCB, metal rings according...
US20150189754 PRINTED CIRCUIT BOARD COPPER PLANE REPAIR  
A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of...
US20130176692 METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD  
For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base...
US20130021739 Multi-layer Printed Circuit Board With Power Plane Islands To Isolate Noise Coupling  
Multi-layer printed circuit boards (PCB) with power plane islands to isolate noise coupling are provided. In addition, methods and computer program products for manufacturing multi-layer PCBs with...
US20120039053 SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM  
A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into...
US20110111264 PRINTED CIRCUIT BOARD AND FUEL CELL  
A rectangular collector portion is formed on each of a first insulating portion and a second insulating portion. A cover layer is provided on the first insulating portion to cover the collector...
US20140360770 PRINTED CIRCUIT BOARD  
An exemplary printed circuit board includes a planar base, a first signal via defined in the base, a second signal via defined in the base, a first ground via defined in the base adjacent to the...
US20110290545 THROUGH WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A through wiring board provided with through wiring extending through the through hole of the board. The through wiring board comprises a through hole made through the board, through extension...
US20130269995 PRINTED CIRCUIT BOARD  
A printed circuit board is provided. The printed circuit board includes a number of welding points in a row for soldering of a series of welding feet of a component thereto. Each welding point...
US20150211837 SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED VIA IN A PRINTED CIRCUIT BOARD  
In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the...
US20110104948 SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE  
An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a...
US20120228017 WIRING BOARD FOR ELECTRONIC PARTS INSPECTING DEVICE AND ITS MANUFACTURING METHOD  
A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with a few number of jigs is provided. In certain embodiments the...
US20140284092 SPLIT PAD FOR CIRCUIT BOARD  
An electronic device such as a circuit board has a contact pad for connection to a contact of a component, and a pad portion interconnection. The contact pad has physically separate pad portions....
US20140332258 DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME  
An object of the present invention is to provide a double-sided printed wiring board in which a blind via hole can be easily and reliably formed, which can be accurately applied to lands of a...
US20150156875 WIRING BOARD  
An wiring board of the present invention includes an insulating board, a pair of signal external connection pads, a pair of ground external connection pads, a pair of signal through-hole...
US20140268614 COUPLED VIAS FOR CHANNEL CROSS-TALK REDUCTION  
Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT)...
US20140353025 PRINTED CIRCUIT BOARD  
A printed circuit board includes a first insulating layer; a pad formed on the first insulating layer; a second insulating layer covered on the first insulating layer having the pad thereon; and a...
US20110024177 METHOD FOR SOLDERING ELECTRONIC COMPONENTS OF CIRCUIT BOARD AND CIRCUIT BOARD STRUCTURE THEREOF  
A method for soldering electronic components of a circuit board and a circuit board structure thereof are presented. The method includes providing a circuit board first; disposing at least one...
US20120255769 PRINTED CIRCUIT BOARD  
A printed circuit board including: a first insulation layer; a second insulation layer stacked over the first insulation layer; a circuit pattern and a via land buried in the second insulation...
US20130081870 MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD  
A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming...
US20120234591 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD  
An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive...
US20110100698 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board has a first rigid wiring board having a substrate with a penetrating hole, a first insulation layer formed on the substrate to cover at least one opening of the penetrating hole,...