Matches 1 - 50 out of 300 1 2 3 4 5 6 >


Match Document Document Title
US20140218883 ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY  
An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within...
US20080047741 HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF  
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The...
US20170077042 APPARATUS AND METHOD FOR ELECTROSTATIC SPRAYING OR ELECTROSTATIC COATING OF A THIN FILM  
Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device...
US20160219702 SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE  
A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor...
US20100073894 Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same  
A coreless substrate includes a stiffener material (110, 210, 620) having a plated via (120, 320) formed therein, an electrically insulating material (130, 230, 830) above the stiffener material,...
US20150041204 MICROELECTRONIC PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAMES CONFIGURED FOR STACKED DIE PACKAGES, AND ASSOCIATED SYSTEMS AND METHODS  
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods are disclosed. A system in accordance with one embodiment...
US20080173477 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same  
A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided...
US20150060127 COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A combined printed wiring board includes a multilayer printed wiring board, and a wiring film fixed to a surface of the multilayer printed wiring board and including a first wiring structure...
US20100195011 SUBSTRATE FOR DISPLAY AND LIQUID CRYSTAL DISPLAY UTILIZING THE SAME  
The invention provides a substrate for a display which can be easily repaired even when there are problems such as inter-layer shorting attributable to invasion of static electricity. The...
US20100181101 PRINTED CIRCUIT BOARD  
A printed circuit board (PCB) reduces a simultaneous switching noise (SSN) causing power noise, thereby reducing radiated electromagnetic interference (EMI). In a double-layered PCB, a first...
US20050081944 Display having addressable characters  
An addressable display comprises a woven article including functional yarn woven therein, each functional yarn having an addressable device for controlling display elements thereon. Addressing...
US20120006591 Wiring Substrate and Method for Manufacturing Wiring Substrate  
A wiring substrate that prevents the occurrence of delamination near an interface between an insulation layer and an electrode pad, which is formed in a recess of the insulation layer. An...
US20090078456 Three dimensional packaging optimized for high frequency circuitry  
At least an embodiment of the present technology provides a method of manufacturing a mechanically adapting interconnecting device for multi-substrate packages comprising placing a metal laminate...
US20150262927 ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHODS OF MANUFACTURING ELECTRONIC PACKAGE AND PACKAGE CARRIER  
A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the holding substrate. Next, an insulating...
US20070158105 MULTILAYER WIRING BOARD CAPABLE OF REDUCING NOISE OVER WIDE FREQUENCY BAND WITH SIMPLE STRUCTURE  
A multilayer wiring board 10 has a high-capacitance layer 121 formed between a ground layer 141 and a power supply layer 15 and a high-capacitance layer 122 formed between the power supply layer...
US20060191707 Circuit board and method for producing the same  
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating...
US20090289360 WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTAL MOVEMENT OF TERMINALS OF IC DURING PRESSING  
A method of forming an electronic assembly including a plurality of IC die having bonding terminals that have a solderable material thereon and a workpiece. The workpiece includes workpiece...
US20090288870 WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME  
A method of manufacturing a wiring substrate of the present invention, includes a step of forming a first wiring layer on an underlying layer, a step of forming a stacked body in which a...
US20110259627 Circuit board with buried circuit pattern  
A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit...
US20070068700 Electric contact and method for producing the same and connector using the electric contacts  
A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper,...
US20060213685 Single or multi-layer printed circuit board with improved edge via design  
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive...
US20130057497 TOUCH SCREEN, TRANSPARENT CIRCUIT BOARD FOR TOUCH SCREEN, AND METHOD FOR FABRICATING TOUCH SCREEN  
Provided is a method for fabricating a transparent circuit board for a touch screen. The transparent circuit board includes a transparent substrate that has a conductive bridge layer deposited...
US20110278056 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD UNIT, MANUFACTURING APPARATUS THEREOF, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT  
A manufacturing method of a printed circuit board unit is provided. A portion of bumps which is arranged on an electronic component is pressed to lower heights of the portion of bumps as compared...
US20110024160 MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD  
A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the...
US20130329391 PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE  
An electronic device comprises: a printed wiring board that comprises a substrate, pads formed on the substrate, and an insulating film layer covering a surface of the substrate on which the pads...
US20130081869 TOUCH SENSING APPARATUS AND METHOD OF MANUFACTURING THE SAME  
Disclosed is a touch sensing apparatus having a transparent substrate that includes a touch sensing region and a peripheral region outside the touch sensing region. The touch sensing region may...
US20060121722 Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components  
A method of making a printed circuit board in which openings of different length are formed using a cover atop one of the openings to prevent dielectric material from an interim layer of...
US20140138141 PERIPHERAL CIRCUIT STRUCTURE  
A peripheral circuit structure disposed on a substrate having an element region and a peripheral circuit region is provided. The peripheral circuit structure located in the peripheral circuit...
US20120267155 CIRCUIT SUBSTRATE  
A circuit substrate includes a base layer, a patterned conductive layer, a dielectric layer, an outer pad and a conductive block. The patterned conductive layer is disposed on the base layer and...
US20120032337 Flip Chip Substrate Package Assembly and Process for Making Same  
Apparatus and methods for providing a package substrate and assembly for a flip chip integrated circuit. A substrate is provided having a solder mask layer, openings in the solder mask layer for...
US20100319974 PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE  
An electronic device comprises: a printed wiring board that comprises a substrate, pads formed on the substrate, and an insulating film layer covering a surface of the substrate on which the pads...
US20090229872 ELECTRONIC COMPONENT BUILT-IN BOARD, MANUFACTURING METHOD OF ELECTRONIC COMPONENT BUILT-IN BOARD, AND SEMICONDUCTOR DEVICE  
An electronic component built-in board including an electronic component having an electrode; a conductive material part arranged in an identical plane to the electronic component; and a resin...
US20150053474 FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE  
An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the...
US20120261174 CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT  
Disclosed is a conductive connecting material 30 used to form conductive portions on a plurality of terminals 11 of an electronic member having a substrate 10 and the plurality of terminals 11...
US20110067911 METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE  
In this method of bonding a part to a substrate using a solder paste, the solder paste is mounted or applied between a metallization layer formed on the substrate and a metallization layer formed...
US20100090339 Structures and Methods for Wafer Packages, and Probes  
This document describes the fabrication and use of multilayer ceramic substrates, having one or more levels of internal thick film metal conductor patterns, wherein any or all of the metal vias...
US20090032299 Suspension board with circuit  
A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an...
US20120018864 BONDING STRUCTURE AND METHOD  
A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a...
US20140360768 SEMICONDUCTOR PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a semiconductor package board and a method for manufacturing the same. The semiconductor package board according to a preferred embodiment of the present invention includes an...
US20110291253 LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF  
A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as...
US20110061922 PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME  
Disclosed is a package substrate, which includes an insulating layer including a circuit layer having a via for connecting layers and an insulating member formed in the insulating layer so as to...
US20080296056 Printed circuit board, production method therefor, electronic-component carrier board using printed circuit board, and production method therefor  
A printed wiring board has a substrate having a first surface and a second surface on both sides of the substrate. A cavity is provided on the first surface. The cavity caves in towards the second...
US20150036272 ELECTRONIC DEVICE AND SUBSTRATE UNIT  
An electronic device includes: substrate unit including a signal terminal provided over a first edge of a substrate body, and a power terminal provided over a second edge that is different from...
US20060144618 Fill plated structure of inner via hole and manufacturing method thereof  
A fill plated structure of an inner via hole, which includes an electroless plated layer formed on a copper clad laminate having an inner via hole formed therethrough, a first copper electroplated...
US20090168391 SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME  
A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the...
US20060254808 Substrate precursor structures  
Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer...
US20100139966 INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS  
An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions...
US20100096168 ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS  
A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper,...
US20090250258 Wiring Substrate, Semiconductor Package, Electronic Instrument, And Wiring Substrate Manufacturing Method  
One embodiment of the invention is a wiring substrate including an insulating base material layer, a metal layer on the insulating base material layer, and a solder resist laminated to the most...
US20090236143 Multilayer wiring board, multilayer wiring board unit and electronic device  
A multilayer wiring board that includes multiple wiring layers, multiple insulating layers stacked alternately with the multiple wiring layers to form a multilayer structure, a first via, and a...

Matches 1 - 50 out of 300 1 2 3 4 5 6 >