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US20140036515 SURFACE MOUNT CIRCUIT BOARD INDICATOR  
The present invention is directed to a surface mount circuit board indicator. In one embodiment the surface mount circuit board indicator includes a printed circuit board (PCB) having at least one...
US20110308847 Method for high-temperature circuit board assembly  
The creation of a circuit board which contains electrical interconnections between the circuit board traces and electronic devices mounted on the circuit board where the circuit board assembly can...
US20130213705 METHOD OF FABRICATING PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD  
A method of fabricating a printed-wiring board, includes: forming a through-hole across a thickness of a printed-wiring board, the forming of the through-hole including forming a first opening...
US20120236523 BOARD UNIT AND METHOD OF FABRICATING THE SAME  
A board unit includes a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface a first...
US20120073864 DIRECT MECHANICAL/ELECTRICAL PRINTED CIRCUIT BOARD INTERFACE  
A printed circuit board is disclosed. The board has a first end having a plurality of fingers in a cooperating relationship with a second end of a second adjacent circuit board. The board has a...
US20150021083 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF  
An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the...
US20110123838 SECONDARY BATTERY AND CIRCUIT BOARD ASSEMBLY SUITABLE FOR SECONDARY BATTERY  
Disclosed are a secondary battery and a circuit board assembly suitable for the secondary battery. The secondary battery includes a bare cell including an electrode terminal, a circuit board...
US20130248233 WIRED CIRCUIT BOARD  
A wired circuit board includes a wire and a terminal formed continuously to the wire and electrically connected to an electronic element at one surface thereof in a thickness direction. The...
US20100252315 Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas  
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure...
US20110061918 BACKBOARD ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME  
A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side...
US20130140070 SYSTEM FOR CONNECTING ELECTRICAL CABLES TO A PRINTED CIRCUIT BOARD  
An electrical communication system includes a printed circuit board (PCB) having first and second ground plates and a plurality of signal vias and a plurality of ground vias extending between and...
US20140153200 PRINTED CIRCUIT BOARD  
A printed circuit board includes a ground layer, a metal board, a via, and a power layer. The metal board is arranged between the ground layer and the power layer. The via is electrically...
US20140014403 ENERGY STORAGE AND DISPENSING FLEXIBLE SHEETING DEVICE  
An energy storing and dispensing sheeting having addressable energy storing cells is disclosed. A free-forming process of fabricating energy storing sheets is disclosed. An interconnect interface...
US20110100694 GROUND TERMINATION WITH DAMPENED RESONANCE  
A system of dampening resonance is provided. In an embodiment, ground traces may be coupled to a common or ground plane via dampening elements such as resistors a predetermined distance from a...
US20120273266 INVERTER AND ELECTRONIC DEVICE USING THE INVERTER  
An inverter and an electronic apparatus using the inverter are disclosed. The electronic apparatus has a circuit board and an inverter. The circuit board has an opening. The inverter has a wiring...
US20130094228 Electronic assembly and a LED retrofit lamp having the Electronic assembly  
The present invention relates to an electronic assembly which includes a printed circuit board and at least two I-type inductors arranged on the printed circuit board, the I-type inductor include...
US20110278054 CIRCUIT BOARD WITH NOTCHED CONDUCTOR PADS  
Various circuit board conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided. The method includes forming a first conductor pad on...
US20130292165 CIRCUIT BOARD  
A circuit board is provided. The circuit board is suitable for carrying a chip. The circuit board includes a dielectric layer and a first circuit layer. The first circuit layer is disposed on a...
US20130048360 SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE  
Method for providing a printed circuit board (16) with an electronic device (1), wherein the electronic device (1) having at least one external soldering pad (11) having a predetermined size for...
US20120325538 PRINTED CIRCUIT BOARD ASSEMBLY  
A printed circuit board assembly includes: a base material of printed boards; a solder pad formed on a pad-forming portion of the base material of printed boards and having a lead-coupling...
US20140131073 MULTI-LAYER WIRING BOARD  
A multi-layer wiring board includes a resin base, a wiring pattern, an adhesive layer, and a via. The wiring pattern includes a land provided on the resin base. The adhesive layer is stacked on...
US20130044448 Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement  
A method for mounting a component to an electric circuit board (10), comprising: providing at least one cavity in the electric circuit board; arranging the component in the at least one cavity;...
US20130335933 CIRCUIT BOARD AND ELECTRONIC DEVICE  
A circuit board includes a substrate having a mounting pad formed thereon, a packaged electronic device having a mounting surface coupled to the mounting pad and an electrode formed on a side...
US20110162877 COMPOSITE ELECTRONIC PARTS  
It is provided a composite electronic part having magnetic material 1 and dielectric material 2 and made by co-sintering at a temperature of 1000° C. or lower. The magnetic material 2 comprises a...
US20110003179 PROTECTION CIRCUIT BOARD, SECONDARY BATTERY, AND BATTERY PACK  
A protection circuit board, a secondary battery, and a battery pack including a secondary battery. In embodiments of a protection circuit board, as well as a secondary battery and a battery pack...
US20110063492 PCB AND CAMERA MODULE HAVING THE SAME  
A print circuit board and a camera module having the same are disclosed. A printed circuit board of the present invention that is thermally coupled to an electronic device includes: a binding...
US20110253437 PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD ASSEMBLY  
A printed circuit board includes signal holes, at least one first securing hole, and at least one second securing hole. The signal holes and the first securing hole is able to secure a first...
US20110127079 ELECTRONIC CIRCUIT MODULE AND METHOD OF CONNECTING COAXIAL CABLE  
An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a...
US20110048779 RESIN SHEET FOR CIRCUIT BOARDS, SHEET FOR CIRCUIT BOARDS AND CIRCUIT BOARD FOR DISPLAYS  
A resin sheet for circuit boards (2) obtained from a macromolecular material of the energy ray curable type and used for embedding circuit chips, which has a double bond concentration of 4.5 to 25...
US20130170164 ADHESIVE DAM  
On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the...
US20120080220 ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE  
An electronic device includes a circuit board including a first electrode and a second electrode; and an electronic component including a first terminal and a second terminal, wherein the first...
US20120292088 ELECTRONIC DEVICE WITH OBLIQUELY CONNECTED COMPONENTS  
According to the disclosure, an electronic device comprising a circuit board and an electrical component is disclosed. The circuit board has a first surface and includes a solder pad array...
US20120145443 CIRCUIT BOARD WITH DOUBLE-SIDED UNIVERSAL CIRCUIT LAYOUT AND LAYOUT METHOD THEREOF  
A circuit board with double-sided universal circuit layout for laying out electronic components has a first side with a first circuit layout thereon and an opposing second side with a second...
US20110056736 FABRICATION METHOD OF CIRCUIT BOARD, CIRCUIT BOARD, AND CHIP PACKAGE STRUCTURE  
A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a...
US20110100692 Circuit Board with Variable Topography Solder Interconnects  
Various circuit boards and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a first side of a first circuit...
US20110104948 SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE  
An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a...
US20120009973 Module Connection in a Printed Wiring Board  
An electronic device has a housing and circuitry disposed within the housing. The circuitry is mounted to, for example, a top surface of a Printed Wiring Board (PWB) disposed within the housing....
US20110180311 SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART  
A solder material with favorable mechanical properties and high corrosion resistance is provided. The solder material is not apt to be melted in a re-heating process after the soldering process is...
US20130292166 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board includes a resin layer, pads formed on the resin layer and positioned to be connected to an electronic component, and a solder-resist layer formed on the resin layer and...
US20070074897 Thermal event detection on printed wire boards  
The present invention provides a system and method for detecting thermal events on circuit boards, such as those used in information handling systems. In embodiments of the present invention, a...
US20140022742 COMPACT LOW LOSS TRANSITION WITH AN INTEGRATED COUPLER  
A compact transition structure includes a printed circuit board, wherein there is a rectangular region on one side of the printed circuit board and the rectangular region has a pair of long edges...
US20120257324 MULTILAYER CAPACITORS, METHOD FOR MAKING MULTILAYER CAPACITORS  
The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein...
US20120298407 MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTI-LAYERED CERAMIC CAPACITOR THEREON  
Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor...
US20140209366 WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD  
There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the...
US20110147063 MULTILAYER BOARD FOR SUPPRESSING UNWANTED ELECTROMAGNETIC WAVES AND NOISE  
A multilayer board for suppressing unwanted electromagnetic waves and noise includes: a power plane and a ground plane constituting a power distribution network; an electromagnetic wave...
US20110011635 Method for Arranging a Component on a Circuit Board  
A method for arranging a component on a circuit board, a circuit board, and a mobile device comprising a circuit board are described.
US20120194101 ELECTRICAL CONNECTION AND METHOD FOR MAKING THE SAME  
Electrical component assembly (30) comprising a first electrical component (32) comprising an electrical connection protrusion (34) (e.g., a solder bump) made of a first metal solder composition...
US20130256022 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD  
A wiring board assembly includes: a plurality of insulating substrates of which each includes an insulating layer and a wiring layer; a wiring board that includes pads formed on the insulating...
US20140209367 WIRING BOARD  
It is impossible to make a wiring board for noise suppression thinner, therefore, a wiring board according to an exemplary aspect of the invention includes a first wiring layer, an intermediate...
US20110147064 BORON NITRIDE AGGLOMERATED POWDER  
Novel boron nitride agglomerated powders are provided having controlled density and fracture strength features. In addition methods for producing same are provided. One method calls for providing...