Match Document Document Title
US20050013106 Peripheral card with hidden test pins  
A peripheral card includes a circuit board, various circuit elements on the circuit board, a set of user terminals, a set of test terminals, and an enclosure that covers a portion of the circuit...
US20130248234 Multilayer Printed Wiring Board  
A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a...
US20080296052 MULTILAYER PRINTED WIRING BOARD  
A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a...
US20080129320 HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF  
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The...
US20120055707 Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes  
A process is provided for fastening an electronic component to a substrate, the process including the steps of: (i) providing an electronic component and a substrate; (ii) creating a sandwich...
US20110240354 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD  
A wiring board including a substrate having a cavity, an electronic component accommodated in the cavity of the substrate, a first conductive pattern formed on a surface of the substrate and...
US20080289867 MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD  
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M...
US20080017407 Interposer and electronic device using the same  
A novel interposer(10) includes a silicon substrate(12), a plurality of through-hole conductors (20) formed on the silicon substrate, and capacitors (15) having of upper and lower electrodes...
US20060254812 Printed circuit boards having embedded thick film capacitors  
A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from...
US20080289868 CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF  
The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to...
US20060225918 Electronic device substrate and its fabrication method, and electronic device and its fabrication method  
An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component...
US20050146019 Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board  
An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes....
US20140151104 ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF  
The present invention relates to an electronic component embedded substrate including: a cavity formed in at least one insulating layer provided inside the electronic component embedded substrate;...
US20090090543 CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead...
US20080041619 Component-embedded multilayer printed wiring board and manufacturing method thereof  
A component-embedded multilayer printed wiring board and manufacturing method thereof. A component-embedded multilayer printed wiring board that includes: a first wiring board, in which a...
US20060191711 Embedded chip printed circuit board and method of manufacturing the same  
The present invention relates to an embedded chip printed circuit board in which a space required for embedding a chip is formed to a desired depth depending on various thicknesses of chips to be...
US20130301227 CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME  
A circuit module having satisfactory isolation characteristics and a method of manufacturing the same are such that electronic components are mounted on a principal surface of a circuit substrate....
US20120152604 MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTI-LAYERED CERAMIC CAPACITOR, METHOD THEREOF, LAND PATTERN OF CIRCUIT BOARD FOR THE SAME, PACKING UNIT FOR MULTI-LAYERED CERAMIC CAPACITOR TAPED HORIZONTALLY AND ALIGNING METHOD THEREOF  
The present invention provides a method of mounting a circuit board having thereon a multi-layered ceramic capacitor and a land pattern of a circuit board for the same. The method of mounting a...
US20110303451 MULTILAYER PRINTED WIRING BOARD  
A multilayer printed wiring board including a core substrate, a first conductor layer on a first surface of the substrate, a second conductor layer on a second surface of the substrate, a third...
US20100282502 MULTILAYER PRINTED WIRING BOARD  
In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out...
US20080173477 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same  
A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided...
US20130294003 SUBSTRATE FOR DISPLAY AND LIQUID CRYSTAL DISPLAY UTILIZING THE SAME  
The invention provides a substrate for a display which can be easily repaired even when there are problems such as inter-layer shorting attributable to invasion of static electricity. The...
US20130127690 ELECTRONIC APPARATUS AND DISPLAY APPARATUS  
An embodiment of the disclosure provides an electronic apparatus including: a shape memory alloy substrate; and an electronic device disposed on the shape memory alloy substrate, wherein the shape...
US20100200285 HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF  
A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect...
US20100181101 PRINTED CIRCUIT BOARD  
A printed circuit board (PCB) reduces a simultaneous switching noise (SSN) causing power noise, thereby reducing radiated electromagnetic interference (EMI). In a double-layered PCB, a first...
US20100108371 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME  
A wiring board with a built-in electronic component in which an electronic component is flip-chip mounted to be built in, including a conductive-pattern layer, a connection terminal formed in the...
US20050257957 Printed wiring board with conductive constraining core including resin filled channels  
Printed wiring boards and methods of manufacturing printed wiring boards are disclosed. In one aspect of the invention, the printed wiring boards include electrically conductive constraining cores...
US20120139483 COMPOSITE CAPACITANCE AND USE THEREOF  
A composite capacitive component includes a plurality of physically distinguishable capacitor modules which are electrically connected to each other. The distinguishable modules allow for an...
US20110127076 ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein is an electronic component-embedded printed circuit board, including: a base plate having a cavity formed therein in a thickness direction thereof; an electronic component which...
US20100147573 CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE CIRCUIT SUBSTRATE  
A thin circuit substrate and a circuit module are arranged such that the circuit module includes an IC mounted on a circuit substrate, the IC includes an IC body and an solder bump located on a...
US20100163291 SUBSTRATE EMBEDDED WITH PASSIVE DEVICE  
A substrate embedded with a passive device, including a substrate, on which a cavity is formed; a passive device in the cavity, the passive being pre-molded; and a conductive material for adhering...
US20080017409 Multilayer board  
A multilayer board includes a base member made of an insulation material. A plurality of conductor patterns is disposed in the base member in a multi-layered manner. A plurality of interlayer...
US20060291173 Printed circuit board with embedded electronic components  
A printed circuit board with embedded electronic components and fabrication method thereof are disclosed. The printed circuit board with embedded electronic components having outer electrodes...
US20050205292 Circuit and method for broadband switching noise suppression in multilayer printed circuit boards using localized lattice structures  
An apparatus for suppressing noise in an electronic device includes a multiple layer structure in which localized arrays of chip capacitors and/or patches around sources of electromagnetic waves...
US20150016082 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A printed circuit board includes an insulating layer; a via in the insulating layer, a first circuit layer formed at a first side of the insulating layer and having a portion buried in the via; a...
US20140158414 RECESSED DISCRETE COMPONENT MOUNTING ON ORGANIC SUBSTRATE  
A method and device include an organic multiple layer substrate having patterned conductors disposed on a recessed layer of the organic multiple layer substrate. A discrete component is coupled to...
US20130186676 Methods and Apparatus for a Substrate Core Layer  
A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality...
US20120234587 PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board is disclosed that includes insulating layers, conductive layers stacked with the insulating layers alternately, a through hole penetrating the insulating layers and the...
US20120138350 ELECTRONIC COMPONENT ALIGNING DEVICE, ELECTRONIC COMPONENT PACKAGING BODY, AND ELECTRONIC COMPONENT MOUNTING BOARD.  
There is provided a device for electronic components including: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer...
US20100006330 STRUCTURE AND PROCESS OF EMBEDDED CHIP PACKAGE  
A process of an embedded chip package structure includes following steps. Firstly, a metal core layer having a first surface, a second surface opposite to the first surface, an opening, and a...
US20120162945 LABEL HAVING AN ELECTRONIC FUNCTIONAL ELEMENT  
An electronic functional label and a special production process for such a label, which can be equipped with electronic components in very simple, fast, and effective manner, without a soldering...
US20110214914 SYSTEM AND METHOD FOR ATTACHING A SUBSTANTIALLY THREE DIMENSIONAL STRUCTURE TO A SUBSTANTIALLY TWO DIMENSIONAL STRUCTURE  
A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional...
US20090219457 DISPLAY SUBSTRATE, METHOD FOR REPAIRING DEFECTS THEREOF AND MOTHER SUBSTRATE HAVING THE SAME  
A display substrate includes a source pad part, a plurality of storage wirings and a first voltage wiring. The source pad part includes a first voltage input pad receiving a storage common...
US20080121417 PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR  
A package substrate having embedded capacitor is provided. The package substrate includes a first core circuit board, at least one embedded capacitor, a second core circuit board and a dielectric...
US20070143995 Circuit board having a multi-signal via  
A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive...
US20120261171 ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND CONNECTING METHOD  
To provide an anisotropic conductive film, which contains: an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing...
US20100018761 EMBEDDED CHIP SUBSTRATE AND FABRICATION METHOD THEREOF  
An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the...
US20080196931 Printed circuit board having embedded components and method for manufacturing thereof  
A printed circuit board having embedded components and a method for the manufacturing of the printed circuit board are disclosed. The printed circuit board includes: an intermediary insulation...
US20150196978 SOLDER ALLOY  
Disclosed herein are a solder alloy and an electronic device using the solder alloy to join electronic components. The solder alloy has virtually no limitation in its alloy composition, is...
US20090242253 FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS  
According to one embodiment, a plurality of conductive-paste-filling openings are provided in the cover layer to align with the conductive pattern portion, and a plurality of conductive portions...