Matches 1 - 50 out of 121 1 2 3 >


Match Document Document Title
US20120111622 Double-Sided Pressure-Sensitive Adhesive Tape or Sheet For Use In Wiring Circuit Board And Wiring Circuit Board Having The Double-Sided Pressure-Sensitive Ahesive Tape  
The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a...
US20110235348 STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGHTING DEVICE USING THE STRUCTURE  
A tin-plated surface 7 is formed by hot-dip coating a solder containing a lead-free tin as the main component on an electrode 6 of a board 4 with which a connector terminal 1 comes in contact.
US20100294551 ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING THE SAME, AND CIRCUIT CONNECTED STRUCTURE  
There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit...
US20120327583 ROBUST POWER PLANE CONFIGURATION IN PRINTED CIRCUIT BOARDS  
A robust printed circuit board (PCB) that includes at least two power layers that are used in providing power to components connected to the PCB. The power layers may be a power plane layer and a...
US20120073869 CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING THE SAME  
A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder...
US20140085551 CONDUCTIVE SUBSTRATE AND TOUCH PANEL COMPRISING SAME  
The invention relates to a conducting substrate and a touch panel comprising the same. A conducting substrate according to one embodiment of the invention comprises at least one base material and...
US20110061916 WIRING BOARD AND MANUFACTURING METHOD THEREOF  
A wiring board includes a substrate having a surface made of an insulating resin. An adhesion layer is formed on the substrate. A wiring layer is formed on the adhesion layer. The adhesion layer...
US20120186865 PASTE COMPOSITION AND PRINTED CIRCUIT BOARD  
A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the...
US20120325535 PRINTED WIRING BOARD ENCAPSULATED BY ADHESIVE LAMINATE COMPRISING A DI-ISOIMIDE, AND PROCESS FOR PREPARING SAME  
The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a...
US20100326714 PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD FABRICATION METHOD, AND ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD  
A printed circuit board include: a printed circuit board main body having a mounting area on a first surface of the printed circuit board main body and a recess being provided at a recess area on...
US20130020118 RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER  
Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average...
US20110303448 Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder  
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial...
US20130118789 FIXING METAL BRACKET FOR COMPONENT MOUNTED ON CIRCUIT BOARD  
A fixing metal bracket for a component mounted on a circuit board, includes a solder bonding plate section to be solder-fixed on a surface of a circuit board with a cream solder, and a component...
US20110247867 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION  
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic...
US20110148777 METHOD FOR BONDING FPC ONTO BASEBOARD, BONDING ASSEMBLY, AND TOUCH SCREEN  
A method for bonding a flexible printed circuit (FPC) onto a baseboard is provided. The baseboard includes a bonding region having a plurality of first electrodes, and a protective layer covering...
US20110100690 ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF MAKING THE SAME  
An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive...
US20130319737 MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL STEPPED STACKED STRUCTURES  
A multilayer electronic support structure comprising a plurality of layers extending in an X-Y plane consisting of a dielectric material surrounding metal via posts that conduct in a Z direction...
US20120031653 Printed Circuit Board made from a Composite Material  
Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber...
US20130037314 BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD  
Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive....
US20150237741 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board (PCB) includes an adhesive film disposed between an insulating layer and a circuit pattern,...
US20150083469 WIRING BOARD  
A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring formed in the through hole and...
US20140287299 Heat-Debonding Adhesives  
A heat-debonding adhesive member is provided. The heat-debonding adhesive member attaches electronic device components such as a battery and a housing together. The heat-debonding adhesive...
US20140048320 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method for manufacturing the same, the printed circuit board including an adhesion promoter (AP) film for enhancing adhesive strength, interposed...
US20100244266 METALLIC BONDING STRUCTURE FOR COPPER AND SOLDER  
The present invention discloses a metallic bonding structure for copper and solder, which applies to connect at least one electronic element. The metallic bonding structure comprises at least one...
US20150136461 SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD  
A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the...
US20110139500 ELECTRICAL CONNECTING METHOD AND ELECTRICALLY CONNECTED CONNECTION STRUCTURE  
A method of connecting a flexible flat cable and a board is provided, which includes the steps of preparing the flexible flat cable having a first connection terminal composed of a plurality of...
US20100163289 PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND METHOD OF CONNECTING PRINTED WIRING BOARD  
A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive...
US20150163924 METHOD OF BONDING ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE USING THE SAME  
Embodiments of the invention provide a method and device for bonding an electronic component with improved adhesive force. In accordance with at least one embodiment, the method includes preparing...
US20120048606 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER  
The adhesive composition of the invention contains (a) organic fine particles comprising at least one selected from the group consisting of alkyl (meth)acrylate ester-butadiene-styrene copolymer...
US20120055705 DOPO-DERIVED FLAME RETARDANT AND EPOXY RESIN COMPOSITION  
This invention relates to 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide derived additive flame-retardants, which are useful in epoxy resin compositions. The epoxy resin compositions may be...
US20080099232 THREE-DIMENSIONAL PRINTED CIRCUIT BOARD FOR USE WITH ELECTRONIC CIRCUITRY  
A method for forming and using a resulting patterned discrete section to interconnect a plurality of printed circuit boards having electrical contact pads. The patterned discrete section is...
US20100294550 BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE  
A bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge and 89.3 to 97.98% by weight of Bi has heat resistance of up to 275° C. and superior wettability, and a...
US20100044088 CONDUCTIVE ADHESIVE  
Conductive adhesives, which do not have the problem of migration in conductive metals upon application of a voltage and which exhibit low resistance values, are provided. One embodiment of the...
US20140182904 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board including an adhesive promoter interposed between an insulating layer and a circuit...
US20130025921 METHOD FOR MANUFACTURING CIRCUIT BOARD USING ELECTRICALLY CONDUCTIVE PARTICLES AND CIRCUIT BOARD MANUFACTURED BY THE METHOD  
An exemplary method for manufacturing a circuit board includes, firstly, obtaining an insulating substrate, liquid heat-curable adhesive and electrically conductive particles. The electrically...
US20070261883 Methods For Improving The Flux Compatibility Of Underfill Formulations  
In accordance with the present invention, it has been discovered that the addition of one or more cationic catalyst(s), such as onium salts as defined herein, provides improved flux compatibility...
US20090266592 CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD  
A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions...
US20090288864 CABLE HAVING ESD DISSIPATIVE ADHESIVE ELECTRICALLY CONNECTING LEADS THEREOF  
A cable in one embodiment comprises a plurality of leads; and an electrostatically dissipative adhesive operatively electrically coupling the leads together, the adhesive comprising a mixture of...
US20090154123 Systems and Methods for Providing a Grounded Card in an Information Handling System  
An information handling system includes a chassis having a guide slot and a printed circuit board placed in guide slot of the chassis. The guide slot includes at least two opposing channels...
US20070074896 Thermosetting resin composition, laminated body using it, and circuit board  
It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric...
US20100230141 STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING PRINTED WIRING BOARDS, AND ADHESIVE HAVING ANISOTROPIC CONDUCTIVITY  
The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of...
US20110030999 METAL CIRCUIT WIRING HAVING ORGANIC RESIN FOR ADHESIVE LAYERS AND METHOD OF MANUFACTURING THE SAME  
The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group...
US20100065311 CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER  
The conductive particle of the invention each comprises a conductive nucleus particle and an insulating coating containing an organic high molecular compound on the surface of the nucleus...
US20150021075 SURFACE-MOUNTING SUBSTRATE  
A surface mounting substrate for surface mounting an electronic part using a lead-free solder includes a joint portion of the substrate to which the electronic parts is joined; and a stress...
US20100025094 EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN COMPOSITION VARNISH, PREPREG, METAL CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD  
An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same...
US20090095516 DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR USE IN WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD  
The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a...
US20120292087 METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMPONENT  
The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting...
US20100212944 Silane Coupling Agents for Printed Circuit Boards  
The present invention is directed to silane coupling agents for printed circuit boards, such as high-temperature printed circuit boards (PCBs), a process for synthesizing the silane coupling...
US20080230262 ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE  
An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable...
US20100155123 HALOGEN-FREE PREPREG AND RESIN FOR PREPARING THE SAME  
A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant,...

Matches 1 - 50 out of 121 1 2 3 >