Match Document Document Title
US20110297428 FLEXIBLE FLAT CABLE  
The present invention provides a flexible flat cable which utilizes a first metal plate disposed on the lower surface of at least one end of a first metal shielding layer to achieve the functions...
US20140092569 WIRING BOARD  
A wiring board includes a base wiring board 10 and a frame wiring board 20. The base wiring board 10 has an element mounting portion 1a and a frame-shaped frame joining portion 1b on the upper...
US20110290543 METHOD FOR PRODUCING WIRING BOARD AND WIRING BOARD  
The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing board, including coating a surface...
US20150090482 CURABLE COMPOSITION FOR PRINTED CIRCUIT BOARD, CURED COATING FILM USING THE SAME, AND PRINTED CIRCUIT BOARD  
Provided are: a curable composition which can attain both good adhesion to a printed circuit board, particularly to a flexible substrate or the like; a resist coating film of the curable...
US20130146344 INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME  
Disclosed herein is an insulating resin composition for a printed circuit board, including 40 to 70 wt % of a liquid crystal oligomer shown in formula 1, 10 to 30 wt % of an epoxy resin, 10 to 30...
US20150008021 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board includes an interlayer resin insulation layer, multiple pads formed on the interlayer resin insulation layer, and multiple metal posts having bonding material portions and...
US20110290541 FLEXIBLE FLAT CABLE  
A flexible flat cable includes a first insulating layer, a conductive wire layer, a second insulating layer, a metal layer and at least one grounding element. The conductive wire layer includes a...
US20150036307 CIRCUIT BOARD  
A circuit board is described. The circuit board comprises a substrate (4), a set of contact pads (6) supported on the substrate and a plurality of discrete adhesive conductive regions disposed on...
US20130126221 METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOARD, AND ELECTRONIC DEVICE  
There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered, the manufacturing. The method includes arranging an adhesive resin sheet...
US20130153269 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such...
US20150070854 DISPLACEABLE INSULATION BARRIER  
The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board (2), said arrangement comprising the printed...
US20130118787 EPOXY RESIN COMPOSITION FOR FORMING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM, AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD  
Disclosed herein is an epoxy resin composition including a core-shell structure of microemulsion silica surrounded by surfactant. By using the epoxy resin, surface roughness of a printed circuit...
US20110284276 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME  
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing...
US20110308847 Method for high-temperature circuit board assembly  
The creation of a circuit board which contains electrical interconnections between the circuit board traces and electronic devices mounted on the circuit board where the circuit board assembly can...
US20140225152 WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME, AND MANUFACTURING METHOD FOR BOTH  
A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically...
US20120247820 RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD  
Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one...
US20130153276 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD  
A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second...
US20130000965 DIELECTRIC COMPOSITION, MULTILAYERED PRINTED CIRCUIT BOARD COMPRISING DIELECTRIC LAYER MANUFACTURED THEREOF, AND METHOD FOR PREPARING THE MULTILAYERED PRINTED CIRCUIT BOARD  
Disclosed herein are a dielectric composition of a multilayered circuit board including two types of inorganic fillers of 10 to 60 parts by weight with respect to an epoxy resin of 100 parts by...
US20090283307 SILICON NITRIDE SUBSTRATE, SILICON NITRIDE CIRCUIT SUBSTRATE USING THE SAME, AND ITS USE  
Provided are a silicon nitride substrate and a silicon nitride circuit board with excellent electrical characteristics, and power control parts utilizing them. A silicon nitride substrate...
US20130333924 MULTILAYER ELECTRONIC SUPPORT STRUCTURE WITH INTEGRAL METAL CORE  
A laminated multilayer electronic support structure comprising a dielectric with integral vias and feature layers and further comprising a planar metal core characterized by a thickness of less...
US20120037408 METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME  
There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic...
US20140000948 RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME  
There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one...
US20130043067 Wire Substrate Structure  
[PROBLEM] To provide a circuit board improved in electrical reliability. [SOLUTION] A circuit board 3 comprises a plurality of first inorganic insulating particles 13a which are connected to each...
US20110017500 PRINTED WIRING BOARD, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE PRINTED WIRING BOARD  
A printed wiring board is formed by performing cutting in a rectangular region having sides which are oblique to sides of a rectangular sheet material from the rectangular sheet material formed...
US20150101851 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes an insulating...
US20120285732 MULTI-LAYER WIRING BOARD  
It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of...
US20130175073 Thick On-Chip High-Performance Wiring Structures  
Methods for fabricating a back-end-of-line (BEOL) wiring structure, BEOL wiring structures, and design structures for a BEOL wiring structure. The BEOL wiring may be fabricated by forming a first...
US20130105209 INORGANIC FILLER AND ELECTRIC MATERIAL CONTAINING THE SAME  
An inorganic filler containing (1) from 50 to 60 parts by weight of SiO2; (2) from 5 to 20 parts by weight of Al2O3; (3) from 0 to 10 parts by weight of CaO; (4) from 15 to 30 parts by weight of...
US20130319738 MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH THICKNESS COAXIAL STRUCTURES  
A multilayer electronic structure comprising a plurality of dielectric layers extending in an X-Y plane and comprising at least one coaxial pair of stacked posts extending through at least one...
US20140290994 SURFACE-MODIFIED INORGANIC FILLER, METHOD OF PREPARING THE SAME, BUILDUP FILM COMPOSITION FOR MULTILAYER PRINTED WIRING BOARD, AND THE MULTILAYER PRINTED WIRING BOARD INCLUDING THE SAME  
Disclosed herein is a method of preparing a surface-modified inorganic filler, comprising the steps of: drying an inorganic filler; treating the inorganic filler with fluorine-containing gas to...
US20110061910 MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME  
There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green...
US20130014977 Plated Through Hole Void Detection in Printed Circuit Boards by Detecting Material Coupling to Exposed Laminate  
An approach is provided in detecting plated-through hole defects in printed circuit boards (PCBs). The printed circuit board is exposed to a modified-silane solution. The modified-silane solution...
US20120043123 PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD  
[Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. [Solution(s)] To lower...
US20120325533 METHOD OF MANUFACTURING MULTILAYER CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD  
A method of manufacturing a multilayer circuit board includes forming a prepreg on a surface of a first circuit board including a first region in which a plated-through hole is formed and a second...
US20110303446 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME  
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone,...
US20110253434 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME  
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including an amino-triazine-novolac resin and dicyandiamide...
US20110253433 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME  
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and...
US20110061913 METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE  
A method of manufacturing a mounting structure includes: an insulating resin arranging step of forming, on a circuit board, two kinds of insulating resin including first insulating resin cured at...
US20110003179 PROTECTION CIRCUIT BOARD, SECONDARY BATTERY, AND BATTERY PACK  
A protection circuit board, a secondary battery, and a battery pack including a secondary battery. In embodiments of a protection circuit board, as well as a secondary battery and a battery pack...
US20140131081 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein is a printed circuit board, including: a base substrate on which a connection pad is formed; a dam spaced apart from one side of the connection pad; and a protective layer formed...
US20150188024 METHOD OF MANUFACTURING ELECTRIC WIRING LAYER, MEMBER FOR FORMING ELECTRIC WIRING LAYER, ELECTRIC WIRING LAYER, METHOD OF MANUFACTURING ELECTRIC WIRING BOARD, MEMBER FOR FORMING ELECTRIC WIRING BOARD, ELECTRIC WIRING BOARD, VIBRATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT  
A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an...
US20140168909 GAPPED ATTACHMENT STRUCTURES  
Attachment structures for electrically coupling a microelectronic package to a microelectronic board/interposer including joint pads formed on the microelectronic board/interposer which provide a...
US20140174802 LOWDIELECTRIC RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME  
A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight...
US20120152600 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed...
US20110189508 PRINTED CIRCUIT BOARD AND FUEL CELL INCLUDING THE SAME  
Collector portions, connection conductor portions and drawn-out conductor portions are formed on one surface of a base insulting layer of an FPC board. The collector portions, the connection...
US20110284277 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board including an insulation layer, a conductive circuit on the insulation layer, an outermost interlayer resin insulation layer formed on the insulation layer and the conductive...
US20120168212 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface...
US20150053469 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer...
US20140055973 CIRCUIT BOARD FOR PERIPHERAL CIRCUITS OF HIGH-CAPACITY MODULES, AND A HIGH-CAPACITY MODULE INCLUDING A PERIPHERAL CIRCUIT USING THE CIRCUIT BOARD  
[Summary] [Subject] The present invention has an objective to provide a circuit board for a peripheral circuit which can transmit outside heat which generates from a high exothermic element, such...
US20110011633 MULTILAYER CIRCUIT BOARD AND MOTOR DRIVE CIRCUIT BOARD  
A multilayer circuit board in which wirings are arranged so that the inductance thereof is reduced. A ground wiring and a power source wiring which are provided in a multilayer circuit board are...