Match Document Document Title
US20110297428 FLEXIBLE FLAT CABLE  
The present invention provides a flexible flat cable which utilizes a first metal plate disposed on the lower surface of at least one end of a first metal shielding layer to achieve the functions...
US20130077272 Structure Design for 3DIC Testing  
A work piece includes a first copper-containing pillar having a top surface and sidewalls, and a first protection layer on the sidewalls, and not over the top surface, of the first...
US20110128325 BONDABLE PRINTED WIRING WITH IMPROVED WEAR RESISTANCE  
A printed wiring member includes a dielectric substrate; a patterned copper layer formed on the dielectric substrate. The patterned copper layer includes i) contact pads for wire bonding; ii)...
US20150000964 PRINTED CIRCUIT BOARD FOR PREVENTING EDGE-BOARD COMPONENTS FROM BEING SHORT-CIRCUITED  
A printed circuit board (PCB) includes an edge-component welded to the edge, which includes a plurality of pins. The PCB includes a base board and at least one slot set at edges of the base board....
US20150008021 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board includes an interlayer resin insulation layer, multiple pads formed on the interlayer resin insulation layer, and multiple metal posts having bonding material portions and...
US20120325531 PRINTED WIRING BOARD WITH IMPROVED CORROSION RESISTANCE AND YIELD  
A printed wiring board is configured such that copper-laminated plates and prepregs are alternately laminated and surface conductive layers are arranged on the outermost positions outside the...
US20140063822 WIRING BOARD, LIGHT-EMITTING DEVICE, AND METHOD OF MANUFACTURING THE WIRING BOARD  
According to one embodiment, a wiring board includes a base assuming a flat plate shape, a wiring pattern provided in a position on one surface of the base and apart from a peripheral edge of the...
US20110290541 FLEXIBLE FLAT CABLE  
A flexible flat cable includes a first insulating layer, a conductive wire layer, a second insulating layer, a metal layer and at least one grounding element. The conductive wire layer includes a...
US20140326489 SYSTEMS AND METHODS FOR DECREASING STUB RESONANCE OF PLATING FOR CIRCUIT BOARDS  
In accordance with embodiments of the present disclosure, a circuit board may include a stub corresponding to a portion of a trace running proximate to an edge of the circuit board, wherein the...
US20150034372 CIRCUIT BOARD  
A circuit board for preventing pins of inserting components from being short-circuited during the welding process welding is provided. The circuit board includes an insulating base board...
US20150036307 CIRCUIT BOARD  
A circuit board is described. The circuit board comprises a substrate (4), a set of contact pads (6) supported on the substrate and a plurality of discrete adhesive conductive regions disposed on...
US20130118785 PRINTED CIRCUIT BOARD WITH CONNECTING WIRES  
A printed circuit board (PCB) includes a substrate, a pad, a plurality of connecting wires and a plurality of separating portions. The pad arranged on at least one surface of the substrate. The...
US20140131080 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF  
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are...
US20140097231 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF  
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are...
US20140225152 WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME, AND MANUFACTURING METHOD FOR BOTH  
A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically...
US20150237737 SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WIRING BOARD, AND COPPER CLAD LAMINATE  
A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated...
US20110036627 Method for Contacting a Rigid Printed Circuit Board to a Contact Partner and Arrangement of a Rigid Printed Circuit Board and Contact Partner  
A method for producing an electrical connection between a rigid printed circuit board and a metallic contact partner, includes preparing the rigid printed circuit board having at least one copper...
US20120236523 BOARD UNIT AND METHOD OF FABRICATING THE SAME  
A board unit includes a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface a first...
US20120298497 CONDUCTIVE LAMINATE AND TOUCH PANEL USING SAME  
The present invention provides a touch panel that not only demonstrates little deterioration of performance even in harsh environments at high temperature and high humidity, but is also free of...
US20130062107 MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME  
Disclosed is a multilayer wiring board having via-hole conductors for connecting a first copper wiring and a second copper wiring, the via-hole conductor including a metal portion and a resin...
US20060124349 Diamond-coated silicon and electrode  
The present invention intends to provide an industrially applicable diamond electrode and a diamond-coated silicon used in the electrode. A silicon substrate having a thickness of 500 μm or less,...
US20120175157 WIRING BOARD AND METHOD OF PRODUCING THE SAME  
A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an...
US20110088932 WIRING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A wiring circuit board that suppresses the softening phenomenon of circuit interconnect lines with time and that maintains a high tensile strength over an extended period of time, and a method of...
US20130087373 ANISOTROPIC CONDUCTIVE ADHESIVE, METHOD OF PRODUCING THE SAME, CONNECTION STRUCTURE AND PRODUCING METHOD THEREOF  
In an anisotropic conductive adhesive including a magnetic powder such as nickel-coated resin particles used as conductive particles, the conductive particles are present in an insulating adhesive...
US20120285734 ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD  
Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a...
US20130333924 MULTILAYER ELECTRONIC SUPPORT STRUCTURE WITH INTEGRAL METAL CORE  
A laminated multilayer electronic support structure comprising a dielectric with integral vias and feature layers and further comprising a planar metal core characterized by a thickness of less...
US20140318838 METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME  
There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic...
US20120037408 METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME  
There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic...
US20140083753 METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOARD, AND WIRING BOARD  
Provided are a method of forming copper wiring, a method of manufacturing a wiring board, and a wiring board, which are capable of improving conductivity and suppressing deterioration over a...
US20110162875 SELECTIVE COPPER ENCAPSULATION LAYER DEPOSITION  
A metal interconnect structure provides high adhesive strength between copper atoms in a copper-containing structure and a self-aligned copper encapsulation layer, which is selectively deposited...
US20100294561 Metal core wiring board and electric junction box having the same  
An electric junction box including a metal core wiring board having a high heat-releasing property is provided. The electric junction box includes a case and a metal core wiring board received...
US20120305300 METHODS FOR MANUFACTURING AN ELECTRIC CONTACT PAD AND ELECTRIC CONTACT  
A method for manufacturing an electrical contact pad, including a pad mounting and at least one contact layer, and a method for manufacturing an electrical contact, including a contact mounting...
US20120328904 PRINTED CIRCUIT BOARDS AND RELATED ARTICLES INCLUDING ELECTRODEPOSITED COATINGS  
Printed circuit boards and related articles including electrodeposited coatings are described herein.
US20130000960 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a copper pad surface roughness-treated to have a surface roughness of 0.1...
US20140177175 Gold Pad Mini PCB Module  
A printed circuit board (PCB) assembly includes a first printed circuit board that includes first circuit traces formed of copper. A second printed circuit board includes second circuit traces...
US20130175073 Thick On-Chip High-Performance Wiring Structures  
Methods for fabricating a back-end-of-line (BEOL) wiring structure, BEOL wiring structures, and design structures for a BEOL wiring structure. The BEOL wiring may be fabricated by forming a first...
US20140290991 GOLD FINGER AND TOUCH SCREEN  
A gold finger, includes a substrate, an embossable adhesive layer and a plurality of wires. The gold finger is achieved through adhering an embossable adhesive layer to a side of the substrate,...
US20130288475 METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BONDING ON PRINTED CIRCUIT BOARDS AND IC-SUBSTRATES  
The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding...
US20130168144 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
The present invention relates to a method for manufacturing a printed circuit board, which includes: preparing a base substrate with an electrode pad; providing a conductive material having a...
US20130319738 MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH THICKNESS COAXIAL STRUCTURES  
A multilayer electronic structure comprising a plurality of dielectric layers extending in an X-Y plane and comprising at least one coaxial pair of stacked posts extending through at least one...
US20110079419 WIRING BOARD  
The wiring board includes: a base material; a copper pattern which is formed in one surface of the base material, and made of a first metal; and a first nickel land and a second nickel land which...
US20130153274 CIRCUIT BOARD CAPABLE OF PREVENTING CONTACT OF A GOLD FINGER AND SOLDER  
A circuit board includes a substrate whereon a sunken portion is formed. The circuit board further includes a gold finger structure disposed inside the sunken portion. A height difference is...
US20130025917 COPPER COLUMN AND PROCESS FOR PRODUCING SAME  
To prevent the breakage of the joint between a ceramic substrate and a glass epoxy substrate. The copper column is formed by a wiredrawing step for drawing a copper wire formed linearly to a...
US20120037409 METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD OBTAINED THEREBY  
In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste...
US20090129004 Electrically conducting and optically transparent nanowire networks  
A network of nanowires has a plurality of interconnected nanowires. Each interconnected nanowire includes a metal in its composition. The network of nanowires is electrically conducting and...
US20110079418 CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING THEREOF  
A ceramic wiring board comprises a ceramic substrate and a copper layer formed on the ceramic substrate. The average copper grain radius in the copper layer is approximately equal to or larger...
US20130014978 Electrical Barrier Layers  
Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.
US20130014977 Plated Through Hole Void Detection in Printed Circuit Boards by Detecting Material Coupling to Exposed Laminate  
An approach is provided in detecting plated-through hole defects in printed circuit boards (PCBs). The printed circuit board is exposed to a modified-silane solution. The modified-silane solution...
US20120007466 PRINTED-CIRCUIT BOARD AND VIBRATION MOTOR HAVING THE SAME  
The printed-circuit board according to the present invention includes a base member, and a clad metal part that is bonded to one side of the base member, wherein the clad metal part is etched to...
US20130140068 Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics Devices  
A secondary alloyed 1N copper wire for bonding in microelectronics contains one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of...