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US20150034370 |
WHITE COLOR COATING LAYER-FORMED TOUCH SCREEN PANEL AND WHITE COLOR COATING LAYER VACUUM COATING METHOD OF TOUCH SCREEN PANEL
Disclosed is a white costing layer-formed touch screen panel. The coating layer includes a glass substrate, a white coating layers selectively formed on an edge portion of the glass substrate, a... |
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US20130098666 |
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME
There is provided a resin composition for a printed circuit board, including 100 parts by weight of a liquid crystal oligomer shown in a predetermined Formula; and 10 to 40 parts by weight of a... |
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US20110155426 |
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the... |
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US20150129287 |
CABLE BACKPLANE SYSTEM HAVING STIFFENERS
A cable backplane system includes a backplane having board areas surrounding a connector opening with holes in the board areas along the connector opening. Stiffeners are coupled to corresponding... |
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US20140111926 |
PRINTED CIRCUIT BOARD FEATURES OF A PORTABLE COMPUTER
Methods, tools and fixtures for assembling a printed circuit board (PCB), such as a main logic board (MLB), in a portable computer device are described. A connector assembly having an electrically... |
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US20150114693 |
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME
Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the... |
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US20150136453 |
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent... |
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US20150136454 |
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each... |
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US20140102773 |
ADHESIVELESS COPPER CLAD LAMINATES AND PRINTED CIRCUIT BOARD HAVING ADHESIVELESS COPPER CLAD LAMINATES AS BASE MATERIAL
Adhesiveless copper clad laminates obtained by metallizing excellent in wiring microfabrication ability in processing by semi-additive method, and a printed circuit board using the adhesiveless... |
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US20140138128 |
Low Loss Pre-Pregs and Laminates and Compositions Useful for the Preparation Thereof
In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and... |
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US20100314160 |
LOW LOSS PRE-PREGS AND LAMINATES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF
In accordance with the present invention compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and... |
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US20150083471 |
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening... |
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US20140133111 |
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD
A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the... |
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US20140284086 |
VIBRATION-PROOF MATERIAL, VIBRATION-PROOF STRUCTURE, AND VIBRATION-PROOF METHOD
A vibration-proof material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. The content ratio of a sulfur atom calculated based on the measurement result... |
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US20130269990 |
CONTACT MAKING ARRANGEMENT FOR CONDUCTORS PROVIDED ON FLAT STRUCTURES, NAMELY PANES OF GLASS
The invention relates to a contacting arrangement for conductors provided on flat structures, namely glass panes, the conductors having a contact point in their connecting section, wherein one end... |
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US20120261170 |
ELECTRONIC DEVICE HAVING BACKBOARD ASSEMBLY
An electronic device includes a printed circuit board, an electronic element, and a backboard assembly. The printed circuit board defines a plurality of first through holes. The electronic element... |
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US20150114694 |
ASSEMBLY OF A CIRCUIT BOARD AND A FLEXIBLE FLAT CABLE, CIRCUIT BOARD, AND ASSEMBLING METHOD FOR A FLEXIBLE FLAT CABLE
An assembly includes a circuit board and a flexible flat cable. The circuit board includes a board body having top, bottom and side faces, and a connection module. The board body is formed with a... |
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US20140251662 |
OPTICALLY CLEAR CONDUCTIVE ADHESIVE AND ARTICLES THEREFROM
The present invention provides an electrically conductive, optically clear adhesive including an optically clear adhesive layer and an interconnected, electrically conductive network layer... |
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US20100012357 |
Printed Circuit Board With Improved Via Design
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive... |
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US20120285732 |
MULTI-LAYER WIRING BOARD
It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of... |
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US20140063794 |
CURVED PRINTED CIRCUIT BOARDS, LIGHT MODULES, AND METHODS FOR CURVING A PRINTED CIRCUIT BOARD
Curved printed circuit boards, light modules, and methods for curving a printed circuit board are disclosed. An example light module includes a curved printed circuit board having electrical... |
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US20140311777 |
BENT PRINTED CIRCUIT BOARD FOR BACKLIGHT UNIT
Provided is a bent printed circuit board for a backlight unit, including: a metal plate including a first part, a second part extending from the first part, and a bending part formed between the... |
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US20130192882 |
WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME
A wiring board of the present invention includes a substrate including a woven fabric formed of a plurality of glass fibers and a resin covering the woven fabric; a plurality of through holes T... |
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US20140284087 |
CIRCUIT BOARD MADE OF AIN WITH COPPER STRUCTURES
Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and... |
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US20150101848 |
SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDING THE SAME, PRINTED CURCUIT BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the... |
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US20140151090 |
STRESS RELIEF STRUCTURE
A stress relief structure is provided. The stress relief structure includes a stress relief body, at least one first stress relief base and at least one second stress relief base. The stress... |
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US20130126218 |
PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5... |
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US20140353518 |
INSULATION STRUCTURE AND INSULATION METHOD
An insulation structure provided among a plurality of electrodes for extraction of an ion beam from a plasma generating section is provided. The insulation structure includes an insulation member... |
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US20140003055 |
TOUCH WINDOW AND MANUFACTURING METHOD THEREOF
Disclosed are a touch window and a manufacturing method thereof. The touch window includes conductive polymer. In the touch window, a light source and/or a connector are provided in a touch screen... |
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US20140131073 |
MULTI-LAYER WIRING BOARD
A multi-layer wiring board includes a resin base, a wiring pattern, an adhesive layer, and a via. The wiring pattern includes a land provided on the resin base. The adhesive layer is stacked on... |
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US20110303441 |
BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE
Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in... |
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US20140151095 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the... |
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US20120012371 |
MANUFACTURING METHOD FOR CIRCUIT BOARD, AND CIRCUIT BOARD
A method of manufacturing circuit boards includes the steps of forming an upper board having an opening, and provided with a circuit and an insulating film layer formed on a surface thereof,... |
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US20150146375 |
POWER CONVERSION DEVICE AND POWER CONVERSION ASSEMBLY
A power conversion device is provided. The power conversion device includes a printed wiring board assembly, a grounding member, and a plurality of insulating struts. The printed wiring board... |
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US20120097431 |
LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal... |
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US20150060115 |
COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first... |
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US20150077963 |
PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH METAL POST
A printed wiring board includes a wiring board, and multiple posts formed on the wiring board and positioned to mount a second printed wiring board onto the wiring board. Each of the metal posts... |
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US20140311776 |
PLATING APPARATUS, PLATING METHOD, METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
A voltage is applied between a stainless steel plate and an electrode such that the stainless steel plate is an anode, whereby a passive film formed at a portion to be plated of the stainless... |
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US20150136452 |
HIGH-WITHSTANDING-VOLTAGE ALUMINA SINTERED COMPACT AND HIGH-WITHSTANDING-VOLTAGE MEMBER
The high-withstanding-voltage member includes an alumina sintered compact containing alumina as a main crystal. Furthermore, the alumina sintered compact exhibits a peak intensity of 5000 or less... |
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US20140034367 |
EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD
Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal... |
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US20110139494 |
EMBEDDED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
A method for manufacturing an embedded wiring board is provided. An activating insulation layer is formed, in which the activating insulation layer includes a plurality of catalyst particles, and... |
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US20110139495 |
CIRCUIT BOARD INCLUDING MASK FOR CONTROLLING FLOW OF SOLDER
A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board. |
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US20130215628 |
PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD AND LED MODULE
A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a... |
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US20120211266 |
WIRING BOARD AND MANUFACTURING METHOD THEREOF
The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention... |
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US20140367149 |
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, BUILD-UP FILM, PREPREG AND PRINTED CIRCUIT BOARD
Disclosed herein are an insulating resin composition for a printed circuit board, a build-up film, a prepreg, and a printed circuit board. More specifically, disclosed herein are a build-up film... |
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US20120199967 |
Interconnection Structure
An electrical interconnect for connecting an IC chip to a PCB, the electrical interconnect comprising a plurality of connection elements for connection to the PCB attached to a first surface of... |
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US20130075137 |
METHOD TO MAKE A MULTILAYER CIRCUIT BOARD WITH INTERMETALLIC COMPOUND AND RELATED CIRCUIT BOARDS
A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a... |
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US20130176732 |
HOLDER AND LED MODULE USING SAME
A holder is provided that include a base with an aperture. An LED array with an LED emitter can be positioned so that the LED emitter is in the aperture. The holder includes pads that can be... |
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US20090095512 |
METHOD FOR PRODUCING A GLASS PLATE WITH A CONDUCTIVE PRINTED WIRE AND GLASS PLATE WITH A CONDUCTIVE PRINTED WIRE
Provided is a process for producing a glass plate with a conductive printed wire, which does not require a screen plate for each model, facilitates adjustments for desired heat generation... |
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US20140311775 |
CIRCUIT BOARD STRUCTURE
A circuit board structure includes a circuit board and at least one adsorption strip set on the circuit board. The circuit board defines at least one group of pin holes arranged along a... |