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US20130168137 Method of Fabricating PCB Board and PCB Board  
A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer....
US20120307501 LED PLASTIC HEAT SINK AND METHOD FOR MAKING AND USING THE SAME  
In an embodiment, heat sink system can comprise: an integrally formed plastic heat sink and a printed circuit board package, wherein the plastic heat sink comprises a thermally conductive plastic...
US20140060894 CLIP ASSEMBLY AND HEAT DISSIPATION DEVICE INCORPORATING THE SAME  
An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes two wire clips and two fasteners engaging with the wire clips,...
US20150000961 PWB COOLING SYSTEM WITH HEAT DISSIPATION THROUGH POSTS  
An apparatus includes a printed wiring board, a post that supports the printed wiring board, and a heat pipe on the printed wiring board with a first end positioned near an electronic component...
US20140326486 PRINTED CIRCUIT BOARD  
A printed circuit board (PCB) comprising a base board, the base board defines a thermal pad and a plurality of pin pads for solder an integrated circuit (IC) with a Quad Flat No-lead (QFN)...
US20130146352 MULTILAYER PRINTED CIRCUIT BOARD AND DEVICE COMPRISING THE SAME  
A multilayer printed circuit board may comprise at least one printed circuit board front end that is thermally conductively metalized. An apparatus with such a printed circuit board is also proposed.
US20120073864 DIRECT MECHANICAL/ELECTRICAL PRINTED CIRCUIT BOARD INTERFACE  
A printed circuit board is disclosed. The board has a first end having a plurality of fingers in a cooperating relationship with a second end of a second adjacent circuit board. The board has a...
US20140060895 CLIP ASSEMBLY AND HEAT DISSIPATION DEVICE INCORPORATING THE SAME  
An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes a wire clip and two fasteners engaging with the wire clip. The wire...
US20150114692 LOCKING OF AN ELECTRONIC BOARD  
An electronic board comprises a plane printed circuit, a thermal drain and an expandable locking means positioned along one edge of the printed circuit comprising a part for transmission of...
US20120199381 PRINTED CIRCUIT BOARD  
The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board,...
US20130170136 PCB HEAT SINK FOR POWER ELECTRONICS  
A PCB with improved cooling. Openings are provided below electronic components on the PCB of an electronics device. Raised mounts or bosses on the device housing or base extend into the openings...
US20130010429 METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND POWER MODULE  
A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step...
US20110284271 HEAT SINK  
A heat sink capable of being surface-mounted, the heat sink having a 3D shape and comprising a body made of metal, having a rear side which is horizontal and a front side which is at least...
US20130314920 Direct Heat Sink Technology for LEDs and Driving Circuits  
Thermally radiating heat sinks are soldered directly beneath individual LEDs and other heat generating electronic components on the opposite side of an FR4 circuit board and thermally coupled to...
US20140048313 THERMALLY ENHANCED WIRING BOARD WITH THERMAL PAD AND ELECTRICAL POST  
A thermally enhanced wiring board with thermal pad and electrical post includes a metal slug, a metal pillar, a patterned interconnect substrate, an adhesive, a build-up circuitry and optionally a...
US20130220675 METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD  
Printed circuit boards have circuit layers with one or more copper filled through-holes and methods of manufacturing the same. An aspect of an embodiment of the present invention enhances thermal...
US20140216789 SUBSTRATE STRUCTURE  
A substrate structure includes a heat dissipating plate and a wiring board. The heat dissipating plate includes at least two inward gaps which are symmetrical to each other and disposed at corners...
US20150146375 POWER CONVERSION DEVICE AND POWER CONVERSION ASSEMBLY  
A power conversion device is provided. The power conversion device includes a printed wiring board assembly, a grounding member, and a plurality of insulating struts. The printed wiring board...
US20080128158 Wire-Printed Circuit Board or Card Comprising Conductors with a Rectangular or Square Cross Section  
The invention relates to a wire-printed circuit board or card comprising conductors that run on and/or in the circuit board or card between connection points. In order to improve circuit boards of...
US20120097431 LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES  
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal...
US20130118782 RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate...
US20150146379 Circuit Board With Ceramic Inlays  
A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board...
US20120138341 HOLE IN PAD THERMAL MANAGEMENT  
A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless...
US20140060897 CHIP RESISTOR WITH OUTRIGGER HEAT SINK  
A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor...
US20130299213 ELECTRONIC DEVICE WITH HEAT DISSIPATION DEVICE ASSEMBLY  
A heat dissipation device assembly for dissipating heat from an electronic component located on a printed circuit board (PCB), includes a heat dissipation module and a fixing device for fixing the...
US20110156083 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof  
A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the...
US20150139662 Heat Dissipation with an On-Board Connector  
Electronic or opto-electronic on-board connector and method to dissipate heat from such a connector. The connector is positioned within the scope of a cooling air flow. The component includes a...
US20110284272 PRINTED CIRCUIT BOARD PROVIDING HEAT DISSIPATION  
A printed circuit board includes an insulated base sheet, a heat-conducting layer, an insulated layer, a plurality of heat-conducting blocks, and a plurality of bonding pads. The heat-conducting...
US20140251658 THERMALLY ENHANCED WIRING BOARD WITH BUILT-IN HEAT SINK AND BUILD-UP CIRCUITRY  
A thermally enhanced wiring board includes a heat sink, a stiffener and a build-up circuitry. The heat sink extends into an aperture of the stiffener and is thermally connected to the build-up...
US20120114978 Energy Storage Module  
This invention comprise an energy storage module consisting of surface mounted solid state energy cells attached to a rigid circuit board with tabbed ends that act as positive and negative...
US20130250576 WIRING BOARD DEVICE, LUMINAIRE AND MANUFACTURING METHOD OF THE WIRING BOARD DEVICE  
According to one embodiment, a wiring board device includes a ceramic board including a first surface and a second surface. A first electrode layer is formed on the first surface of the ceramic...
US20130215121 HEAT SPREADING SUBSTRATE  
Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically...
US20130277093 SUBSTRATE STRUCTURE  
A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board...
US20140190727 METHOD OF FABRICATING FLEXIBLE METAL CORE PRINTED CIRCUIT BOARD  
A flexible metal core printed circuit board assembly comprises a flexible printed circuit board structure. The flexible printed circuit board structure includes a flexible substrate, a conductive...
US20130206459 RADIANT HEAT CIRCUIT BOARD, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT UNIT  
Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to...
US20130118781 ELECTRONIC DEVICE HAVING HEAT DISSIPATION DEVICE  
An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting...
US20140020933 THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARDS  
A printed circuit board that includes a dielectric polymer layer having a thermally conductive agglomerate filler and an electrically conductive layer bonded to the dielectric polymer layer is...
US20110005810 INSULATING SUBSTRATE AND METHOD FOR PRODUCING THE SAME  
An insulating substrate 1 includes an electrically insulative layer 2, a wiring layer 3 formed on one side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an...
US20110001418 HIGH HEAT DISSIPATION ELECTRIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
The present invention relates to a high heat dissipation electric circuit board, comprises: an electric conductive wiring layer serving to be installed with at least one electronic unit, on which...
US20140321061 SLIDING THERMAL CONTACT FOR PLUGGABLE OPTIC MODULES  
Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat...
US20140290986 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME  
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the...
US20080179078 REMOTE DIODES IN A CORDLESS TOOL  
A diode assembly for a wire harness includes a printed circuit board (PCB), a diode connected to the PCB, and a plurality of diode lead wires extending from the PCB for external connections. The...
US20130264102 SYSTEM PROVIDED WITH A SOLDER JOINT  
A system provided with a solder joint includes: a circuit board (101) provided with an aperture (102), an electrical component (103) including a conductor foot (104) protruding through the...
US20140264417 WIRING BOARD AND LIGHT EMITTING DEVICE  
There is provided a wiring board for mounting a light emitting element thereon. The wiring board includes: an insulating layer; a wiring pattern on the insulating layer; a reflecting layer on the...
US20120224328 INNER-LAYER HEAT-DISSIPATING BOARD, MULTI-CHIP STACK PACKAGE STRUCTURE HAVING THE INNER LAYER HEAT-DISSIPATING BOARD AND FABRICATION METHOD THEREOF  
An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal...
US20140174795 PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD  
A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The...
US20130087366 POWER MANAGEMENT APPLICATIONS OF INTERCONNECT SUBSTRATES  
Various applications of interconnect substrates in power management systems are described.
US20130220676 ELECTRONIC CIRCUIT AND HEAT SINK  
An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink...
US20140262449 Apparatus and Method for a Back Plate for Heat Sink Mounting  
Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first...
US20100103625 PRINTED CIRCUIT BOARD AND HEAT SINK  
A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin...
Matches 1 - 50 out of 361 1 2 3 4 5 6 7 8 >