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US20050062492 |
High density integrated circuit apparatus, test probe and methods of use thereof
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The... |
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US20050013106 |
Peripheral card with hidden test pins
A peripheral card includes a circuit board, various circuit elements on the circuit board, a set of user terminals, a set of test terminals, and an enclosure that covers a portion of the circuit... |
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US20100218978 |
METHOD OF MAKING AN ELECTRICAL CIRCUIT
A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an... |
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US20080079140 |
ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON
This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or... |
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US20110074380 |
ELECTRIC CONDUCTION PAD AND MANUFACTURING METHOD THEREOF
The present invention relates to electric conduction pads and a method for manufacturing the same, and more particularly, to an electric conduction pad having elastic properties while enabling... |
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US20080264684 |
Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same
Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide... |
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US20110255250 |
PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES
Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed... |
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US20100139952 |
FLUX FORMULATIONS
Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable... |
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US20080296057 |
Simultaneous and selective partitioning of via structures using plating resist
Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via... |
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US20130168133 |
PROCESS FOR PRODUCING A CIRCUIT CARRIER
A process for producing a circuit carrier, including providing a moulded part containing a thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring additive... |
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US20100247381 |
PROCESSES AND APPLICATIONS OF CARBON NANOTUBE DISPERSIONS
Disclosed are copolymers of carbon nanotubes, as well as processes and applications of carbon nanotube dispersions. Carbon nanotube emulsions and related technology are also disclosed. The... |
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US20090110884 |
Surface Coating
A composite is provided, comprising a substrate and a film on the substrate. The film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than... |
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US20090056991 |
Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom
The present invention generally relates to methods of treating a surface of a substrate, and to the use of the method and resulting films, coatings and devices formed therefrom in various... |
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US20140048131 |
CONDUCTIVE MEMBER, PRODUCTION METHOD OF THE SAME, TOUCH PANEL, AND SOLAR CELL
A conductive member containing a base material and a conductive layer provided on the base material, wherein the conductive layer includes (i) a metallic nanowire having an average short-axis... |
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US20140027163 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core reinforcement having stiffness; insulating layers formed on both... |
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US20120031656 |
SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME
Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic... |
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US20110100688 |
Electro-Optical Device and Method of Manufacturing the Same
In a liquid crystal display device, gate lines and common lines are first concurrently formed, and after an interlayer film is formed, a pixel electrode, common electrodes, and source lines are... |
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US20140151098 |
CONDUCTIVE SUBSTRATE COMPRISING CONDUCTIVE PATTERN AND TOUCH PANEL COMPRISING SAME
The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate... |
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US20130319729 |
Low Haze Transparent Conductive Electrodes and Method of Making the Same
A transparent conductive electrode comprising metal nanowires and method of making is described, wherein the transparent conductive electrode has a pencil hardness more than 1 H, nanoporous... |
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US20130206820 |
SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY
An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls... |
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US20100038121 |
Metal Deposition
Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive... |
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US20090250253 |
Printed circuit board and manufacturing method thereof
Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes:... |
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US20130294003 |
SUBSTRATE FOR DISPLAY AND LIQUID CRYSTAL DISPLAY UTILIZING THE SAME
The invention provides a substrate for a display which can be easily repaired even when there are problems such as inter-layer shorting attributable to invasion of static electricity. The... |
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US20120285732 |
MULTI-LAYER WIRING BOARD
It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of... |
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US20120241199 |
CONDUCTIVE SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND TOUCH PANEL
One embodiment of the present invention is a conductive substrate including: a conductive layer, and a transparent conductive layer on at least one surface of a transparent substrate in this order... |
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US20150092359 |
TOUCH WINDOW AND TOUCH DEVICE WITH THE SAME
Disclosed are a touch window with an improved visibility and a touch device with the same. The touch window includes a substrate; a first sensing electrode aligned on the substrate as a first... |
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US20120073865 |
CARRIER MEMBER FOR TRANSMITTING CIRCUITS, CORELESS PRINTED CIRCUIT BOARD USING THE CARRIER MEMBER, AND METHOD OF MANUFACTURING THE SAME
A carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and... |
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US20060201701 |
Circuit security
A secure device (1) has a circuit board (2) with various exposed components such as an LCD (4) and keys (40). A secure circuit (10) is housed within an enclosure formed between the board (2) and a... |
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US20140063375 |
CONDUCTIVE SHEET AND TOUCH PANEL
This conductive sheet and touch panel have a plurality of first conductive patterns arrayed in the x-direction. The first conductive patterns have: a band-shaped section extending in the... |
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US20090114425 |
CONDUCTIVE PASTE AND PRINTED CIRCUIT BOARD USING THE SAME
A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can... |
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US20080017409 |
Multilayer board
A multilayer board includes a base member made of an insulation material. A plurality of conductor patterns is disposed in the base member in a multi-layered manner. A plurality of interlayer... |
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US20140232959 |
CONDUCTIVE FILM AND TOUCH PANEL
A first conductive unit of a first conductive film has two or more first conductive patterns made from fine metal wires and including multiple first pads connected through a first connection part.... |
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US20140116754 |
CONDUCTIVE STRUCTURE OF TRANSPARENT CONDUCTIVE FILM, TRANSPARENT CONDUCTIVE FILM AND PREPARATION METHOD THEREOF
The present invention discloses a conductive structure of a transparent conductive film, the transparent conductive film and a preparation method thereof, wherein the transparent conductive film... |
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US20130255998 |
METHOD OF MANUFACTURING CONDUCTIVE SHEET, CONDUCTIVE SHEET, AND RECORDING MEDIUM
The method of manufacturing a conductive sheet of the present invention is provided with: a creation step for creating image data that indicates a meshed pattern; and an outputting step for... |
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US20120292082 |
ANISOTROPIC CONDUCTIVE FILM
In an anisotropic conductive film formed by laminating an insulating adhesive layer containing a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator and a... |
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US20090194319 |
PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD
Provided is a photocurable resin composition developable with a rare alkali solution, including a carboxylic acid-containing resin (A), a coloring agent (B) composed of a compound having an... |
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US20070158105 |
MULTILAYER WIRING BOARD CAPABLE OF REDUCING NOISE OVER WIDE FREQUENCY BAND WITH SIMPLE STRUCTURE
A multilayer wiring board 10 has a high-capacitance layer 121 formed between a ground layer 141 and a power supply layer 15 and a high-capacitance layer 122 formed between the power supply layer... |
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US20070074902 |
Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor
The present invention provides a printed-wiring board which can make the electric wiring densified and can be thinned, even when having a BVH of a non-penetration hole filled with a selectively... |
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US20060191707 |
Circuit board and method for producing the same
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating... |
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US20060005994 |
Wiring board, method of manufacturing wiring board, and electronic device
A method of manufacturing a wiring board includes steps of: providing a substrate; forming a first wiring layer on the substrate by photolithography; forming a first insulating layer by ink... |
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US20050133249 |
Printed wiring board and semiconductor device
A printed wiring board has a large number of wirings formed substantially parallel to one another, a dummy pattern is formed along the wirings and a solder resist layer is formed by coating the... |
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US20140054070 |
ELECTROCONDUCTIVE SHEET AND TOUCH PANEL
An electroconductive sheet and a touch panel, wherein the electroconductive sheet has a first electroconductive section and a second electroconductive section; the first electroconductive section... |
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US20130213695 |
METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME
The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the... |
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US20090141505 |
WHITE HEAT-HARDENING RESIN COMPOSITION, HARDENED MATERIAL, PRINTED-WIRING BOARD AND REFLECTION BOARD FOR LIGHT EMITTING DEVICE
A white heat-hardening resin composition includes rutile-type titanium oxide and a heat-hardening resin. |
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US20080100763 |
CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME
A circuit board outputs a plurality of signals through first to n-th connection portions. Each of the connection portions includes a ground pad, signal output pads outputting the signals, and... |
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US20140097002 |
ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS
A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating... |
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US20140021851 |
SUBSTRATE FOR LED MODULE AND METHOD FOR MANUFACTURING THE SAME
As a substrate for an LED module and a method for manufacturing the same, they teach a substrate for an LED module and a method for manufacturing the same which including a base substrate, an... |
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US20130081858 |
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD
[Problems] The present invention relates to a photosensitive resin composition in which a cured film obtained therefrom has good resistance to electroless gold plating and occurrence of whitening... |
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US20120073866 |
Touch screen panel and fabricating method therof
A touch screen panel includes a film substrate defined by a touch active area and a non-touch active area and the touch area is arranged outside the touch active area. The touch screen panel... |
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US20110122591 |
HYBRID FABRIC MATERIALS, AND STRUCTURAL COMPONENTS INCORPORATING SAME
Composite structural components are disclosed that include electrically conducting fibres providing signal power paths to electrical components disposed on or adjacent the material. The signal... |