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US20050062492 High density integrated circuit apparatus, test probe and methods of use thereof  
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The...
US20050013106 Peripheral card with hidden test pins  
A peripheral card includes a circuit board, various circuit elements on the circuit board, a set of user terminals, a set of test terminals, and an enclosure that covers a portion of the circuit...
US20100218978 METHOD OF MAKING AN ELECTRICAL CIRCUIT  
A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an...
US20080079140 ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON  
This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or...
US20110074380 ELECTRIC CONDUCTION PAD AND MANUFACTURING METHOD THEREOF  
The present invention relates to electric conduction pads and a method for manufacturing the same, and more particularly, to an electric conduction pad having elastic properties while enabling...
US20080264684 Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same  
Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide...
US20110255250 PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES  
Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed...
US20100139952 FLUX FORMULATIONS  
Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable...
US20080296057 Simultaneous and selective partitioning of via structures using plating resist  
Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via...
US20130168133 PROCESS FOR PRODUCING A CIRCUIT CARRIER  
A process for producing a circuit carrier, including providing a moulded part containing a thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring additive...
US20100247381 PROCESSES AND APPLICATIONS OF CARBON NANOTUBE DISPERSIONS  
Disclosed are copolymers of carbon nanotubes, as well as processes and applications of carbon nanotube dispersions. Carbon nanotube emulsions and related technology are also disclosed. The...
US20090110884 Surface Coating  
A composite is provided, comprising a substrate and a film on the substrate. The film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than...
US20090056991 Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom  
The present invention generally relates to methods of treating a surface of a substrate, and to the use of the method and resulting films, coatings and devices formed therefrom in various...
US20140048131 CONDUCTIVE MEMBER, PRODUCTION METHOD OF THE SAME, TOUCH PANEL, AND SOLAR CELL  
A conductive member containing a base material and a conductive layer provided on the base material, wherein the conductive layer includes (i) a metallic nanowire having an average short-axis...
US20140027163 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core reinforcement having stiffness; insulating layers formed on both...
US20120031656 SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME  
Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic...
US20110100688 Electro-Optical Device and Method of Manufacturing the Same  
In a liquid crystal display device, gate lines and common lines are first concurrently formed, and after an interlayer film is formed, a pixel electrode, common electrodes, and source lines are...
US20140151098 CONDUCTIVE SUBSTRATE COMPRISING CONDUCTIVE PATTERN AND TOUCH PANEL COMPRISING SAME  
The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate...
US20130319729 Low Haze Transparent Conductive Electrodes and Method of Making the Same  
A transparent conductive electrode comprising metal nanowires and method of making is described, wherein the transparent conductive electrode has a pencil hardness more than 1 H, nanoporous...
US20130206820 SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY  
An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls...
US20100038121 Metal Deposition  
Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive...
US20090250253 Printed circuit board and manufacturing method thereof  
Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes:...
US20130294003 SUBSTRATE FOR DISPLAY AND LIQUID CRYSTAL DISPLAY UTILIZING THE SAME  
The invention provides a substrate for a display which can be easily repaired even when there are problems such as inter-layer shorting attributable to invasion of static electricity. The...
US20120285732 MULTI-LAYER WIRING BOARD  
It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of...
US20120241199 CONDUCTIVE SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND TOUCH PANEL  
One embodiment of the present invention is a conductive substrate including: a conductive layer, and a transparent conductive layer on at least one surface of a transparent substrate in this order...
US20150092359 TOUCH WINDOW AND TOUCH DEVICE WITH THE SAME  
Disclosed are a touch window with an improved visibility and a touch device with the same. The touch window includes a substrate; a first sensing electrode aligned on the substrate as a first...
US20120073865 CARRIER MEMBER FOR TRANSMITTING CIRCUITS, CORELESS PRINTED CIRCUIT BOARD USING THE CARRIER MEMBER, AND METHOD OF MANUFACTURING THE SAME  
A carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and...
US20060201701 Circuit security  
A secure device (1) has a circuit board (2) with various exposed components such as an LCD (4) and keys (40). A secure circuit (10) is housed within an enclosure formed between the board (2) and a...
US20140063375 CONDUCTIVE SHEET AND TOUCH PANEL  
This conductive sheet and touch panel have a plurality of first conductive patterns arrayed in the x-direction. The first conductive patterns have: a band-shaped section extending in the...
US20090114425 CONDUCTIVE PASTE AND PRINTED CIRCUIT BOARD USING THE SAME  
A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can...
US20080017409 Multilayer board  
A multilayer board includes a base member made of an insulation material. A plurality of conductor patterns is disposed in the base member in a multi-layered manner. A plurality of interlayer...
US20140232959 CONDUCTIVE FILM AND TOUCH PANEL  
A first conductive unit of a first conductive film has two or more first conductive patterns made from fine metal wires and including multiple first pads connected through a first connection part....
US20140116754 CONDUCTIVE STRUCTURE OF TRANSPARENT CONDUCTIVE FILM, TRANSPARENT CONDUCTIVE FILM AND PREPARATION METHOD THEREOF  
The present invention discloses a conductive structure of a transparent conductive film, the transparent conductive film and a preparation method thereof, wherein the transparent conductive film...
US20130255998 METHOD OF MANUFACTURING CONDUCTIVE SHEET, CONDUCTIVE SHEET, AND RECORDING MEDIUM  
The method of manufacturing a conductive sheet of the present invention is provided with: a creation step for creating image data that indicates a meshed pattern; and an outputting step for...
US20120292082 ANISOTROPIC CONDUCTIVE FILM  
In an anisotropic conductive film formed by laminating an insulating adhesive layer containing a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator and a...
US20090194319 PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD  
Provided is a photocurable resin composition developable with a rare alkali solution, including a carboxylic acid-containing resin (A), a coloring agent (B) composed of a compound having an...
US20070158105 MULTILAYER WIRING BOARD CAPABLE OF REDUCING NOISE OVER WIDE FREQUENCY BAND WITH SIMPLE STRUCTURE  
A multilayer wiring board 10 has a high-capacitance layer 121 formed between a ground layer 141 and a power supply layer 15 and a high-capacitance layer 122 formed between the power supply layer...
US20070074902 Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor  
The present invention provides a printed-wiring board which can make the electric wiring densified and can be thinned, even when having a BVH of a non-penetration hole filled with a selectively...
US20060191707 Circuit board and method for producing the same  
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating...
US20060005994 Wiring board, method of manufacturing wiring board, and electronic device  
A method of manufacturing a wiring board includes steps of: providing a substrate; forming a first wiring layer on the substrate by photolithography; forming a first insulating layer by ink...
US20050133249 Printed wiring board and semiconductor device  
A printed wiring board has a large number of wirings formed substantially parallel to one another, a dummy pattern is formed along the wirings and a solder resist layer is formed by coating the...
US20140054070 ELECTROCONDUCTIVE SHEET AND TOUCH PANEL  
An electroconductive sheet and a touch panel, wherein the electroconductive sheet has a first electroconductive section and a second electroconductive section; the first electroconductive section...
US20130213695 METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME  
The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the...
US20090141505 WHITE HEAT-HARDENING RESIN COMPOSITION, HARDENED MATERIAL, PRINTED-WIRING BOARD AND REFLECTION BOARD FOR LIGHT EMITTING DEVICE  
A white heat-hardening resin composition includes rutile-type titanium oxide and a heat-hardening resin.
US20080100763 CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME  
A circuit board outputs a plurality of signals through first to n-th connection portions. Each of the connection portions includes a ground pad, signal output pads outputting the signals, and...
US20140097002 ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS  
A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating...
US20140021851 SUBSTRATE FOR LED MODULE AND METHOD FOR MANUFACTURING THE SAME  
As a substrate for an LED module and a method for manufacturing the same, they teach a substrate for an LED module and a method for manufacturing the same which including a base substrate, an...
US20130081858 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD  
[Problems] The present invention relates to a photosensitive resin composition in which a cured film obtained therefrom has good resistance to electroless gold plating and occurrence of whitening...
US20120073866 Touch screen panel and fabricating method therof  
A touch screen panel includes a film substrate defined by a touch active area and a non-touch active area and the touch area is arranged outside the touch active area. The touch screen panel...
US20110122591 HYBRID FABRIC MATERIALS, AND STRUCTURAL COMPONENTS INCORPORATING SAME  
Composite structural components are disclosed that include electrically conducting fibres providing signal power paths to electrical components disposed on or adjacent the material. The signal...