Matches 1 - 50 out of 177 1 2 3 4 >


Match Document Document Title
US20150013940 COMMONLY SUBMERSED, VERTICALLY REMOVABLE SERVERS IN RACK  
Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a...
US20120313657 TEMPERATURE CONTROL UNIT FOR ELECTRONIC COMPONENT AND HANDLER APPARATUS  
A temperature control unit for an electronic component and a handler apparatus, which are excellent in responsibility during cooling and heating, is obtained. The temperature control unit for an...
US20070159797 Heat exchange apparatus  
In one embodiment, heat exchange device is provided, which includes a printed circuit board with a multichip module mounted on the printed circuit board. A cold plate is positioned on the...
US20080158817 ELECTRONIC APPARATUS  
An electronic apparatus 100 includes a heat-generating element 1, a heat-radiating plate 4 which is used in heat radiation of the heat-generating element, and a housing 10 which accommodates the...
US20090139693 TWO PHASE MICRO-CHANNEL HEAT SINK  
A method and system for providing a heat sink are described. The heat sink includes at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect...
US20070158050 Microchannel heat sink manufactured from graphite materials  
A microchannel heat sink is manufactured from graphite materials. A heat sink member has at least a first thermal contact surface for making thermal contact with an electronic device. The heat...
US20060225867 Heat sink apparatus for electronic device  
A heat sink apparatus is provided for an electronic device. The heat sink apparatus includes a body in which an inlet and an outlet are formed. A heat absorbing fluid flows through a plurality of...
US20060067052 Liquid cooling system  
In some embodiments, a multi-processor system board has at least a first processor installed on the system board and at least a first liquid cooling system configured to provide dedicated cooling...
US20050199372 Cold plate and method of making the same  
A cold plate having a base member and a cover member connected thereto by friction stir welding and one or more fins or flow channels machined into the base and/or the cover member. The invention...
US20070227697 Heat radiator  
A heat radiator 10 includes: a first member 12 which has a recessed portion 12c in one side thereof and which has a large number of substantially circular truncated conical protruding portions 12d...
US20060096738 Liquid cold plate heat exchanger  
A heat exchanger includes a cooling plate having a heat collection surface for fixing against an object to be cooled, an opposed heat transfer surface which may be provided with fins, and a...
US20070017659 Heat spreader  
A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate...
US20050178529 Cooling system or electronic apparatus, and electronic apparatus using the same  
An electronic apparatus, such as, personal computers of so-called a desktop type and a notebook type, as well as, a server, etc., having a cooling system being high in cooling efficiency, wherein...
US20060162901 Blower, cooling device including the blower, and electronic apparatus including the cooling device  
The invention provides a cooling device including a heat-receiver integrated pump that has a heat-receiving part provided on one side thereof and delivers toward a connecting pipe liquid...
US20060157225 High turbulence heat exchanger  
The present invention is a method and apparatus for cooling a heat source. In one embodiment a heat exchanger is provided and includes a channel for receiving a coolant, the channel having a first...
US20060011326 Heat-exchanger device and cooling system  
A heat-exchanging device. The device comprises a block made from a heat-conducting material with a plurality of cooling tubes provided in it. Each of the cooling tubes has an inlet for receiving...
US20050211418 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device  
A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid...
US20070215325 DOUBLE SIDED HEAT SINK WITH MICROCHANNEL COOLING  
An apparatus for cooling at least two heated surfaces includes a base plate defining multiple upper and lower supply manifolds and upper and lower exhaust manifolds. The upper and lower supply...
US20060272802 Cooling plate  
A cooling plate comprises a passage 6 for flowing a coolant by closing a groove 5 formed on a main body 2 with a lid 3. The lid 3 has a width greater than that of the groove 5 and has a convex...
US20050241803 Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation  
A liquid loop cooling apparatus includes rigid or semi-rigid tubing enclosing an interior bore or lumen within which a cooling fluid can circulate among at least one heat-generating component in a...
US20080060792 HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING  
A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal...
US20060254752 Radiator and heatsink apparatus having the radiator  
A radiator includes: an inlet header having a hollow shape and being provided with an inlet for the coolant to enter; a plurality of flat tubes connecting to the inlet header on one end; and an...
US20050183844 Hotspot spray cooling  
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the...
US20060243422 Liquid-cooled semiconductor unit for cooling high-power semiconductor elements that are enclosed in modules  
In a liquid-cooled semiconductor unit having one or more semiconductor modules and a plurality of cooling tubes arrayed in parallel, with each semiconductor module sandwiched between a pair of...
US20150096719 Apparatus for Dissipating Heat  
An apparatus for dissipating heat includes a plate or pipe made of a planar thermal conductive material, such as pyrolytic graphite. The apparatus may include fins attached to the plate or pipe,...
US20060237166 High Efficiency Fluid Heat Exchanger and Method of Manufacture  
A fluid heat exchanger has a housing having a thermally conductive base, a plurality of fin members connected to the base in a parallel, spaced relationship, a heat exchanger fluid inlet on one...
US20050211417 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers  
A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange...
US20090027856 BLADE COOLING SYSTEM USING WET AND DRY HEAT SINKS  
An enclosure is disclosed. The enclosure comprises a chassis having a plurality of slots configured to hold a plurality of blades. At least one wet heat sink is positioned adjacent to each of the...
US20070068657 Sheet -shaped heat pipe and method of manufacturing the same  
A sheet-shaped heat pipe including working fluid, a partition plate having a vapor flow path which is formed by a concave portion provided in a spacer and through which vapor of the working fluid...
US20160128234 COOLING DEVICE AND ELECTRONIC APPARATUS  
A cooling device including: a heat receiver in which a working fluid is enclosed, a heat sink in which the working fluid is enclosed, an air tube made of metal so as to have flexibility, the air...
US20150136362 HEAT CONVEYING STRUCTURE FOR ELECTRONIC DEVICE  
A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally...
US20110056675 APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S)  
Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat...
US20080121821 TECHNIQUES FOR LOW-TEMPERATURE ION IMPLANTATION  
Techniques for low-temperature ion implantation are disclosed. In one particular exemplary embodiment, the techniques may be realized as a wafer support assembly for low-temperature ion...
US20070227709 Multi device cooling  
A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat...
US20070107874 Water Cooling Type Heat Dissipation Apparatus with Parallel Runners  
A water cooling type heat dissipation apparatus includes a heat dissipation stage having an upper cover and a lower cover. A first passageway and a second passageway extend from two ends of the...
US20060021737 Liquid cooling device  
A liquid cooling device includes a hollow heat absorbing unit (2) containing liquid therein, a first heat exchange body (32) and a second heat exchange body (34). The first heat exchange body...
US20070188995 Flow Diversion Heat Sinks For Temperature Uniformity in Back to Back Multi-processor Configurations  
A system for maintaining heat sink temperature uniformity in a system with pairs of substantially similar components mounted on a surface in close proximity and substantially aligned with an air...
US20070119572 System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements  
According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an...
US20070039717 Heat exchanger unit and method of manufacturing the same  
A heat exchanger unit has tubes each having a body section and at least one of an inner pipe section and an outer pipe section extending from the body section and defining an opening at an end....
US20070017660 Heatsink with adapted backplate  
A fluid-cooled heatsink and backplate, for example, for an electronic power module in an automotive application are provided, the backplate formed with a set of grooves, and the heatsink formed...
US20140318741 Cooling With Liquid Coolant And Bubble Heat Removal  
An apparatus includes a reservoir to hold a volume of liquid, a port to inject a flow of gas into a lower portion of the reservoir, and a structure to transform the flow of gas into one or more...
US20080277095 Heat exchanger assembly  
A heat exchanger, includes a plurality of MCC microchannel tubes, each microchannel tube of the plurality of microchannel tubes having at least one microchannel fluid passage defined therein and...
US20060187639 Electronic component cooling and interface system  
A cooling system for a heat-generating component on a circuit board requires no fluid connections to be made or broken in order to install or remove the circuit board. In the cooling system, a...
US20050241802 Liquid loop with flexible fan assembly  
An assembly includes a heat exchanger with a tube and a plurality of fins coupled to the tube, and a mount coupled to the heat exchanger capable of attaching a variable number and configuration of...
US20160120063 LIQUID COOLING SYSTEM HAVING HEAT DISSIPATION FINS THEREIN  
A liquid cooling system includes a liquid cooling radiator, a circulation device, and a plurality of circulation pipes coupling the circulation device with the liquid cooling radiator. A liquid...
US20060196643 Cooling system and electronic apparatus  
A cooling system includes a heat receiving portion thermally connected to a heating element, a heat radiating portion which radiates a heat of the heating element, and a circulation path...
US20060191667 Liquid-cooled heat dissipation module  
A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a base, a rotor supported by the base and having a...
US20060209512 Heat receiving member, heat receiving device and electronic equipment  
A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film...
US20060113066 Heat exchanger configuration for pumped liquid cooling computer systems  
A cooling system using counter-flow air and fins with thermal isolation sections is disclosed. The cooling system includes a pump and a liquid coolant. Counter-flow air is applied in a direction...
US20160374230 COOLING JACKET AND ELECTRONIC DEVICE HAVING THE SAME  
A cooling jacket includes: first and second pipe portions through which a coolant flows; and a main portion connected with side surfaces of the first and second pipe portions, defining, with a...

Matches 1 - 50 out of 177 1 2 3 4 >