|
Match
|
Document |
Document Title |
|
|
US20150013940 |
COMMONLY SUBMERSED, VERTICALLY REMOVABLE SERVERS IN RACK
Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a... |
|
|
US20120313657 |
TEMPERATURE CONTROL UNIT FOR ELECTRONIC COMPONENT AND HANDLER APPARATUS
A temperature control unit for an electronic component and a handler apparatus, which are excellent in responsibility during cooling and heating, is obtained. The temperature control unit for an... |
|
|
US20070159797 |
Heat exchange apparatus
In one embodiment, heat exchange device is provided, which includes a printed circuit board with a multichip module mounted on the printed circuit board. A cold plate is positioned on the... |
|
|
US20080158817 |
ELECTRONIC APPARATUS
An electronic apparatus 100 includes a heat-generating element 1, a heat-radiating plate 4 which is used in heat radiation of the heat-generating element, and a housing 10 which accommodates the... |
|
|
US20090139693 |
TWO PHASE MICRO-CHANNEL HEAT SINK
A method and system for providing a heat sink are described. The heat sink includes at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect... |
|
|
US20070158050 |
Microchannel heat sink manufactured from graphite materials
A microchannel heat sink is manufactured from graphite materials. A heat sink member has at least a first thermal contact surface for making thermal contact with an electronic device. The heat... |
|
|
US20060225867 |
Heat sink apparatus for electronic device
A heat sink apparatus is provided for an electronic device. The heat sink apparatus includes a body in which an inlet and an outlet are formed. A heat absorbing fluid flows through a plurality of... |
|
|
US20060067052 |
Liquid cooling system
In some embodiments, a multi-processor system board has at least a first processor installed on the system board and at least a first liquid cooling system configured to provide dedicated cooling... |
|
|
US20050199372 |
Cold plate and method of making the same
A cold plate having a base member and a cover member connected thereto by friction stir welding and one or more fins or flow channels machined into the base and/or the cover member. The invention... |
|
|
US20070227697 |
Heat radiator
A heat radiator 10 includes: a first member 12 which has a recessed portion 12c in one side thereof and which has a large number of substantially circular truncated conical protruding portions 12d... |
|
|
US20060096738 |
Liquid cold plate heat exchanger
A heat exchanger includes a cooling plate having a heat collection surface for fixing against an object to be cooled, an opposed heat transfer surface which may be provided with fins, and a... |
|
|
US20070017659 |
Heat spreader
A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate... |
|
|
US20050178529 |
Cooling system or electronic apparatus, and electronic apparatus using the same
An electronic apparatus, such as, personal computers of so-called a desktop type and a notebook type, as well as, a server, etc., having a cooling system being high in cooling efficiency, wherein... |
|
|
US20060162901 |
Blower, cooling device including the blower, and electronic apparatus including the cooling device
The invention provides a cooling device including a heat-receiver integrated pump that has a heat-receiving part provided on one side thereof and delivers toward a connecting pipe liquid... |
|
|
US20060157225 |
High turbulence heat exchanger
The present invention is a method and apparatus for cooling a heat source. In one embodiment a heat exchanger is provided and includes a channel for receiving a coolant, the channel having a first... |
|
|
US20060011326 |
Heat-exchanger device and cooling system
A heat-exchanging device. The device comprises a block made from a heat-conducting material with a plurality of cooling tubes provided in it. Each of the cooling tubes has an inlet for receiving... |
|
|
US20050211418 |
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid... |
|
|
US20070215325 |
DOUBLE SIDED HEAT SINK WITH MICROCHANNEL COOLING
An apparatus for cooling at least two heated surfaces includes a base plate defining multiple upper and lower supply manifolds and upper and lower exhaust manifolds. The upper and lower supply... |
|
|
US20060272802 |
Cooling plate
A cooling plate comprises a passage 6 for flowing a coolant by closing a groove 5 formed on a main body 2 with a lid 3. The lid 3 has a width greater than that of the groove 5 and has a convex... |
|
|
US20050241803 |
Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation
A liquid loop cooling apparatus includes rigid or semi-rigid tubing enclosing an interior bore or lumen within which a cooling fluid can circulate among at least one heat-generating component in a... |
|
|
US20080060792 |
HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING
A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal... |
|
|
US20060254752 |
Radiator and heatsink apparatus having the radiator
A radiator includes: an inlet header having a hollow shape and being provided with an inlet for the coolant to enter; a plurality of flat tubes connecting to the inlet header on one end; and an... |
|
|
US20050183844 |
Hotspot spray cooling
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the... |
|
|
US20060243422 |
Liquid-cooled semiconductor unit for cooling high-power semiconductor elements that are enclosed in modules
In a liquid-cooled semiconductor unit having one or more semiconductor modules and a plurality of cooling tubes arrayed in parallel, with each semiconductor module sandwiched between a pair of... |
|
|
US20150096719 |
Apparatus for Dissipating Heat
An apparatus for dissipating heat includes a plate or pipe made of a planar thermal conductive material, such as pyrolytic graphite. The apparatus may include fins attached to the plate or pipe,... |
|
|
US20060237166 |
High Efficiency Fluid Heat Exchanger and Method of Manufacture
A fluid heat exchanger has a housing having a thermally conductive base, a plurality of fin members connected to the base in a parallel, spaced relationship, a heat exchanger fluid inlet on one... |
|
|
US20050211417 |
Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange... |
|
|
US20090027856 |
BLADE COOLING SYSTEM USING WET AND DRY HEAT SINKS
An enclosure is disclosed. The enclosure comprises a chassis having a plurality of slots configured to hold a plurality of blades. At least one wet heat sink is positioned adjacent to each of the... |
|
|
US20070068657 |
Sheet -shaped heat pipe and method of manufacturing the same
A sheet-shaped heat pipe including working fluid, a partition plate having a vapor flow path which is formed by a concave portion provided in a spacer and through which vapor of the working fluid... |
|
|
US20160128234 |
COOLING DEVICE AND ELECTRONIC APPARATUS
A cooling device including: a heat receiver in which a working fluid is enclosed, a heat sink in which the working fluid is enclosed, an air tube made of metal so as to have flexibility, the air... |
|
|
US20150136362 |
HEAT CONVEYING STRUCTURE FOR ELECTRONIC DEVICE
A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally... |
|
|
US20110056675 |
APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S)
Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat... |
|
|
US20080121821 |
TECHNIQUES FOR LOW-TEMPERATURE ION IMPLANTATION
Techniques for low-temperature ion implantation are disclosed. In one particular exemplary embodiment, the techniques may be realized as a wafer support assembly for low-temperature ion... |
|
|
US20070227709 |
Multi device cooling
A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat... |
|
|
US20070107874 |
Water Cooling Type Heat Dissipation Apparatus with Parallel Runners
A water cooling type heat dissipation apparatus includes a heat dissipation stage having an upper cover and a lower cover. A first passageway and a second passageway extend from two ends of the... |
|
|
US20060021737 |
Liquid cooling device
A liquid cooling device includes a hollow heat absorbing unit (2) containing liquid therein, a first heat exchange body (32) and a second heat exchange body (34). The first heat exchange body... |
|
|
US20070188995 |
Flow Diversion Heat Sinks For Temperature Uniformity in Back to Back Multi-processor Configurations
A system for maintaining heat sink temperature uniformity in a system with pairs of substantially similar components mounted on a surface in close proximity and substantially aligned with an air... |
|
|
US20070119572 |
System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an... |
|
|
US20070039717 |
Heat exchanger unit and method of manufacturing the same
A heat exchanger unit has tubes each having a body section and at least one of an inner pipe section and an outer pipe section extending from the body section and defining an opening at an end.... |
|
|
US20070017660 |
Heatsink with adapted backplate
A fluid-cooled heatsink and backplate, for example, for an electronic power module in an automotive application are provided, the backplate formed with a set of grooves, and the heatsink formed... |
|
|
US20140318741 |
Cooling With Liquid Coolant And Bubble Heat Removal
An apparatus includes a reservoir to hold a volume of liquid, a port to inject a flow of gas into a lower portion of the reservoir, and a structure to transform the flow of gas into one or more... |
|
|
US20080277095 |
Heat exchanger assembly
A heat exchanger, includes a plurality of MCC microchannel tubes, each microchannel tube of the plurality of microchannel tubes having at least one microchannel fluid passage defined therein and... |
|
|
US20060187639 |
Electronic component cooling and interface system
A cooling system for a heat-generating component on a circuit board requires no fluid connections to be made or broken in order to install or remove the circuit board. In the cooling system, a... |
|
|
US20050241802 |
Liquid loop with flexible fan assembly
An assembly includes a heat exchanger with a tube and a plurality of fins coupled to the tube, and a mount coupled to the heat exchanger capable of attaching a variable number and configuration of... |
|
|
US20160120063 |
LIQUID COOLING SYSTEM HAVING HEAT DISSIPATION FINS THEREIN
A liquid cooling system includes a liquid cooling radiator, a circulation device, and a plurality of circulation pipes coupling the circulation device with the liquid cooling radiator. A liquid... |
|
|
US20060196643 |
Cooling system and electronic apparatus
A cooling system includes a heat receiving portion thermally connected to a heating element, a heat radiating portion which radiates a heat of the heating element, and a circulation path... |
|
|
US20060191667 |
Liquid-cooled heat dissipation module
A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a base, a rotor supported by the base and having a... |
|
|
US20060209512 |
Heat receiving member, heat receiving device and electronic equipment
A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film... |
|
|
US20060113066 |
Heat exchanger configuration for pumped liquid cooling computer systems
A cooling system using counter-flow air and fins with thermal isolation sections is disclosed. The cooling system includes a pump and a liquid coolant. Counter-flow air is applied in a direction... |
|
|
US20160374230 |
COOLING JACKET AND ELECTRONIC DEVICE HAVING THE SAME
A cooling jacket includes: first and second pipe portions through which a coolant flows; and a main portion connected with side surfaces of the first and second pipe portions, defining, with a... |