Match
|
Document |
Document Title |
|
US20120313657 |
TEMPERATURE CONTROL UNIT FOR ELECTRONIC COMPONENT AND HANDLER APPARATUS
A temperature control unit for an electronic component and a handler apparatus, which are excellent in responsibility during cooling and heating, is obtained. The temperature control unit for an... |
|
US20050155743 |
Composite heat sink with metal base and graphite fins
A composite heat sink apparatus includes a metal base which has a thermal conductivity of at least about 150 W/m° K. The metal base is preferably constructed either of copper of aluminum. The heat... |
|
US20080158817 |
ELECTRONIC APPARATUS
An electronic apparatus 100 includes a heat-generating element 1, a heat-radiating plate 4 which is used in heat radiation of the heat-generating element, and a housing 10 which accommodates the... |
|
US20070000642 |
Thermally conductive member and cooling system using the same
A thermally conductive member including a thermal diffusion sheet having at least one opening with an inner periphery; and a thermally conductive elastomer piece passing through the opening of the... |
|
US20050098300 |
Heat sink with heat pipes and method for manufacturing the same
A heat sink including a base portion and a fin portion thermally contacted with the base portion. The inside of the base portion has at least one heat pipe, and a space (e.g., an air passage)... |
|
US20080212279 |
Frequency Converter
A frequency converter includes a radiating section having a base and fins for radiating heat from a power semiconductor, a circuit substrate being provided at an opposite side of the fins with... |
|
US20060096737 |
Heat exchanger
A heat exchanger having a plurality of fin plates (2) provided in parallel on a face (1a) of a base (1), wherein the fin plate (2) is provided with a rectifier portion (2b) having a tapered cross... |
|
US20050207116 |
Systems and methods for inter-cooling computer cabinets
Systems and methods for cooling computer components housed in cabinets in large computer systems are disclosed herein. In one embodiment, a computer system configured in accordance with the... |
|
US20050061480 |
Heat sinks and method of formation
A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The... |
|
US20080128113 |
COOLING DEVICE AND ELECTRONIC APPARATUS
According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is... |
|
US20070000643 |
Heat sink
A heat sink for coolers is provided. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins... |
|
US20050145366 |
Heat-sink with large fins-to-air contact area
A heat sink adapted for cooling a heat generating component, operative with an air moving means to generate airflow and remove the generated heat. The heat sink comprises a heat conducting element... |
|
US20070193718 |
Heat sinks and method of formation
A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The... |
|
US20060185822 |
System and method for thermal management using distributed synthetic jet actuators
One embodiment of the device comprises a device for thermal management. More particularly, one embodiment comprises a synthetic jet actuator (60) and a tube (61). The synthetic jet actuator (60),... |
|
US20060144573 |
Cooling device and electronic device
In a cooling device, an electronic component is attached to one surface on one side of a heat pipe so that heat can be conveyed, a first heat-radiating fin is provided on another surface on... |
|
US20070146988 |
Electronic apparatus
According to one embodiment, there is provided an electronic apparatus including: a casing including an upper surface; a keyboard mount section provided in the upper surface of the casing; and a... |
|
US20050286232 |
Heat sink
A heat sink includes a base and a plurality of spaced parallel fins arranged on the base. Adjacent fins define a plurality of passages there between. Each passage includes an inlet and at least... |
|
US20050167085 |
Graphite-based heat sinks and method and apparatus for the manufacture thereof
One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a... |
|
US20090151900 |
HEAT SINK
A heat sink includes a thermal conductive base panel that has a plurality of heat dissipation columns of any of a variety of configurations perpendicularly upwardly extending from the top wall,... |
|
US20090016019 |
AIRFLOW CONTROL AND DUST REMOVAL FOR ELECTRONIC SYSTEMS
Airflow control and dust removal systems and methods are disclosed. In one embodiment, a plurality of blade servers is mounted in a chassis. A blower generates airflow through the chassis. Air... |
|
US20070086170 |
HEAT SINK DEVICE WITH SHIELDING MEMBER
A heat sink device includes a heat sink (20) and a shielding member (30). The heat sink defines a receiving groove (220). The shielding member includes a fixing plate (322) received in the... |
|
US20070012429 |
Heat Transfer Device
A heat transfer device includes a vapor chamber that houses a phase change material such as water. The heat transfer device may be selectively formed from a combination of polymeric and... |
|
US20160178289 |
KINETIC HEAT-SINK WITH INTERDIGITATED HEAT-TRANSFER FINS
A kinetic heat sink has a stationary portion with a first heat-conducting surface and a second heat-conducting surface to conduct heat therebetween. To cool heat generating devices devices, the... |
|
US20090145581 |
Non-linear fin heat sink
A non-linear fin heat sink is provided for dissipating/removing heat uniformly from a device, where the heat generation is non-uniform over that device, while also providing a small and relatively... |
|
US20080099193 |
SELF-REGULATED COOLING MECHANISM
Regulating the temperature of a heat-generating device within a desired range using shape memory materials disposed on a heat sink. According to one embodiment, cooling fins are placed upon a... |
|
US20070158052 |
HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING SAME
A vacuum heat-dissipating device (300) includes a container (310), a top wall (320) coupled to the container, and working fluid sealed in the heat-dissipating device. The container includes a... |
|
US20060219386 |
Heat dissipating assembly with composite heat dissipating structure
A heat dissipating assembly includes a fan and a composite heat dissipating structure. The composite heat dissipating structure includes a first heat sink and a second heat sink disposed adjacent... |
|
US20050211416 |
Heat sink with fins and a method for manufacturing the same
A heat sink with fins comprising a pillar-shaped base member, and a plurality of fins which are inserted into a plurality of grooves formed in the side face of said base member and then both sides... |
|
US20090195990 |
Heat sink
The present invention seeks to provide a novel heat sink capable of being effectively produced at a low cost and having excellent heat dissipation performance. The heat sink comprises fins 11 of a... |
|
US20060243427 |
Heat pipe heat sink and method for fabricating the same
A heat pipe heat sink and a method for making the same are disclosed. A heat pipe heat sink 1 has a heat block 2 which is heat exchangeably mounted to a heat exchange object, and the heat block 2... |
|
US20060196638 |
System and method for thermal management using distributed synthetic jet actuators
One embodiment of the device comprises a device for thermal management. More particularly, one embodiment comprises a synthetic jet actuator (60) and a tube (61). The synthetic jet actuator (60),... |
|
US20060021736 |
Pin type heat sink for channeling air flow
A pin heat sink has a plurality of pins arranged on a base plate. The plurality of pins includes a first plurality of pins arranged to create one or more funnels of air flow directed to one or... |
|
US20050168942 |
Airflow gates for electronic devices
A system may include a first power supply to supply electrical power to the system and a second power supply to supply electrical power to the system. A first airflow gate may be able to reduce... |
|
US20090321046 |
FLOW DIVERTERS TO ENHANCE HEAT SINK PERFORMANCE
A heat sink includes a base and fins attached to the base. A flow diverter is in contact with the base or at least one of the fins and is configured to disturb a laminar flow region of a fluid... |
|
US20080066888 |
HEAT SINK
A heat sink comprises a base panel having a top surface and a bottom surface. A plurality of pin fins extend outwardly from the top surface and each fin has a cross-sectional configuration with... |
|
US20070267174 |
Heat sink of plasma display apparatus
As to a heat sink manufacturing method of a plasma display apparatus according to the present invention and the manufacturing device, a widthwise direction air channel and a lengthwise direction... |
|
US20050082036 |
Cooling device of electronic apparatus
A cooling device for an electronic apparatus includes a heat generating element attached within a housing, a heat receiving jacket connectable with the heat generating element, a heat exchanger... |
|
US20050072558 |
Heat sink assembly and connecting device
A heat sink assembly includes a heat sink with a base plate having a top surface with fins for dissipating heat and an opposed bottom surface for placing against an electronic device mounted on a... |
|
US20160081225 |
STACKABLE ROTATED HEAT SINK
A cooling assembly is provided which has a heat-transferring member, a heat sink assembly, and a plurality of heat-transferring columns. The heat-transferring member has first and second sides and... |
|
US20070006997 |
Heat sink structure
A heat sink has a first vent and a second vent. The heat sink includes at least a first heat-dissipating fin having a first wall positioned at the first vent. |
|
US20060032622 |
Thermal assembly and method for fabricating the same
A thermal assembly includes a heat source (10), a heat sink (50), a thermal interface material (30) and a porous membrane (20). The heat sink is over the heat source. The thermal interface... |
|
US20050167083 |
Heat sink including redundant fan sinks
A cooling device for electronic devices is built comprising at least two fan sinks thermally coupled together such that when one fan sink fails, the remaining fan sinks are able to compensate for... |
|
US20150136358 |
COOLING ELEMENT
A cooling element includes a first surface for receiving an electric component, and a second surface which is provided with fins for forwarding a heat load received from the electric component via... |
|
US20130242504 |
COOLING AN ELECTRONIC ASSEMBLY USING POSITION VARIABLE FLOW RESTRICTORS
A plenum provides cooled air to an inlet of an enclosure. An electronics assembly within the enclosure includes temperature sensors. Each of a plurality of position variable flow restrictors is... |
|
US20100157522 |
Alternative Form Factor Computing Device with Cycling Air Flow
Various apparatus and methods of removing heat from devices in a computing device. In one aspect, a method of removing heat from a semiconductor chip in an enclosure of a computing device is... |
|
US20090086435 |
HEAT SINK MODULE AND METHOD OF MANUFACTURING THE SAME
There is provided a heat sink module having good thermal conductivity, excellent reliability without separation, and a space-saving property with a mechanism of sufficiently high heat radiation.... |
|
US20070119567 |
HEAT DISSIPATION DEVICE
A heat dissipation device includes a heat sink, a cooling fan having a frame arranged on the heat sink, and a fan holder disposed between the heat sink and the cooling fan. The fan holder includes... |
|
US20070000646 |
HEAT DISSIPATION DEVICE WITH HEAT PIPE
A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins... |
|
US20100170657 |
Integrated blower diffuser-fin heat sink
An air-cooled heat exchange device for cooling an object such as an electronic device generating heat during use. The device includes a toroidal electric motor with a centrifugal blower for... |
|
US20080135215 |
HEAT DISSIPATION DEVICE
A heat dissipation device includes a heat sink including a base and a plurality of fins on the base. Each of the fins includes a body stamped with at least a flap toward an adjacent fin. A... |