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US20150208551 |
Apparatuses for Transmitting Heat Between a Rail of Rack Mounted Equipment and a Channel of a Cooling Rack Enclosure, And Related Components, Systems, and Methods
Rack mountable equipment and a complementary cooling rack enclosure are arranged to work together to transmit heat from heat generating components of the rack mountable equipment to the cooling... |
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US20120180983 |
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
The present invention generally provides a cluster tool for processing a substrate. In one embodiment, the cluster tool comprises at least one processing rack, which comprises a first plurality of... |
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US20160104655 |
BONDING SHEET AND MANUFACTURING METHOD THEREOF, AND HEAT DISSIPATION MECHANISM AND MANUFACTURING METHOD THEREOF
A CNT-metal composite structure is formed by forming a plurality of CNTs which stand side by side from a base substance, forming a sheet-shaped support film which covers upper ends of the CNTs,... |
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US20060011336 |
Thermal management system and computer arrangement
It is the object of the present invention to provide a low weight, compact, low vertical profile thermal management system for removing heat from electronic components. The thermal management... |
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US20150332942 |
PEDESTAL FLUID-BASED THERMAL CONTROL
Thermal control of substrate carrier is described using a thermal fluid. In one example, a thermally controlled substrate support includes a top surface to support a substrate, the top surface... |
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US20150355693 |
Jacket for a Handheld Electronic Device and Handheld Assembly Having the Jacket and the Handheld Electronic Device
A jacket for a handheld electronic device includes: a housing adapted to couple with a handheld electronic device; a fan mounted in the housing; and a control unit electrically connecting with the... |
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US20140000844 |
ELECTRONICS CASE WITH INCLUDED HEAT DIFFUSER
A protective case for a planar electronic device such as a tablet or smartphone. The case includes a back having an interior surface and an exterior surface; an opening defined in the exterior... |
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US20120279684 |
SYSTEMS AND METHODS FOR COOLING ELECTRONIC EQUIPMENT
A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic... |
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US20090139690 |
HEAT SINK AND METHOD FOR PRODUCING A HEAT SINK
A heat sink includes a base body of an electrically insulating material and one or several metallic molded parts having a mounting portion and a heat-transfer portion, wherein the heat-transfer... |
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US20100108291 |
Method and apparatus for embedded battery cells and thermal management
Battery cells are embedded in a device to control thermal management of the device. One embodiment includes an embedded battery arrangement that improves thermal management of a portable computer,... |
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US20090218072 |
Cooling system for a computer system
The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said... |
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US20060060328 |
Heat-transfer devices
Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally... |
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US20160094692 |
MOBILE PHONES WITH HEAT DISSIPATION COMPONENTS, MANUFACTURING METHOD AND HEAT DISSIPATION DEVICE THEREFOR
A mobile phone is provided. A heating component has a heating surface. A heat dissipation component has a heat absorbing surface. A thermal phase-change material layer is thermally connected... |
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US20120037339 |
COOLING SYSTEM FOR CONTACT COOLED ELECTRONIC MODULES
Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are... |
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US20090321045 |
MONOLITHIC STRUCTURALLY COMPLEX HEAT SINK DESIGNS
A heat sink includes a base and a heat exchange element monolithically connected to the base. The heat exchange element has a surface that at least partially bounds first and second paths through... |
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US20110100598 |
COOLING ARRANGEMENT
The invention relates to an arrangement for cooling at least one electrical and/or electronic component and/or group of electrical/electronic components by means of a cooling body. The cooling... |
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US20160035610 |
ELECTROSTATIC CHUCK ASSEMBLIES HAVING RECESSED SUPPORT SURFACES, SEMICONDUCTOR FABRICATING APPARATUSES HAVING THE SAME, AND PLASMA TREATMENT METHODS USING THE SAME
An electrostatic chuck apparatus includes a base and a dielectric layer on the base. The dielectric layer includes a support surface opposite the base and a clamping electrode laterally extending... |
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US20100096105 |
REAR DOOR HEAT EXCHANGER TRANSITION FRAME
A transition frame system integrates a liquid cooling door with associated computer equipment racks. Dissimilar dimensions of equipment racks and cooling doors are accommodated by a transition... |
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US20130258580 |
STORAGE APPARATUS AND PARTITION BOARD USED IN STORAGE APPARATUS
A storage apparatus includes: a backplane having first and second faces; a first storage device and a first unit attached to the first face; a second storage device and a second unit attached to... |
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US20090260795 |
ACTIVE DOOR ARRAY FOR COOLING SYSTEM
Systems and methods for cooling a chassis are provided. Pulsed and/or modulated air flow may be used to cool a chassis. An array of movable doors and/or baffles may be used to achieve the... |
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US20120243175 |
COVER, ELECTRONIC DEVICE RACK, AND AIR CONDITIONING SYSTEM
A cover is provided on one surface of a rack of an electronic device provided with an outlet, and includes a sheet that guides exhaust air exhausted from the outlet in one direction along the one... |
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US20070023165 |
Thermally Conductive Two-Part Adhesive Composition
The present invention relates to a two part thermally conductive adhesive composition comprising: a first part comprising: a polymerisable monomer component which is (meth)acrylate based; a... |
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US20050217823 |
Aluminum bonding member and method for producing same
There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding... |
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US20150355691 |
MOUNTING STRUCTURE AND METHOD FOR DISSIPATING HEAT FROM A COMPUTER EXPANSION CARD
A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to... |
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US20110240281 |
Liquid-Based Cooling System For Data Centers Having Proportional Flow Control Device
A liquid-based cooling system provides a method of supplying a heated coolant fluid at a relatively constant temperature and pressure to one or more heat driven engines, such as adsorption... |
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US20150313011 |
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY
A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic... |
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US20050111188 |
Thermal management device for an integrated circuit
Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium. |
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US20120061054 |
DISTRIBUTED COOLING OF ARRAYED SEMI-CONDUCTOR RADIATION EMITTING DEVICES
Techniques for the removal of waste heat from solid state, semiconductor devices (such as cooking or heating devices) are provided. In particular, techniques for conducting waste heat away from... |
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US20100314072 |
BASE PLATE WITH TAILORED INTERFACE
Base plate apparatus for mounting IGBT modules, the base plate apparatus includes a base plate with a mounting surface and an opposed surface. A tailored coefficient of thermal expansion interface... |
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US20160006088 |
BATTERY THERMAL MANAGEMENT FOR HYBRID ELECTRIC VEHICLES USING A PHASE-CHANGE MATERIAL COLD PLATE
A thermal management system for an energy storage device that includes a liquid-cooled cold plate made of phase-change material changeable from a substantially solid form to a substantially liquid... |
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US20090266511 |
METHODS AND SYSTEMS FOR USING A STORAGE DEVICE TO CONTROL AND MANAGE EXTERNAL COOLING DEVICES
The present invention is directed toward methods and systems for cooling electronics. More particularly, in various embodiments, the present invention provides systems and methods for cooling a... |
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US20050006053 |
Device and arrangement for fixing a profiled part to a bearing rail
The invention relates to a device (1) and an arrangement (2) for fixing a profiled part (4) to a bearing rail (5) which are simple and economical to manufacture. According to the invention, an... |
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US20120292304 |
PORTABLE ELECTRONIC DEVICE CASE WITH ACTIVE THERMAL PROTECTION
A device case for a portable electronic device is provided and includes mechanical protection for the device, an active thermal element incorporated within the mechanical protection and a... |
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US20170027084 |
CONTINUOUS FLUIDIC THERMAL INTERFACE MATERIAL DISPENSING
A temperature control system for controlling a temperature of an electronic device during testing of the electronic device includes a thermal head having a device contact face configured to... |
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US20110240260 |
COOLING ARRANGEMENT
A cooling arrangement for cooling a heat generating electrical component is disclosed, which arrangement comprises a heat spreading element (2) having a mounting surface (3) adapted to be... |
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US20150060014 |
SERVER RACK COOLING SYSTEM
A server rack includes a plurality of servers received therein. The server rack includes a delivery mechanism, a plurality of main fan groups and a backup fan group for cooling the servers. Each... |
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US20080156457 |
Thermally coupling an integrated heat spreader to a heat sink base
The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may... |
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US20160056512 |
HEAT EXCHANGER COMPONENT
A heat exchanger component of a temperature control system of an electrical energy store may include a carrier material and at least two layers. The at least two layers may include a first layer... |
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US20140182814 |
AIR DUCT
An air duct includes a top wall, two sidewalls connected to opposite sides of the top wall, and a board. One of the sidewalls defines an opening extending through a bottom side of the sidewall,... |
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US20140043761 |
MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER
An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized... |
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US20080264613 |
STRUCTURE OF MEMORY HEAT SINK
A memory heat sink is mainly used to provide the memory unit with increased heat dissipation and protection. The memory unit, which is sandwiched in between the bilateral heat spreaders gripped by... |
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US20050257912 |
Laser cooling system and method
A folded sheet is used as a basis for a fin array to cool laser modules. The folded sheet has flat portions that are connected in thermal contact with the laser module, and fins formed by... |
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US20170188486 |
RACK AIRFLOW MONITORING SYSTEM AND METHOD
A rack airflow monitoring system is configured to measure airflow through an equipment rack having a housing and a perforated front door to enable air to flow into an interior of the housing. The... |
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US20100110633 |
INTEGRATED ACTIVE COOLED CABINET/RACK FOR ELECTRONIC EQUIPMENTS
An integrated active cooled cabinet/rack for electronic equipments. An aspect of the present invention is to provide a control unit for the cabinet, that enables individual equipment monitoring... |
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US20120048511 |
Spiral-path chimney-effect heat sink
A spiral-path chimney-effect heat sink cools an LED light bulb by increasing the length of the path over which heated air rises between two coaxial tubes. A tube top is attached to one end of the... |
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US20160021768 |
Multi-Purpose Enclosures And Methods For Removing Heat In The Enclosures
A multi-purpose enclosure for telecommunication applications includes plural walls defining a first chamber and a second chamber, and a heat generating component positioned in the first chamber.... |
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US20100006260 |
HEAT SINK
A heat sink includes a base plate and at least one elastic plate. The base plate is connected to a heat generator such as a semiconductor chip. One end portion of the elastic plate is connected to... |
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US20160360644 |
Heat Dissipation in a Mobile Device to Enable High-Performance Desktop Functionality
The invention allows a mobile device such as a smart phone or tablet to be designed to dissipate heat through the battery or battery casing to the back and sides of the enclosure, which allows... |
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US20160113148 |
COOLING DEVICE AND COOLED ELECTRICAL ASSEMBLY COMPRISING THE SAME
A cooling device comprising a first chamber (1), a second chamber (2) separated from the first chamber (1), heat exchanger means (4) adapted to transfer heat from the first chamber (1) to the... |
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US20150366103 |
Signal Transmission Device and Cooling Device
The heat generating elements are more effectively cooled by improving a heat radiating property of the heat generating elements provided so as to be adjacent to each other. An extending direction... |