Match Document Document Title
US20110096502 PRINTED CIRCUIT BOARD ASSEMBLY  
A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The...
US20110011565 PLATE-TYPE HEAT PIPE  
A plate-type heat pipe includes a container, a wick structure and a plurality of supporting plates. The wick structure is adhered to an inner surface of the container. The supporting plates are...
US20100061062 MULTI-ORIENTATIONAL COOLING SYSTEM WITH A BUBBLE PUMP  
The present invention relates to a multi-orientational cooling system with a bubble pump for generation of a circulating flow of cooling fluid. The cooling system is a closed cooling system...
US20120168145 DEICING LOUVERS FOR DATACENTER APPLICATIONS  
A datacenter may use heat collected from a heat exchanger at the exhaust portion of a cooling system to heat inlet louvers for an atmospheric intake. The louvers may have fluid passages through...
US20110114294 HEAT REMOVAL IN COMPACT COMPUTING SYSTEMS  
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
US20130264030 STRUCTURAL CONFIGURATION OF A HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK  
A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening...
US20120227937 HEAT DISSIPATION STRUCTURE FOR PHOTOVOLTAIC INVERTER  
A heat dissipation structure for photovoltaic inverter includes a photovoltaic inverter, a thermal module and at least one heat pipe. The thermal module has a heat dissipation backboard formed...
US20100307719 HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING THE SAME  
A heat dissipation device includes a heat sink, a heat-absorbing plate with two slots defined in two lateral sides thereof, a heat pipe connecting the heat-absorbing plate and the heat sink, and a...
US20110205703 GIMBAL SYSTEM WITH FORCED FLOW OF EXTERNAL AIR THROUGH A CHANNEL TO REMOVE HEAT  
Gimbal system, including apparatus and methods, with forced flow of external air through a channel to remove heat. The system may comprise a support portion including at least one electronic...
US20150075754 SINGLE-PASS COLD PLATE ASSEMBLY  
A single-pass cold plate assembly having a base and a cover arranged in confronting relationship to define a cold plate with a spiral channel and a manifold with the manifold having a manifold...
US20080073061 Variable depth microchannels  
A channel heat exchanger and cooling system with plan-wise variable rate of cooling that corresponds, in part, to a plan-wise variable heat flux and a method of manufacturing and using same.
US20080128120 FIN-PIPE SHAPED RADIATOR SPECIALLY ADAPTED TO A SEMICONDUCTOR CHILLING UNIT AND THE METHOD OF MAKING SAME  
This invention relates to a radiator and its preparation method, and especially refers to a fin-pipe shaped radiator specially applied to semiconductor chilling unit and its preparation method....
US20140318746 DEVICE FOR INDIRECTLY COOLING BATTERY MODULE OF ECO-FRIENDLY VEHICLE  
A device for indirectly cooling a battery module of an eco-friendly vehicle is provided that cools the battery module using an interfacial plate into which a heat pipe is inserted to maximize...
US20070089867 Magneto-hydrodynamic hot spot cooling heat sink  
A heat sink is configured to cool at least one hot spot of an integrated circuit. The heat sink has a first pipe and a second pipe disposed interior to and concentric with the first pipe, where at...
US20090314472 Evaporator For Loop Heat Pipe System  
Provided is an evaporator for a loop heat pipe system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to an evaporator having an increased...
US20100126703 Motor device with heat dissipating capability  
A motor device includes a motor body and a set of heat-conducting pipes. The motor body includes a motor casing that defines a chamber, a stator that is disposed in the chamber, and a rotor that...
US20130034767 BATTERY PACK LIQUID COOLING SYSTEM  
A cooling system operable to cool a battery pack or other device through a heat exchange operation supported, at least in part, with cycling of a coolant relative to a coldplate or other thermally...
US20120050984 SERVER CABINET WITH LIQUID COOLING SYSTEM  
An exemplary server cabinet includes an enclosure configured to house multiple servers therein, and a liquid cooling system. A heat conductive plate is positioned in the enclosure to be adjacent...
US20150036294 Sealed Battery Charger Housing  
A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used to facilitate charging a high...
US20110232863 INTEGRAL COLD PLATE AND STRUCTURAL MEMBER  
A cold plate assembly is provided having a cold plate with a generally planar member that provides a support surface. The support surface is configured to support a heat generating device. A...
US20080196867 Cooling Fluid Flow Regulation Distribution System and Method  
The disclosure provides systems and methods for regulating and distributing cooling fluid through a plurality of heat sinks, such as cold plates, using a flow regulator, which sets the total flow...
US20100236754 Airflow guider for use in heat sink  
An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the...
US20090211736 COOLANT CIRCULATING APPARATUS, AND COOLING APPARATUS INCLUDING THE SAME COOLANT CIRCULATING APPARATUS FOR ELECTRIC AND/OR ELECTRONIC DEVICE WHICH GENERATES HEAT  
A coolant circulating apparatus includes circulating pumps disposed in parallel to each other and each having inlet and discharge ports and discharging coolant flowing into the inlet port from the...
US20140246178 LIQUID COOLING SYSTEM FOR A SERVER  
A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality...
US20140168889 LIQUID COOLING SYSTEM FOR A SERVER  
A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality...
US20110303394 LIQUID COOLING SYSTEM FOR A SERVER  
A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality...
US20110192571 WATER-COOLING HEAT DISSIPATION SYSTEM FOR LED SIGNBOARD  
A water-cooling heat dissipation system for LED signboard includes a frame, at least one water pipe system, and at least one water-cooling unit. At least one heat receiving section and at least...
US20100300652 Heat Dissipating System  
A heat dissipating system includes an electronic device, a refrigeration device, a thermal connector, a cold plate, and a pipe. The cold plate is located in the electronic device for absorbing the...
US20080087406 Cooling system and associated method for planar pulsating heat pipe  
A cooling assembly, system, and method are provided. The cooling assembly includes a plate comprising a plurality of channels defined in a surface of the plate and at least one pulsating heat pipe...
US20090084528 METHOD FOR MANUFACTURING HEAT DISSIPATOR HAVING HEAT PIPES AND PRODUCT OF THE SAME  
A heat dissipator having heat pipes includes a heat-conducting base, a first heat pipe and a second heat pipe. The heat-conducting base has an accommodating trough. After the first heat pipe is...
US20120097374 MAINTAINING THERMAL UNIFORMITY IN MICRO-CHANNEL COLD PLATES WITH TWO-PHASE FLOWS  
A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant...
US20110168358 LAP-JOINED HEAT PIPE STRUCTURE AND THERMAL MODULE USING SAME  
A lap-joined heat pipe structure includes at least one first heat pipe having at least a first heat absorbing section in contact with a heat source and at least a first heat transfer section; and...
US20130056181 DEIONIZED-WATER COOLING SYSTEM FOR ELECTRICAL EQUIPMENT  
Deionized-water cooling system for electrical equipment, connected electrically to a primary power supply, characterized in that it includes: a main circuit to channel and cool the deionized water...
US20120216992 DEW-CONDENSATION DETECTING APPARATUS, ELECTRONIC EQUIPMENT COOLING SYSTEM, AND DEW-CONDENSATION DETECTING METHOD  
A dew-condensation detecting apparatus includes a dew-condensation detector provided in a middle of a cold-liquid supply passage. The cold-liquid supply passage supplies a cooling liquid to...
US20090266523 SCALEABLE PARALLEL FLOW MICRO-CHANNEL HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME  
Provided is a heat exchanger, heat sink or coldwall having a machined manifold for receiving a plurality of individual, modular micro-channel heat exchanger elements. The manifold further includes...
US20070215328 Coated heat sink  
A coated heat sink includes: a copper base seat, an aluminum heat-dissipating seat, a plurality of heat pipes, a solder, a heat-conducting adhesive glue, and a plurality of heat-dissipating fins....
US20090032229 METHODS AND SYSTEMS FOR COOLING INVERTERS FOR VEHICLES  
A method for cooling an inverter of a vehicle system includes the steps of providing a flow of cooling fluid to the inverter, determining a value of a variable that is influenced at least in part...
US20110132579 Liquid Submerged, Horizontal Computer Server Rack and Systems and Method of Cooling such a Server Rack  
Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a...
US20060137860 Heat flux based microchannel heat exchanger architecture for two phase and single phase flows  
An apparatus, system, and method to cool a non-uniform heat source using a micro-channel heat exchanger.
US20110293985 Heat Transfer Module for Battery Cells and Battery Assembly Therewith  
Disclosed is a heat transfer module (3) for battery cells includes a plastic frame (4) having a supply conduit and an exhaust conduit (13b) for a heat transfer fluid. Two heat transfer members...
US20100032141 COOLING SYSTEM UTILIZING CARBON NANOTUBES FOR COOLING OF ELECTRICAL SYSTEMS  
A cooling system to cool the airflow through a electrical system includes a CNT heat exchanger module disposed within a housing of the electrical system, a cooling device configured to receive a...
US20060207750 Heat pipe with composite capillary wick structure  
A heat pipe (20) includes a metal casing (22) having an evaporating section (70) and a condensing section (80). A first type of capillary wick (241) is provided in the evaporating section and a...
US20090025415 DEVICE AND METHOD FOR VACUUM-SEALING A COOLING MEDIUM  
A device and a method for vacuum-sealing cooling medium is to allow a work piece being vacuumed for the cooling medium being introduced into the work piece. The device provides a first passage, a...
US20110315353 LIQUID-COOLED ELECTRONICS RACK WITH IMMERSION-COOLED ELECTRONIC SUBSYSTEMS AND VERTICALLY-MOUNTED, VAPOR-CONDENSING UNIT  
Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor...
US20060196641 SCREEN MESH WICK AND METHOD FOR PRODUCING THE SAME  
A screen mesh wick (14) and a method of making the same are disclosed. The wick is made separately and is adaptive for inserting into a heat pipe as a wick structure. The wick includes a plurality...
US20090194260 Cooling apparatus for graphic cards  
A cooling apparatus for graphic cards is used for two graphic cards that are disposed in parallel. There is a receiving space between the two graphic cards. The cooling apparatus for graphic cards...
US20140071626 VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE  
A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with...
US20090218078 VARIABLE FLOW COMPUTER COOLING SYSTEM FOR A DATA CENTER AND METHOD OF OPERATION  
Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of...
US20080115924 ELECTRICAL INSTALLATION WITH A COOLING ELEMENT AND METHOD FOR OPERATING SAID INSTALLATION  
The installation contains a current conductor producing Joulean heat in the operating state, a cooling element and a monitoring device. The cooling element has a condensable working medium and an...
US20070056713 Integrated cooling design with heat pipes  
Methods and apparatus are provided for a cooling system (100) for cooling a microelectronic device (102). The system includes a heat sink (104) and first and second heat pipes (106, 108). The heat...