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US20150007592 COMPOSITIONS COMPRISING 2,3,3,3-TETRAFLUOROPROPENE AND HYDROCARBONS AND USES THEREOF  
The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises 2,3,3,3-tetrafluoropropene (HFC-1234yf) and at...
US20090178790 VAPOR COMPRESSION SYSTEM  
An evaporator for use in a vapor compression system is disclosed. The evaporator may include an enclosure that covers a substantial portion of a tube bundle in the evaporator. The enclosure...
US20130221262 TETRAFLUOROPROPENE COMPOSITIONS AND USES THEREOF  
The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises a tetrafluoropropene and at least one other...
US20140283537 COMPOSITIONS COMPRISING A FLUOROOLEFIN  
The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises a fluoroolefin and at least one other component....
US20090225515 Thermal bus or junction for the removal of heat from electronic components  
A thermal bus enables the use of multiple separate heat pipe assemblies instead of using a single heat pipe assembly spanning the distance from heat source to cold plate. The use of a thermal bus...
US20090032227 Flexible Graphite Thermal Management Devices  
The invention provides to thermal management devices constructed from flexible graphite. In one embodiment, the thermal management device includes a wick structure inside a shell. In certain...
US20120126187 HEAT TRANSFER COMPOSITIONS  
The invention provides a heat transfer composition comprising: (i) 1,3,3,3-tetrafluoroprop-1-ene (R1234ze, CF3CH═CHF) (ii) a second component comprising R-1243zf, (3,3,3 trifluoropropene) or a...
US20130193369 HEAT TRANSFER COMPOSITIONS  
The invention provides a heat transfer composition comprising: (i) trans-1,3,3,3-tetrafluoropropene (R-1234ze(E)); (ii) a second component selected from difluoromethane (R-32), propene...
US20110005723 IONIC LIQUID STABILIZER COMPOSITIONS  
The present invention relates to compositions comprising at least one ionic liquid and CF3I; and mixtures thereof. Such compositions may be useful as low GWP working fluids. These compositions...
US20110108241 METHOD FOR MAKING PHASE CHANGE PRODUCTS FROM AN ENCAPSULATED PHASE CHANGE MATERIAL  
The present invention provides methods of producing manufactured aggregates and other compositions from an encapsulated PCM slurry, suspension or emulsion by combining a cementitious binder and an...
US20150237762 INTEGRATED THERMAL MANAGEMENT SYSTEM  
A thermal management system for a heat generating electrical component and a method of making such a thermal management system. Additive manufacturing is used to form at least a portion of the...
US20150216081 HEAT DISSIPATION MECHANISM FOR HANDHELD ELECTRONIC APPARATUS  
A heat dissipation mechanism for handheld electronic apparatus includes a thin metal sheet having one or multiple elongated mounting grooves and an elongated rib extending along each of two...
US20160073548 COOLING MODULE, COOLING MODULE MOUNTING BOARD AND ELECTRONIC DEVICE  
A cooling module includes a casing that stores a heating element and a coolant in which the heating element is immersed; and a liquid channel through which a cooling liquid that condenses vapor of...
US20140191154 COMPOSITIONS COMPRISING 1,1,1,2,2-PENTAFLUOROPROPANE AND A FLUOROOLEFIN AND USES THEREOF  
Compositions are disclosed comprising: (a) 1,1,1,2,2-pentafluoropropane; (b) a compound selected from the group consisting of 2,3,3,3-tetrafluoropropene, E-1,3,3,3-tetrafluoropropene, and...
US20090294103 PROCESS TO REDUCE THE TEMPERATURE OF A HYDROGEN AND CARBON MONOXIDE CONTAINING GAS AND HEAT EXCHANGER FOR USE IN SAID PROCESS  
Process to reduce the temperature of a hydrogen and carbon monoxide containing gas by contacting the gas with a metal alloy surface having a lower temperature than the temperature of the gas,...
US20090025910 Vapor chamber structure with improved wick and method for manufacturing the same  
A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber....
US20140264147 Low GWP heat transfer compositions containing difluoromethane, A Fluorinated ethane and 1,3,3,3-tetrafluoropropene  
Heat transfer compositions, methods and use wherein the composition comprising: (a) from about 5 to about 20% by weight of HFC-32; (b) from about 70% to about 90% by weight of HFO-1234ze; and (c)...
US20100157535 HEAT-TRANSPORTING DEVICE AND ELECTRONIC APPARATUS  
A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, a liquid-phase flow path, and an intermediate layer. The working fluid transports heat using a phase change....
US20070204646 Cold plate incorporating a heat pipe  
Apparatus and method for cooling a comestible fluid. The method can include cooling a plate with ice. A heat pipe with a condenser portion can be in heat transfer relationship with the plate, and...
US20050126759 Plate-type heat pipe and method for manufacturing the same  
A plate-type heat pipe including a hermetically sealed container in which a working fluid is received, said container comprising a plate member on which at least one heat generating device is...
US20160061532 EVAPORATOR AND CONDENSER SECTION STRUCTURE FOR THERMOSIPHON  
A thermosiphon device includes a closed loop evaporator section having one or more evaporation channels that are fed by a liquid return path, and a condenser section with one or more condensing...
US20130020053 LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING  
Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein;...
US20120211201 COOLING DEVICE FOR A HEAT SOURCE  
A cooling element for a heat source, especially LED modules with many components, includes a base body in thermal and mechanical contact with a body of the heat source, at least one heat pipe...
US20060236709 Spacing-saving superconducting device  
A superconducting device has a magnet with at least one superconducting winding and a cryogenic unit that has at least one cryogenic head. The device further has a conductor system with at least...
US20160209120 BOILING HEAT TRANSFER DEVICE  
A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and...
US20140347801 Flat Heat Pipe Radiator and Portable Computer  
A flat heat pipe radiator and a new kind of portable computer are provided. The air convective extended heat exchange surface of the radiator surrounds the fan impeller and is facing the air...
US20140293541 HEAT PIPE HEAT SINK FOR HIGH POWER DENSITY  
A heat sink is disclosed including a cold plate, a plurality of heat pipes, and a plurality of fins. The cold plate has a first surface arranged substantially vertical and adapted to thermally...
US20140290929 HEAT PIPE HEAT SINK WITH HEATING UNIT  
A heat sink is disclosed including a cold plate, a plurality of heat pipes, a plurality of fins, and a heating unit. The cold plate has a first surface adapted to thermally couple to a heat...
US20140131011 Silicon-Based Thermal Energy Transfer Device And Apparatus  
A thermal energy transfer apparatus is described. The apparatus includes a silicon-based support module and a plurality of silicon-based plate modules. The silicon-based support module includes a...
US20050126758 Heat sink in the form of a heat pipe and process for manufacturing such a heat sink  
In a heat sink designed as a heat pipe, there is an interior space in a body of the heat sink that is closed toward the outside with at least one vapor channel or vapor space and at least one...
US20150223367 Computer Cooling System And Method of Use  
A reliable, leak-tolerant liquid cooling system with a backup air-cooling system for computers is provided. The system may use a vacuum pump and a liquid pump and/or an air compressor in...
US20060090881 Immersion cooling apparatus  
A device for cooling a heat-dissipating component comprising a body having at least one sidewall, an enclosed volume, an expansion volume, a quantity of heat transfer fluid disposed within the...
US20150013941 Conduction Cooled Chassis With Embedded Heatpipes  
An electronics chassis heat-pipe conduction cooling system includes a first chassis wall having multiple heat transfer sleeves defining multiple first chassis slots. A cabinet bottom chassis wall...
US20120305830 HEAT TRANSFER COMPOSITIONS  
The invention provides a heat transfer composition consisting essentially of from about 45 to about 58% by weight trans-1,3,3,3-tetrafluoropropene (R-1234ze(E)) and from about 42 to about 55% by...
US20120125571 Heat-Dissipating Device for Space-Based Equipment, Notably for a Satellite  
A device for dissipating heat, for a space-based satellite, includes at least one dissipating panel, the dissipating panel having at least one skin formed from a composite structure comprising an...
US20080092587 Heat Exchanger with Fluid Expansion in Header  
A heat exchanger includes a plurality of flat, multi-channel heat exchange tubes extending between spaced headers. Each heat exchange tube has a plurality of flow channels extending longitudinally...
US20150136362 HEAT CONVEYING STRUCTURE FOR ELECTRONIC DEVICE  
A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally...
US20140238646 SLOPED HIERARCHICALLY-STRUCTURED SURFACE DESIGNS FOR ENHANCED CONDENSATION HEAT TRANSFER  
An apparatus. The apparatus comprises a distribution of microstructures on an area of a surface, each of the microstructures having one or more sloping sides. The apparatus comprises a...
US20120085959 USE OF UNSATURATED HYDROFLUOROCARBONS  
Use of certain hydrofluoroalkenes for foam blowing, solvent cleaning, refrigeration, as etching gas for semiconductor etching or chamber cleaning, heat transfer, fire extinguishing and for the...
US20080236795 LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING  
Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein;...
US20140090814 COOLING SYSTEM AND ELECTRONIC APPARATUS USING THE SAME  
The invention relates to a cooling system and an electronic apparatus using the same, and particularly aims to use a thermosiphon as the cooling system and derives an optimum shape (inter-fin gap,...
US20130146257 CONDENSER FOR VEHICLE  
A condenser for a vehicle is used in an air conditioning having an expansion valve, an evaporator, and a compressor, is provided between the compressor and the expansion valve, and circulates...
US20050051302 Cooling apparatus  
A cooling apparatus 1 boiling and condensing refrigerant is constructed to have a stacked construction by stacking a plurality of pressed members 3 and comprises a refrigerant tank portion, a heat...
US20150198380 HEAT TRANSFER DEVICE FOR HIGH HEAT FLUX APPLICATIONS AND RELATED METHODS THEREOF  
A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage...
US20150000871 HOUSING WITH HEAT PIPES INTEGRATED INTO ENCLOSURE FINS  
A device with increased heat dissipation abilities for supporting printed wiring boards includes a chassis for holding printed wiring boards, a plurality of fins attached to the chassis, and a...
US20120247735 HEAT SINK  
The heat sink has a first heat transfer plate member that has one surface thermally connected to a heat generating component and is thermally connected to a first heat dissipating fin section...
US20120012281 HEAT SINK WITH MULTIPLE VAPOR CHAMBERS  
A heat sink is disclosed. The heat sink comprises a base (102, 402) with at least one vapor chamber (208, 408) containing a fluid with a first activation point. The base has at least one vapor...
US20140369005 PASSIVE THERMAL MANAGEMENT DEVICE  
A thermal management device including a first face configured to be in contact with a hot source and a second face opposite the first face configured to be in contact with a cold source, and at...
US20130063896 HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING SAME  
A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus includes a box-shaped heat receiver,...
US20110083459 HEAT EXCHANGER WITH INTEGRAL PHASE CHANGE MATERIAL FOR HEATING AND COOLING APPLICATIONS  
A heat exchanger is provided for use in heating and cooling applications. The heat exchanger includes a heat exchange fluid, at least one heating element for heating the heat exchange fluid, and a...

Matches 1 - 50 out of 371 1 2 3 4 5 6 7 8 >