Matches 1 - 13 out of 13


Match Document Document Title
US20060219359 Protective tape separating method and apparatus using the same  
During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining...
US20080017311 SHEET PEELING APPARATUS AND PEELING METHOD  
A sheet S is stuck on the front surface of a wafer W, and the wafer W is supported on a table 20. A peeling tape T is stuck onto a peripheral portion of the sheet S and the peeling tape T is held...
US20090084499 METHODS TO PREVENT ECC (EDGE CHIPPING AND CRACKING) DAMAGE DURING DIE PICKING PROCESS  
A method for preventing edge chipping and cracking damage encountered by semiconductor chips in a die picking operation during separation from an adhesive sheet. Also provided is a device for...
US20090139655 Adhesive seal peeling device for a hard disk drive  
The present invention provides a system and method for peeling off a adhesive seal for sealing a evacuation hole in the cover of a hard disk drive without damaging the seal in the fabrication and...
US20090107633 Apparatus and Method for Transferring, Apparatus and Method for Peeling, and Apparatus and Method for Laminating  
An apparatus and method for peeling, and an apparatus and method for laminating which are preferable to reduce the overall size of the apparatus are provided. When a transport means 8 transports a...
US20060231202 Support board separating apparatus, and support board separating method using the same  
An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape...
US20070119543 Method and apparatus for attaching a peeling tape  
In a peeling tape attaching method for attaching a peeling tape (4) on a surface protective film (11) attached on the surface of a wafer (20), the wafer is supported on a movable table (31) with...
US20100252205 DEVICE FOR THIN DIE DETACHMENT AND PICK-UP  
A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are...
US20050274457 Peeling device for chip detachment  
A peeling device is provided for detachment of a chip from an adhesive tape on which it is mounted. The device comprises a platform including a first surface and a raised contact surface set at a...
US20090242124 METHOD AND APPARATUS FOR PEELING ELECTRONIC COMPONENT  
A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into...
US20050016678 Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device  
A manufacturing apparatus of a semiconductor device is provided with a pickup section for picking up a sectioned semiconductor element from a semiconductor wafer, a film sticking section for...
US20150279716 APPARATUS AND METHOD FOR DETACHING CHIP  
Provided are an apparatus and method for detaching a chip, in which a semiconductor chip attached to a tape is detached so as to supply and mount the semiconductor chip on a package or a circuit...
US20150239227 DELAMINATION METHOD, DELAMINATION DEVICE, AND DELAMINATION SYSTEM  
A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a...

Matches 1 - 13 out of 13