Matches 1 - 33 out of 33


Match Document Document Title
US20110052836 FLEXIBLE DISPLAY AND METHOD FOR MANUFACTURING THE SAME  
A flexible display comprises a flexible substrate made of plastic material, a display element on a first surface of the flexible substrate, and a surface residual film containing at least one of a...
US20100243159 RESIN LAMINATE, PRESSURE SENSITIVE ADHESIVE SHEET, METHOD FOR WORKING ADHEREND USING THE PRESSURE SENSITIVE ADHESIVE SHEET, AND DEVICE FOR SEPARATING THE PRESSURE SENSITIVE ADHESIVE SHEET  
A pressure sensitive adhesive sheet according to the present invention is a resin laminate, including a high thermally shrinkable base layer having relatively high thermal shrinkage ratio, having...
US20130084459 LOW PEEL ADHESIVE  
A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether...
US20110139375 METHOD AND APPARATUS FOR SEPARATING ADHESIVE TAPE  
An adhesive tape joined to a wafer is irradiated with ultraviolet rays via diodes. Simultaneously, a heater heats the adhesive tape to a preset temperature. Consequently, an ultraviolet reaction...
US20100224320 APPARATUS FOR DE-BONDING FLEXIBLE DEVICE AND METHOD FOR DE-BONDING FLEXIBLE DEVICE  
The invention provides an apparatus for de-bonding a flexible device and method thereof. The apparatus for de-bonding a flexible device includes a carrier to mount a carrier substrate thereon, a...
US20110048641 METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE FROM OBJECT TO BE CUT  
The present invention is intended to provide a method for protecting a surface of an object to be cut from contamination due to the adhesion of dust and the like, including cutting scraps, by...
US20120118511 LAMINATE AND METHOD FOR SEPARATING THE SAME  
A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a...
US20090314438 Supporting plate peeling apparatus  
A supporting plate peeling apparatus in accordance with the present invention has removal means for removing an adhesive agent remaining on a side of a wafer from which a supporting plate has been...
US20110048630 PROTECTIVE TAPE SEPARATING METHOD AND APPARATUS  
A chuck table adhesively holds a rear face of a mount frame subject to a dicing process with a protective tape joined thereto, and a suction plate having a heater embedded therein contacts and...
US20090035580 ELECTROPEELING COMPOSITION, AND MAKING USE OF THE SAME, ADHESIVE AND ELECTROPEELING MULTILAYER ADHESIVE  
An object of the invention is to provide an electropeeling composition which, when attached two adhered members, has an enough bond strength and can be easily detached the adherend members...
US20140144593 WAFER DEBONDING USING LONG-WAVELENGTH INFRARED RADIATION ABLATION  
Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers that absorb long-wavelength infrared...
US20130014905 FILM PEELING APPARATUS AND FILM PEELING METHOD  
An ultrashort pulsed laser beam, the fluence of which on an interface BF is set to be larger than a substrate processing threshold and smaller than a film processing threshold, is irradiated to...
US20160133486 Double Layer Release Temporary Bond and Debond Processes and Systems  
A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release...
US20140057098 LAMINATED COMPOSITIONS AND METHODS  
A laminated composition includes a first polymer layer having a first surface and a second surface; a second polymer layer having a first surface and a second surface; and an adhesive layer...
US20130199732 METHOD OF STRIPPING MULTIPLE PLIES OF A PRESSURE-SENSITIVE ADHESIVE LAYER, AND A PRESSURE-SENSITIVE ADHESIVE LAYER USED THEREIN  
The present invention provides a method of stripping multiple plies of a pressure-sensitive adhesive layer, capable of easily separating and dismantling the joint portion in a short time, without...
US20120021225 LAMINATED COMPOSITIONS AND METHODS  
A laminated composition includes a first polymer layer having a first surface and a second surface; a second polymer layer having a first surface and a second surface; and an adhesive layer...
US20090095418 ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME  
The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray...
US20080264563 Apparatus and Method to Enable Easy Removal of One Substrate from Another for Enhanced Reworkability and Recyclability  
A method and apparatus enables easy removal of a first substrate (e.g., a label, EMC gasket, etc.) from a second substrate (e.g., a cover of a computer enclosure) for enhanced reworkability or...
US20140251533 SUBSTRATE PEELING DEVICE, METHOD FOR PEELING SUBSTRATE, AND METHOD FOR FABRICATING FLEXIBLE DISPLAY DEVICE  
A method for fabricating a display device is provided. A laser having a power density is provided to a substrate coupling body. The substrate coupling body includes a first substrate and a second...
US20080302481 METHOD AND APPARATUS FOR DEBONDING OF STRUCTURES WHICH ARE BONDED TOGETHER, INCLUDING (BUT NOT LIMITED TO) DEBONDING OF SEMICONDUCTOR WAFERS FROM CARRIERS WHEN THE BONDING IS EFFECTED BY DOUBLE-SIDED ADHESIVE TAPE  
When heat or UV radiation is applied to an adhesive tape (130) which bonds a semiconductor wafer (110) to a carrier (120), the appropriate lift-off time for separating the wafer from the carrier...
US20050173052 Method for processing an electronic part  
Disclosed is a gas-generating, pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an...
US20060292377 Adhesive attachment of a first member to a second member  
Apparatus and method for adhesively attaching a first member to a second member, such as components of a data storage device. Preferably, an adhesive is applied to the first member and exposed to...
US20110217505 Low-Defect nitride boules and associated methods  
This invention describes Extreme low-defect Nitride Boules and associated methods of manufacture using low-defect seed templates or composite templates arranged in precise hexagonal or partial...
US20160133495 MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION  
The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The...
US20160133497 MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION  
The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The...
US20160052252 PEELING PROCESS OF SUBSTRATE  
A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate...
US20120318463 SEPARATION OF LAMINATED SHEETS  
There is disclosed a method of separating laminated sheets comprising first and second sheets which are bonded by an adhesive interlayer, the method comprising heating the interlayer to soften it...
US20160141197 METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE  
Provided is a method of peeling an electronic member from a laminate composed of the electronic member adhered to a supporting substrate via an adhesive film having a self-peeling adhesive layer...
US20100255347 INFORMATION RECORDING MEDIUM AND METHOD FOR MANUFACTURING SAME  
A method for manufacturing an information recording medium may used for manufacturing the information recording medium which has a recording layer and a resin layer that may be provided in contact...
US20090078370 Method of separating non-metallic material using microwave radiation  
A method of high speed cutting of non-metallic materials (14), preferably glass, is described. In the inventive method a concentrated microwave radiation (1) with appropriate frequency and power...
US20090008032 METHOD FOR PICKING UP A COMPONENT AS WELL AS A DEVICE SUITABLE FOR CARRYING OUT SUCH A METHOD  
A method for picking up a component from a film. The component is connected to the film by means of an adhesive bond, which adhesive bond between the component and the film is irradiated by means...
US20070062643 Method of separating adhesive-bonded body  
A method of separating an adhesive-bonded body is provided, by which a pair of pieces bonded together by using an adhesive can be easily securely separated from each other, wherein the adhesive...
US20150183172 METHOD FOR REPAIRING ELECTRONIC DEVICE  
A method is employed for repairing an electronic device. The electronic device includes a base plate, a component installed on the base plate, and a second workpiece adhered on the base plate by...

Matches 1 - 33 out of 33