Matches 1 - 50 out of 183 1 2 3 4 >


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US20050274696 Single-acid compensating system  
A single-acid compensating system (20) includes an etching unit (201), and a monitoring and compensating unit (202). The etching unit includes an acid-mixing tank (212). The monitoring and...
US20140144879 METHOD AND SYSTEM FOR GOLF CLUB WEIGHT ADJUSTMENT  
There is provided a method and system for adjusting the weight of a golf clubs. The method includes receiving a target additional weight for the golf club. A weighted filler is selected...
US20090075421 Wet etching of zinc tin oxide thin films  
A method of wet etching semiconductor zinc tin oxide includes submerging a semiconductor zinc tin oxide film in a bath solution. The film is partially covered with a pattern of protective...
US20140231010 CHEMICAL SUPPLIER, PROCESSING APPARATUS INCLUDING THE CHEMICAL SUPPLIER  
A chemical supplier includes a chemical reservoir containing a chemical mixture at a room temperature, an inner space of the chemical reservoir being separated from surroundings, a supply line...
US20070235132 Photoresist stripping apparatus, method of recycling photoresist stripper, and method of manufacturing thin film transistor array panel using the photoresist stripping apparatus  
Provided is a photoresist (PR) stripping apparatus that enables the recycling of a photoresist stripper and utilizes a continuous filtering action during a filter operation. The PR-stripping...
US20140010992 Chemical Process for Obtaining Anti-Reflective Glass, Comprising Immersion in an Acid Solution, for Simultaneous and Continuous Production  
A chemical process for obtaining anti-reflective glass, comprising immersion in an acid solution, for the simultaneous and continuous production of one or more parts and/or sheets of glass having...
US20150197862 ADDITIVE METAL DEPOSITION PROCESS  
A build piece is made from a build plan by an additive metal deposition process, the build plan created from a three dimensional definition of a desired part, the build plan having a first set of...
US20060219664 Core leaching  
Removal of a soluble part of a core allows provision of relatively complex three-dimensional geometric shapes in a component. Unfortunately previous leaching arrangements have been relatively...
US20130247967 GASEOUS OZONE (O3) TREATMENT FOR SOLAR CELL FABRICATION  
Methods of fabricating solar cells and apparatuses for fabricating solar cells are described. In an example, a method of fabricating a solar cell includes treating a light-receiving surface of a...
US20080142484 Auxiliary method for wet etching by oscillation flow modification and device for the same  
The present invention provides an auxiliary method for wet etching by oscillation flow modification and an device for the same. The method for wet etching by oscillation flow modification includes...
US20060128160 Photoresist strip using solvent vapor  
Photoresist is removed from a wafer or substrate during various stages of processing by introducing a solvent vapor, along with heat, into the processing chamber. The solvent vapor chemically...
US20060144822 Apparatus and method for wet-etching  
A wet-etching apparatus (20) includes a first etching chamber (213), a second etching chamber (215), and a cleaning chamber (214) located between the first and second etching chambers. The...
US20090114619 WET ETCHING METHOD AND WET ETCHING APPARATUS  
A fine pattern is formed on a surface of a processing object without using photoresist. A wet etching for the processing object in an area to which ultraviolet light is applied is performed by...
US20050279452 Etching reaction device with protrusions  
An etching reaction device (3) includes an etching reaction chamber (30), and a number of protrusions (301) arranged on the bottom of the etching reaction chamber. Thus it can economize the...
US20110165365 METHOD AND DEVICE FOR ENCAPSULATING MICROSTRUCTURES  
A method for encapsulating structures (11) (typically MEMS structures) supported by a carrier substrate (12) (typically made of glass or silicon), includes: application, on the carrier substrate...
US20050241760 Wet etching system  
A wet etching system includes a substrate holding chamber (211), a drying chamber (218), a cleaning chamber (217), a wet etching region, an elevator (213), a conveyor (212) arranged above the...
US20150034245 SUBSTRATE TREATMENT APPARATUS  
An inventive substrate treatment method includes a silylation step of supplying a silylation agent to a substrate, and an etching step of supplying an etching agent to the substrate after the...
US20130248486 ELECTRON BEAM POLISHING OF ALUMINUM  
A highly polished surface on an aluminum substrate is formed using any number of machining processes. During the machining process, intermetallic compounds are typically generated at a top surface...
US20070295357 REMOVING METAL USING AN OXIDIZING CHEMISTRY  
A method of removing a metal includes exposing at least a portion of a metal-to-metal removal chemistry, wherein the metal removal chemistry comprises a chlorine-rich superoxidizer. In one...
US20130062014 LIQUID-GAS INTERFACE PLASMA DEVICE  
A plasma system for treating a workpiece is disclosed. The plasma system includes: a plasma device including an electrode formed from a metal alloy and a dielectric layer covering the electrode,...
US20090301515 MICROWAVE ASSISTED CHEMICAL STRIPPING OF COATINGS  
A method for chemically stripping a metallic coating from a substrate is described. The coating is treated in the presence of microwave energy with a solution containing at least one acid known to...
US20050247673 Confinement of fluids on surfaces  
The invention is directed to a device for applying a fluid to a surface, the device comprising a first conduit for directing a flow of a first fluid towards the surface and a second conduit for...
US20140264153 Processing System and Method for Providing a Heated Etching Solution  
Embodiments of the invention provide a processing system and a method for processing with a heated etching solution. In one example, tight control over temperature and hydration level of an acidic...
US20070221615 Liquid supply method, liquid supply apparatus, substrate polishing apparatus, and method of measuring supply flow rate of liquid  
A liquid supply apparatus is to supply a polishing liquid from a polishing supply source onto a polishing surface of a polishing table at a predetermined flow rate. The liquid supply apparatus...
US20090032497 System and method for controlling the application of acid etchers or cleaners by means of color-changing dye  
An acidic etcher solution for etching a substrate's surface. The acidic etcher solution includes an acid and a pH indicator, the pH indicator having at least one color transition at a pH below 7....
US20140057416 SEMICONDUCTIVE MICRO- AND NANO-WIRE ARRAY MANUFACTURING  
The disclosure provides methods of manufacturing semiconductive structures using stamping and VLS techniques.
US20080203058 SUBSTRATE DEVELOPING METHOD AND DEVELOPING APPARATUS  
A method for developing a substrate includes a developing step for supplying a developer to the substrate, and a neutralizing and removing step for supplying a treating solution containing a...
US20130306238 CHEMICAL LIQUID PREPARATION METHOD OF PREPARING A CHEMICAL LIQUID FOR SUBSTRATE PROCESSING, CHEMICAL LIQUID PREPARATION UNIT PREPARING A CHEMICAL LIQUID FOR SUBSTRATE PROCESSING, AND SUBSTRATE PROCESSING SYSTEM  
A substrate processing system includes a chemical liquid preparation unit preparing a chemical liquid to be supplied to a substrate and a processing unit which supplies the chemical liquid,...
US20110309051 APPARATUS AND METHOD FOR WET TREATMENT OF AN OBJECT AND FLUID DIFFUSION PLATE AND BARREL USED THEREIN  
An apparatus for wet treatment of an object includes a treatment bath in which an object to be treated is received and treated; a plurality of object supporting rods rotatably installed in the...
US20050247675 Treatment of dies prior to nickel silicide formation  
A post chemical-mechanical polishing cleaning method, comprising contacting a die with a first chemistry that removes at least some organic compounds and ions from a surface of the die. After...
US20140273497 Wet Processing Systems and Methods with Replenishment  
Embodiments provided herein describe systems and methods for processing substrates. A substrate having a plurality of site-isolated regions defined thereon is provided. A plurality of wet...
US20140144871 Stripping Structure And Method For Removing Enamel Insulation From Lead Ends  
Stripping structure strips insulation from ends of a plurality of leads of a lead bundle. Each lead includes a conductor member coated with the insulation. The structure includes a housing having...
US20140338751 METHOD OF MANUFACTURING THIN FILM SOLAR CELL, DEVICE FOR MANUFACTURING THIN FILM SOLAR CELL, AND THIN FILM SOLAR CELL INCLUDING BUFFER LAYER MANUFACTURED BY THE METHOD  
A device of manufacturing a cascade thin film solar cell with improved productivity, and a thin film solar cell manufactured using the device have been disclosed. The thin film solar cell having a...
US20050092433 Etching apparatus of glass substrate  
The present invention discloses an etching apparatus comprising an etching bath having an etchant; an etchant recycling part in the etching bath; a DI and undiluted etchant supply part for...
US20070037399 High-pressure device for closing a container in a clean room  
The invention relates to a very compact device and to a method for closing a container by means of a rotational symmetric lifting system, which contains a working piston and a guide cylinder and...
US20130012028 High purity, environmentally clean method and apparatus, for high rate, liquid anisotropic etching of single crystal silicon or etching of polycrystalline silicon, using an overpressure of ammonia gas above aqueous ammonium hydroxide  
A high purity, non-toxic, environmentally friendly method for anisotropically etching single crystal silicon and etching polysilicon, suitable for microelectronics, optoelectronics and...
US20140262028 Non-Contact Wet-Process Cell Confining Liquid to a Region of a Solid Surface by Differential Pressure  
An open-bottomed reactor cell for wet processing of substrates can be configured to confine a process liquid to an area under the cell (processing the “internal site”), or alternatively to exclude...
US20050016680 Device for etching rinsing and drying substrates in an ultra-clean atmosphere  
An etching, rinsing and drying device for substrates (7) comprises a tank (5) having a diffusing bottom (9) and an overflow chute (2). Projection nozzles (10, 11) are arranged in the diffusing...
US20090008364 Method and Device for Etching Substrates Contained in an Etching Solution  
The invention relates to a method for etching substrates (4) received in an etching solution (2). Said method comprises the following steps: A basin (1) which can receive the etching solution (2)...
US20070107842 Corrosion-resistant member  
To provide a material for devices that require good corrosion resistance and a property of less liquid remaining, such as jigs to load an article to be treated in a wet process and spray chambers...
US20140251951 PRESSURE MASKING SYSTEMS AND METHODS FOR USING SAME IN TREATING TECHNIQUES  
Systems and methods of treating, e.g., stripping and coating, a target surface of an article including a passageway are disclosed. The systems may fluidly connect a pressure masker including...
US20150111311 METHOD OF SELECTIVELY REMOVING SILICON NITRIDE AND ETCHING APPARATUS THEREOF  
A method of selectively removing silicon nitride is provided. The method includes: providing a wafer having silicon nitride on a surface of the wafer; supplying a mixture of phosphoric acid and a...
US20100055398 Single-Sided Textured Sheet Wafer  
An apparatus for texturing two-sided wafers has a body capable of containing texturing chemistry (i.e., not necessarily containing the chemistry at this time), and a transport mechanism for...
US20050191861 Using supercritical fluids and/or dense fluids in semiconductor applications  
Embodiments of the present invention generally relate to methods and apparatuses using supercritical fluids and/or dense fluids in semiconductor applications. In one embodiment, a substrate...
US20060070979 Using ozone to process wafer like objects  
The present invention relates to methods of processing wafer-like objects (e.g., having an exposed copper feature and/or including low-k dielectric material) with ozone. In certain preferred...
US20080073030 Apparatus for manufacturing semiconductor device  
An apparatus according to the present invention, includes an etching solution tank which contains etching solution used for a wet etching process, a wet etching process to a semiconductor wafer...
US20080223826 Reagent Delivery using a Membrane-Mediated Process  
Methods and apparatuses for using a semi-permeable membrane to deliver a reagent to a surface in a topographically selective manner are provided. The methods and apparatuses are particularly...
US20120305528 REMOVABLE COATING AND RESIN SYSTEM AND METHOD OF USING THE SAME  
The illustrated embodiments include a selectively removable marking product composed of an aqueous solution of at least one resin complex of polyethyleneimine (PEI) characterized by a total amine...
US20120248061 INCREASING MASKING LAYER ETCH RATE AND SELECTIVITY  
Provided is a method and system for increasing etch rate and etch selectivity of a masking layer on a substrate, wherein the system comprises a plurality of substrates containing the masking layer...
US20120309135 Through-Substrate Vias  
A method of etching through-substrate vias comprising depositing a layer of embossable material on a first side and a second side of a thin-film stack, the thin-film stack including a base...

Matches 1 - 50 out of 183 1 2 3 4 >