Matches 1 - 36 out of 36


Match Document Document Title
US20140209215 COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME  
A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a...
US20120073712 MACHINABLE COPPER-BASED ALLOY AND METHOD FOR PRODUCING THE SAME  
Alloy containing between 1% and 20% by weight of Ni, between 1% and 20% by weight of Sn, between 0.5%, 3% by weight of Pb in Cu which represents at least 50% by weight of the alloy; characterized...
US20130284327 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE  
A copper alloy for an electric device contains Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less, and the balance...
US20130056116 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE  
A copper alloy for an electronic device containing Mg in a range of 2.6 atomic % or more and 9.8 atomic % or less, Al in a range of 0.1 atomic % or more and 20 atomic % or less, and the balance...
US20110247735 COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS AND METHOD OF PRODUCING THE SAME  
A copper alloy material for electric/electronic parts, containing: Sn 3.0 to 13.0 mass %, any one or both of Fe and Ni 0.01 to 2.0 mass % in total, and P 0.01 to 1.0 mass %, with the balance being...
US20130075272 HIGHLY PURE COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, METHOD FOR MANUFACTURING SAME, AND ELECTROLYTIC COPPER PLATING METHOD  
Provided are a highly pure copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the highly pure copper anode. The...
US20130048162 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE  
One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic %, with a remainder being Cu and inevitable...
US20140283961 COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC EQUIPMENT, ROLLED COPPER ALLOY MATERIAL FOR ELECTRONIC EQUIPMENT, AND PART FOR ELECTRONIC EQUIPMENT  
This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration...
US20130042949 METHOD OF MANUFACTURING SOFT-DILUTE-COPPER-ALLOY-MATERIAL  
A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg,...
US20080061038 Composite Wire For Electrical Discharge Machining  
The invention relates to a wire (1) which comprises a copper or pinchbeck core (2) surrounded by a pinchbeck coating consisting of a continuous pinchbeck sub-layer (3) in phase β and a superficial...
US20140096877 COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICES, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC DEVICES, AND COMPONENT FOR ELECTRONIC DEVICES  
An aspect of this copper alloy contains: Mg at a content of 3.3 at % or more to less than 6.9 at %; and either one or both of Cr and Zr at respective contents of 0.001 at % to 0.15 at %, with the...
US20140283962 COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD OF MANUFACTURING COPPER ALLOY FOR ELECTRONIC DEVICES, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC DEVICES, AND COMPONENT FOR ELECTRONIC DEVICES  
A copper alloy for electronic devices has a low Young's modulus, high proof stress, high electrical conductivity and excellent bending formability and is appropriate for a component for electronic...
US20140261925 ULTRA HIGH STRENGTH COPPER-NICKEL-TIN ALLOYS  
The present disclosure relates to ultra high strength wrought copper-nickel-tin alloys and processes for improving the yield strength of the copper-nickel-tin alloy such that the resulting 0.2%...
US20050103409 Cleaning System for Surfaces Exposed to Poor Weather Conditions  
The invention concerns a cleaning system for surfaces exposed to poor weather conditions, in particular roof surfaces, solar heating systems or glass roofs. Said system comprises a plurality of...
US20080011396 COPPER ALLOY AND METHOD OF PRODUCING THE SAME  
A copper alloy, having Sn 3.0 to 13.0 mass %, with the balance being Cu and unavoidable impurities, which copper alloy contains crystal grains whose diameter is 1.0 to 2.0 μm, and wherein the...
US20140261924 PROCESSES FOR IMPROVING FORMABILITY OF WROUGHT COPPER-NICKEL-TIN ALLOYS  
Disclosed are processes for improving the formability of a copper-nickel-tin alloy having a 0.2% offset yield strength that is above 115 ksi. The alloy includes about 14.5 to about 15.5 wt %...
US20050211346 Copper alloy and copper alloy manufacturing method  
An object of the present invention is to provide copper alloy which has a dimensionless performance index value M satisfying an inequality: M>400 in either a binary system alloy composition...
US20140253281 Electrode Material for Thermal Fuses, Manufacturing Method Therefor and Thermal Fuse Comprising the Same  
[Problem to be solved] For an Ag—CuO alloy based electrode material for thermal fuses, rolling workability is significantly decreased as the content of CuO is increasing, and the reduction of a...
US20130028784 COPPER ALLOY WROUGHT MATERIAL, COPPER ALLOY PART, AND METHOD OF PRODUCING A COPPER ALLOY WROUGHT MATERIAL  
A copper alloy wrought material, containing 1.5 to 7.0 mass % of Ni, 0.3 to 2.3 mass % of Si, 0.02 to 1.0 mass % of S, and optionally at least one selected from the group consisting of Sn, Mn, Co,...
US20070089816 Machinable copper-based alloy and production method  
Alloys based on copper, nickel, tin and lead obtained by a method of continuous or semi-continuous casting, or static billet casting or sprayforming billet casting, and capable of spinodal...
US20130255845 HEAT TREATMENT METHOD OF UNLEADED BRASS ALLOY  
A heat treatment method for unleaded brass alloy is provided to improve processability, cracking resistance, wear resistance and anti-corrosive property of unleaded brass alloy containing no lead...
US20130167357 Refrigeration Line Set Fitting and Method of Using the Same to Join Refrigeration Lines to Each Other  
A crimp fitting comprises a metal tube wall that forms both a cylindrical tube portion and an adjacent annular O-ring channel portion. The tube wall has a first wall thickness along the...
US20100059147 Copper Sputtering Targets and Methods of Forming Copper Sputtering Targets  
The invention includes a copper-comprising sputtering target. The target is monolithic or bonded and contains at least 99.99% copper by weight and has an average grain size of from 1 micron to 50...
US20060162827 Contact pin  
The present invention relates to a one-piece screw terminal, characterized by the fact that it is made of a copper alloy based on Cu, Ni, and Si.
US20090014102 Copper-based alloy and method of manufacturing same  
This invention is a copper-based alloy for use in connectors, lead frames, switches and relays and the like that has a superior balance of conductivity, tensile strength and workability in bending...
US20090035632 SOLID OXIDE FUEL CELL ELECTRODE SYSTEMS AND METHODS  
A solid oxide fuel cell (SOFC) interconnect comprises a metal sheet with an air side and a fuel side in accordance with an embodiment of the present invention. The metal sheet comprises a metallic...
US20090229716 COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS AND METHOD OF PRODUCING THE SAME  
A copper alloy material for electric/electronic parts, which is produced by the steps containing: finish rolling a copper alloy at a reduction ratio of 40% or less, subjecting the copper alloy...
US20100037996 COPPER ALLOY MATERIAL AND METHOD OF MAKING SAME  
A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and...
US20150171598 GASKET AND PRODUCTION METHOD FOR SAME, AND SPARK PLUG AND PRODUCTION METHOD FOR SAME  
A gasket is made of metal, has a solid annular shape, and is provided on the outer circumference of a metallic shell of a spark plug between an externally threaded portion and a seat portion of...
US20060142167 Water-soluble copper, copper alloys and non-ferrous metals intermediate cold and hot rolling composition  
The present invention relates to a water soluble copper, copper alloys and non-ferrous metals intermediate cold and hot rolling composition comprising a base stock oil and, based on the total...
US20130247979 NEW ELECTRICAL CONDUCTOR FOR ATTACHING SILICON WAFERS IN PHOTOVOLTAIC MODULES  
The invention relates to an electrical conductor (2) having a longitudinal axis (A) parallel to the rolling direction of a conductor wire, comprising copper material and an attachment surface (7)...
US20070051442 Copper alloy material and method of making same  
A copper alloy material for electric parts having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 0.05 to 2.0 mass % of Sn; 0.1 to 5.0 mass % of Zn; 0.01 to 0.3 mass % of P; 0.05 to 1.0 mass %...
US20100323218 Plain bearing composite material, use thereof and production methods therefor  
The invention relates to a plain bearing composite material with a supporting layer made of a copper alloy, and with a lining applied to the bearing metal layer. The copper alloy can contain 0.5...
US20170130309 COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC EQUIPMENT, ROLLED COPPER ALLOY MATERIAL FOR ELECTRONIC EQUIPMENT, AND PART FOR ELECTRONIC EQUIPMENT  
This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration...
US20160130677 Systems and Methods for Tailoring Coefficients of Thermal Expansion Between Extreme Positive and Extreme Negative Values  
Systems and methods disclosed herein relate to the manufacture of metallic material with a thermal expansion coefficient in a predetermined range, comprising: deforming, a metallic material...
US20150308009 PHOSPHOROUS-CONTAINING COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, METHOD FOR MANUFACTURING SAME, AND ELECTROLYTIC COPPER PLATING METHOD  
Provided are a phosphorous-containing copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the phosphorous-containing...

Matches 1 - 36 out of 36