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US20150240340 MACHINABLE COPPER ALLOYS FOR ELECTRICAL CONNECTORS  
The present disclosure concerns a machinable precipitation hardenable copper alloy comprising between 1 and 4.1 wt. % of Ni; between 0.3 and 3.0 wt. % of Si; between 0.4 and 4.0 wt. % of Pb; no...
US20140209215 COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME  
A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a...
US20120073712 MACHINABLE COPPER-BASED ALLOY AND METHOD FOR PRODUCING THE SAME  
Alloy containing between 1% and 20% by weight of Ni, between 1% and 20% by weight of Sn, between 0.5%, 3% by weight of Pb in Cu which represents at least 50% by weight of the alloy; characterized...
US20130263978 Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIALS AND MANUFACTURING METHOD THEREOF  
Cu—Ni—Si—Co copper alloy strip having excellent balance between strength and electrical conductivity which can prevent the drooping curl is provided. The copper alloy strip for an electronic...
US20120279618 COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME  
A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal...
US20140014241 STRIP OF Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND THE METHOD FOR PRODUCING THE SAME  
Cu—Co—Si-based alloy strip, which has not only an excellent balance between strength and electrical conductivity but also suppressed hanging curl, is provided. The copper alloy strip for...
US20120148441 COPPER ALLOY WIRE AND METHOD FOR PRODUCING THE SAME  
The zirconium content of the alloy composition of a copper alloy wire is 3.0 to 7.0 atomic percent; and the copper alloy wire includes copper matrix phases and composite phases composed of...
US20110174417 HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY PIPE, ROD, OR WIRE  
A high strength and high conductivity copper alloy pipe, rod, or wire is composed of an alloy composition containing 0.13 to 0.33 mass % of Co, 0.044 to 0.097 mass % of P, 0.005 to 0.80 mass % of...
US20100319818 Method for fabricating a copper alloy and copper alloy fabricated by the same  
A method for fabricating a copper alloy. Cu and Cr, Zr, and Sn to be doped to the Cu are melt to cast a copper alloy material. Hot working is carried out on the copper alloy material to form a...
US20140014240 Cu-Si-Co-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR PRODUCING THE SAME  
A Cu—Si—Co-based alloy having an enhanced spring limit is provided. The copper alloy comprises 0.5-2.5 mass % of Co, 0.1-0.7 mass % of Si, the balance Cu and inevitable impurities, wherein, from a...
US20140318673 COPPER ALLOY MATERIAL, ELECTRICAL OR ELECTRONIC PARTS, AND METHOD OF PRODUCING A COPPER ALLOY MATERIAL  
A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance...
US20110192505 COPPER ALLOY MATERIAL, ELECTRICAL OR ELECTRONIC PARTS, AND METHOD OF PRODUCING A COPPER ALLOY MATERIAL  
A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance...
US20150170781 COPPER ALLOY AND METHOD FOR MANUFACTURING THE SAME  
A copper alloy according to the present invention is a copper alloy rolled to be plate-shaped. The copper alloy contains 8.5 to 9.5 mass % of Ni, 5.5 to 6.5 mass % of Sn with a remainder being Cu...
US20130022492 CU-NI-SI-CO COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME  
A Cu—Ni—Si—Co system alloy having an improved spring bending elastic limit is provided. The alloy is a copper alloy for electronic materials, which contains 1.0% to 2.5% by mass of Ni, 0.5% to...
US20110094635 COPPER ALLOY  
A method of producing a copper alloy containing a precipitate X composed of Ni and Si and a precipitate Y that comprises (a) Ni and 0% Si, (b) Si and 0% Ni, or (c) neither Ni nor Si, wherein the...
US20140190596 COPPER ALLOY AND METHOD OF MANUFACTURING COPPER ALLOY  
Disclosed is a beryllium-free copper alloy having high strength, high electric conductivity and good bending workability and a method of manufacturing the copper alloy. Provided is a copper alloy...
US20150225826 Cu-Al-Mn-BASED ALLOY EXHIBITING STABLE SUPERELASTICITY AND METHOD OF PRODUCING THE SAME  
A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a β single phase, in which 70% or more of crystal grains is within a range of...
US20120258809 COPPER-TIN MULTICOMPONENT BRONZE CONTAINING HARD PHASES, PRODUCTION PROCESS AND USE  
The invention relates to a copper-tin multicomponent bronze consisting of (in % by weight): 0.5 to 14.0% Sn,0.01 to 8.0% Zn,0.01 to 0.8% Cr,0.05 to 2.0% Al,0.01 to 2.0% Si,optionally in addition...
US20060157167 Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method  
A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt.ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn....
US20130014861 CU-NI-SI ALLOY FOR ELECTRONIC MATERIAL  
The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to...
US20130333812 COPPER ALLOY AND PROCESS FOR PRODUCING COPPER ALLOY  
To provide a copper alloy of the FCC structure containing Ni: 3.0 to 29.5 mass %, Al: 0.5 to 7.0 mass %, and Si: 0.1 to 1.5 mass %, with the remainder consisting of Cu and incidental impurities,...
US20090183803 COPPER-NICKEL-SILICON ALLOYS  
A copper base alloy having an improved combination of yield strength and electrical conductivity consisting essentially of between about 1.0 and about 6.0 weight percent Ni, up to about 3.0 weight...
US20090165902 METHOD OF PRODUCING A COPPER ALLOY WIRE ROD AND COPPER ALLOY WIRE ROD  
A method of producing a copper alloy wire rod, containing: a casting step for obtaining an ingot by pouring molten copper of a precipitation strengthening copper alloy into a belt-&-wheel-type or...
US20120145438 COPPER ALLOY FOIL, FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD FOR PRODUCING COPPER ALLOY FOIL  
The zirconium content of the alloy composition of a copper alloy foil of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil includes copper matrix phases and composite...
US20120312431 COPPER ALLOY WITH HIGH STRENGTH AND HIGH CONDUCTIBILITY, AND METHOD FOR MANUFACTURING SAME  
A copper alloy includes Si to facilitate deoxidation, and can be easily manufactured even when including elements such as Cr or Sn. The copper alloy has high conductivity and high workability...
US20140311633 COPPER-NICKEL-TIN ALLOY WITH HIGH TOUGHNESS  
A spinodal copper-nickel-tin alloy with a combination of improved impact strength, yield strength, and ductility is disclosed. The alloy is formed by process treatment steps including solution...
US20130180630 Cu-Co-Si-BASED ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURING THE SAME  
A Cu—Co—Si-based alloy that has even mechanical properties and that is provided with favorable mechanical and electrical properties as a copper alloy for an electronic material is provided. The...
US20110186187 COPPER ALLOY  
A method of producing a copper alloy containing: Ni and/or Si and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, the copper...
US20130087255 Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS, AND METHOD OF MANUFACTURING SAME  
Disclosed is a Cu—Co—Si-based copper alloy for electronic materials, which is capable of achieving high levels of strength, electrical conductivity, and also anti-setting property; and contains...
US20070062619 Copper alloy and process for producing the same  
A copper alloy that has a specific chemical composition, the balance being Cu and impurities, in which the relationship between the total number N and the diameter X satisfies the following...
US20080283159 Soft copper alloy, and soft copper wire or plate material  
A method of fabricating soft copper alloy wire having flexure resistance and heat resistance, includes casting a molten alloy of a copper alloy including 10 mass ppm or less of oxygen, and 0.005...
US20120241056 COPPER ALLOY SHEET MATERIAL HAVING A LOW YOUNG'S MODULUS AND METHOD OF PRODUCING THE SAME  
{Problems} To provide a copper alloy material, having a low Young's modulus that is required of electrical or electronic parts, such as connectors. {Means to solve} A copper alloy sheet material...
US20100132851 COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME  
A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal...
US20050211346 Copper alloy and copper alloy manufacturing method  
An object of the present invention is to provide copper alloy which has a dimensionless performance index value M satisfying an inequality: M>400 in either a binary system alloy composition...
US20140014239 COPPER ALLOY CONTAINING COBALT, NICKEL AND SILICON  
A process for manufacturing copper-nickel-silicon alloys includes the sequential steps of casting the copper alloy; hot working the cast copper-base alloy to effect a first reduction in...
US20130098511 CU-SI-CO ALLOY FOR ELECTRONIC MATERIALS, AND METHOD FOR PRODUCING SAME  
A Cu—Co—Si alloy having an improved balance between electrical conductivity and strength is provided. Disclosed is a copper alloy for electronic materials, which contains 0.5% to 4.0% by mass of...
US20050039827 Copper alloy having excellent corrosion cracking resistance and dezincing resistance, and method for producing same  
A copper alloy having an excellent corrosion cracking resistance and an excellent dezincing resistance consists of: 58 to 66 wt % of copper (Cu); 0.1 to 0.8 wt % of Sn; 0.01 to 0.5 wt % of Si; at...
US20070158004 Low-migration components, media- or drinking-water carrying works  
The invention relates to a method for producing components, media- or drinking-water carrying works, in particular fittings, valves, pipes, press connectors, roof or drainage gutters, as well as...
US20060086437 Method for manufacturing copper alloys  
The invention relates to a method for manufacturing copper based precipitation hardenable alloys, such as copper-chromium (CuCr), copper-chromium-zirconium (CuCrZr) and copper-zirconium (CuZr),...
US20090084473 COPPER ALLOY WITH HIGH STRENGTH AND EXCELLENT PROCESSABILITY IN BENDING AND PROCESS FOR PRODUCING COPPER ALLOY SHEET  
The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to...
US20130092297 Cu-Co-Si System Alloy Sheet and Method for Manufacturing Same  
The present invention provides a Cu—Co—Si system alloy sheet, being suitable for use in a variety of electronic device components, in particular, having excellent uniform adhesive property for...
US20090101496 COPPER PHYSICAL VAPOR DEPOSITION TARGETS AND METHODS OF MAKING COPPER PHYSICAL VAPOR DEPOSITION TARGETS  
The invention includes physical vapor deposition targets formed of copper material and having an average grain size of less than 50 microns and an absence of course-grain areas throughout the...
US20050161129 Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor  
A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to...
US20120267013 COPPER ALLOY SHEET MATERIAL AND METHOD OF PRODUCING THE SAME  
A copper alloy sheet material, having an R value of 1 or greater, which is defined by: R=([BR]+[RDW]+[W])/([C]+[S]+[B]) wherein [BR], [RDW], [W], [C], [S], and [B] represent an area ratio of...
US20090098011 Copper Tin Nickel Phosphorus Alloys With Improved Strength and Formability and Method of Making Same  
A new copper-based alloy is described along with a processing method to make a strip that can be used for various automotive interconnects. The alloy process combination yields a material with...
US20090107589 Method and Production Line for Manufacturing Metal Strips Made of Copper or Copper Alloys  
Disclosed are a method and a production line for manufacturing metal strips made of copper or copper alloys by means of casting and rolling. In order to lower the investment cost and operating...
US20120312430 COPPER ALLOY HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY, AND METHOD FOR PREPARING THE SAME  
The present invention relates to a copper alloy having particular benefits for electronic parts and a method for making the same. The alloy having the composition of 0.05 wt % of Fe, 0.025˜0.15 wt...
US20120031533 Cu-Co-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR MANUFACTURING SAME  
The present invention provides Cu—Co—Si system alloys that have desirable mechanical and electrical characteristics as a copper alloy for electronic materials, and have uniform mechanical...
US20090053090 Alloy for heat dissipation of semiconductor device and semiconductor module, and method of manufacturing alloy  
It is an object to provide an inexpensive alloy for heat dissipation having a small thermal expansion coefficient as known composite materials, a large thermal conductivity as pure copper, and...
US20090035174 Copper Alloy for Electronic Materials  
The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about...

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