Matches 1 - 28 out of 28


Match Document Document Title
US20130284327 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE  
A copper alloy for an electric device contains Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less, and the balance...
US20130056116 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE  
A copper alloy for an electronic device containing Mg in a range of 2.6 atomic % or more and 9.8 atomic % or less, Al in a range of 0.1 atomic % or more and 20 atomic % or less, and the balance...
US20130048162 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE  
One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic %, with a remainder being Cu and inevitable...
US20070227631 Copper-zinc alloy for a valve guide  
A novel copper-zinc alloy is particularly suited for a valve guide. The copper-zinc alloy comprises 59 to 73% copper, 2.7 to 8.3% manganese, 1.5 to 6% aluminum, 0.2 to 4% silicon, 0.2 to 3% iron,...
US20110240182 Ni-Si-Co COPPER ALLOY AND MANUFACTURING METHOD THEREFOR  
Disclosed is a Ni—Si—Co copper alloy that is suitable for use for various kinds of electronic parts and has particularly good uniform plating adhesion properties. The copper alloy for electronic...
US20150225826 Cu-Al-Mn-BASED ALLOY EXHIBITING STABLE SUPERELASTICITY AND METHOD OF PRODUCING THE SAME  
A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a β single phase, in which 70% or more of crystal grains is within a range of...
US20130014861 CU-NI-SI ALLOY FOR ELECTRONIC MATERIAL  
The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to...
US20140212324 FINE CRYSTALLITE HIGH-FUNCTION METAL ALLOY MEMBER AND METHOD FOR MANUFACTURING SAME  
Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of...
US20110056591 BRASS ALLOY POWDER, BRASS ALLOY EXTRUDED MATERIAL, AND METHOD FOR PRODUCING THE BRASS ALLOY EXTRUDED MATERIAL  
Brass alloy powder has a brass composition formed by a mixed phase of α-phase and β-phase, and contains 0.5 to 5.0 mass % of chromium. The chromium includes a component that is solid-solved in a...
US20100276037 High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same  
A high strength titanium copper alloy consists of Ti at 2.0% by mass or more to 3.5% by mass or less; the balance of copper and inevitable impurities; an average grain size of 20 μm or less; and a...
US20130087255 Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS, AND METHOD OF MANUFACTURING SAME  
Disclosed is a Cu—Co—Si-based copper alloy for electronic materials, which is capable of achieving high levels of strength, electrical conductivity, and also anti-setting property; and contains...
US20070169854 Copper-based alloy casting in which grains are refined  
A copper-based alloy casting includes 69 to 88% of Cu, 2 to 5% of Si, 0.0005 to 0.04% of Zr, 0.01 to 0.25% of P by mass, and a remainder including Zn and inevitable impurities, and satisfies...
US20100322818 GOLD ALLOYS  
A gold alloy having, expressed by weight, about 24.5 to 25.5% Au, about 19.0 to 23.0% Ag, about 43.0 to 47.0% Cu, about 6.0 to 10.0% Zn, about 0.05 to 0.30% Si, and about 0.005 to 0.03% Ir....
US20120312430 COPPER ALLOY HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY, AND METHOD FOR PREPARING THE SAME  
The present invention relates to a copper alloy having particular benefits for electronic parts and a method for making the same. The alloy having the composition of 0.05 wt % of Fe, 0.025˜0.15 wt...
US20070158002 COPPER ALLOY CASTING AND METHOD OF CASTING THE SAME  
Copper alloy casting contains Cu: 58-72.5 mass %; Zr: 0.0008-0.045 mass %; P: 0.01-0.25 mass %; one or more elements selected from Pb: 0.01-4 mass %, Bi: 0.01-3 mass %, Se: 0.03-1 mass %, and Te:...
US20120175026 COPPER ALLOY WITH HIGH STRENGTH AND EXCELLENT PROCESSABILITY IN BENDING AND PROCESS FOR PRODUCING COPPER ALLOY SHEET  
The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to...
US20150044089 COPPER/ZINC ALLOYS HAVING LOW LEVELS OF LEAD AND GOOD MACHINABILITY  
The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially...
US20130276938 COPPER/ZINC ALLOYS HAVING LOW LEVELS OF LEAD AND GOOD MACHINABILITY  
The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially...
US20090229716 COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS AND METHOD OF PRODUCING THE SAME  
A copper alloy material for electric/electronic parts, which is produced by the steps containing: finish rolling a copper alloy at a reduction ratio of 40% or less, subjecting the copper alloy...
US20070169855 Copper alloy  
Disclosed is a copper alloy. The copper alloy consists essentially of Cu : 69 to 88 mass %, Si : 2 to 5 mass %, Zr: 0.0005 to 0.04 mass %, P : 0.01 to 0.25 mass %, and Zn : balance; has relation...
US20100224292 Copper alloy material and a method for fabricating the same  
A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group...
US20100269959 COPPER ALLOY SHEET AND METHOD FOR PRODUCING SAME  
A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a...
US20110240180 Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component  
There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7,...
US20090165903 Material Having Ultrafine Grained Structure and Method of Fabricating Thereof  
In the present invention, there is provided a fabrication method of a material having an ultrafine grained structure characterized by including a step of providing a metal or an alloy having a...
US20100139822 Cu-Ti-based copper alloy sheet material and method of manufacturing same  
Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent...
US20140305551 COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF PREPARING THE SAME  
A copper alloy material for electrical and electronic components and a method of preparing the same are disclosed. In particular, a copper alloy material with excellent mechanical strength...
US20160160321 COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, PLASTICALLY WORKED COPPER ALLOY MATERIAL FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, AND COMPONENT AND TERMINAL FOR ELECTRONIC AND ELECTRICAL EQUIPMENT  
The present invention provides a copper alloy for electronic and electronic device which has excellent mechanical properties and is capable of suppressing generation of defects even in a case in...
US20160068940 ALLOY WITH SELECTED ELECTRICAL CONDUCTIVITY AND ATOMIC DISORDER, PROCESS FOR MAKING AND USING SAME  
A primary alloy includes: nickel; copper; zinc; an electrical conductivity from 5.2% International Annealed Copper Standard (IACS) to 5.6% IACS measured in accordance with ASTM E1004-09 (2009);...

Matches 1 - 28 out of 28