Matches 1 - 50 out of 205 1 2 3 4 5 >


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US20110048582 Ti-Based Brazing Filler Metal and Method for Producing the Same  
A Ti-based brazing filler material comprising in mixture a Zr-containing alloy powder comprising 30 to 90% by mass of one or two of Cu and Ni, the balance being Zr and unavoidable impurities and a...
US20150174704 VOC Exempt Brazing Binder System  
By blending a brazing alloy, preferably a Cu, P, Sn, and Ni alloy, with a binder system (and in some cases other blended alloys), the invention includes several superior brazing binder systems....
US20130008698 MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE  
A multilayer wiring board having via-hole conductors which electrically connects a plurality of wirings arranged in a manner such that an insulating resin layer is placed between the wirings,...
US20150239071 BRAZING COMPOSITION, HEAT EXCHANGER TUBE, AND HEAT EXCHANGER  
A brazing composition contains 1 part by mass or more and 10 parts by mass or less of Zn powder, 1 part by mass or more and 5 parts by mass or less of Si powder, 3 parts by mass or more and 10...
US20140130940 Solder Paste  
To provide solder paste that can be filled in minute apertures. The solder paste that is printed on a substrate through a mask member in which apertures are formed is supplied to the apertures of...
US20130160895 SOLDER PASTE FOR PASTING ELECTRONIC PART ON PRINTED CIRCUIT BOARD  
A solder paste includes alloy powder, conductive adhesive, and flux. The mass ratio of the alloy powder to the conductive adhesive is in the range of about 3:1 to 5:1. The mass ratio of the alloy...
US20140150929 COMPOSITION OF SOLID-CONTAINING PASTE  
Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between...
US20140285039 Solder, Aluminum Wire Body and Motor Using the Same  
An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a...
US20140175160 SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SURFACE MOUNT ASSEMBLY DEFECTS  
A composition including a solder flux including a rosin material have a property to maintain a less than 10 percent drop in tackiness from an initial tackiness value of 20 gf to 120 gf over a...
US20150053753 COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND JOINING METHOD  
The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity,...
US20140332116 SOLDER PASTE  
A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one...
US20120248176 SOLDER PASTES FOR PROVIDING IMPACT RESISTANT, MECHANICALLY STABLE SOLDER JOINTS  
A solder is provided that produces a more impact resistant solder joint that is usable in high-end applications. The solder joint has a strong interconnection that can perform all of the normal...
US20150059928 Flux and Solder Paste  
Provided is flux which is capable of suppressing increase in the viscosity of solder paste during its storage and is also capable of improving the fusibility of a solder alloy. In the flux which...
US20110180311 SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART  
A solder material with favorable mechanical properties and high corrosion resistance is provided. The solder material is not apt to be melted in a re-heating process after the soldering process is...
US20130186519 SOLDERING PASTE AND FLUX  
The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint...
US20110220247 FLUX COMPOSITION AND SOLDERING PASTE COMPOSITION  
Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in...
US20140227550 MAGNETIC NICKEL BASE TERNARY BRAZING MATERIAL AND METHOD OF APPLICATION  
A ternary magnetic braze alloy and method for applying the braze alloy in areas having limited access. The magnetic braze alloy is a nickel-based braze alloy from the perminvar region of the Ni,...
US20140174605 SOLDER POWDER, AND SOLDER PASTE USING SOLDER POWDER  
In solder powder having an average particle size of 5 μm or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an...
US20150030837 NOVEL BRAZING CONCEPT  
The present invention relates to an intermediate product for joining and coating by brazing comprising a base metal and a blend of boron and silicon, said base metal having a solidus temperature...
US20140263588 INTERCONNECT ALLOY MATERIAL AND METHODS  
A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other...
US20150209914 ANISOTROPIC CONDUCTIVE ADHESIVE  
An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device...
US20140079472 PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METHOD FOR APPLYING THE PASTE  
The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder...
US20120175020 LOW SILVER SOLDER ALLOY AND SOLDER PASTE COMPOSITION  
A low silver solder alloy of the present invention comprises 0.05-2.0% by mass of silver; 1.0% by mass or less of copper; 3.0% by mass or less of antimony; 2.0% by mass or less of bismuth; 4.0% by...
US20150258636 SOLDER ALLOY FOR LOW-TEMPERATURE PROCESSING  
A solder composition is provided comprising from about 5.5 to 7.0 percent by weight of bismuth, from about 2.0 to 2.5 percent by weight of silver, from about 0.5 to 0.7 percent by weight of...
US20090266446 NICKEL BRAZE ALLOY COMPOSITION  
A nickel braze alloy composition includes a blend of a first nickel alloy and a second nickel alloy. The first nickel alloy includes about 4.75 wt %-10.5 wt % of chromium, about 5.5 wt %-6.7 wt %...
US20150260316 System and Method for Producing Chemicals at High Temperature  
A system for producing chemicals, such as, ethylene or gasoline, at high temperature (above 1100 degrees C.) having a feedstock source. The system includes a chemical conversion portion connected...
US20130042946 SOLDER PASTE COMPOSITION, A SOLDER PASTE AND A SOLDERING FLUX  
The present invention relates to a solder paste composition, a solder paste and a soldering flux. The soldering flux comprises a resin, a thixotropic agent, an activator, a solvent as well as a...
US20130082093 Amine, Carboxylic Acid Flux Composition And Method Of Soldering  
A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical...
US20120018048 CREAM SOLDER AND METHOD OF SOLDERING ELECTRONIC PART  
A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery...
US20130323529 BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD  
There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a...
US20150021377 METHOD AND MACHINE FOR FORGE WELDING OF TUBULAR ARTICLES AND EXOTHERMIC FLUX MIXTURE AND METHOD OF MANUFACTURING AN EXOTHERMIC FLUX MIXTURE  
A method of forge welding includes placing at least two components for welding together, adjacent each other and with an exothermic flux mixture placed between the components. The exothermic flux...
US20140048587 BRAZING ALLOY AND PROCESSES FOR MAKING AND USING  
Disclosed is a brazing alloy composition. The composition comprises, by weight, about 94% copper, about 4% zinc, and about 2% iron. Further disclosed is a brazing process utilizing the brazing...
US20090050239 BRAZING FLUX POWDER FOR ALUMINUM-BASED MATERIAL AND PRODUCTION METHOD OF FLUX POWDER  
It is aimed at providing a brazing flux powder, which exhibits an excellent spreadability in case of brazing of an Mg-containing aluminum-based material, which is non-corrosive and is thus...
US20090297882 Brazing filler metal, brazing filler metal paste, and heat exchanger  
A brazing filler metal includes quaternary alloy powder and copper powder. The quaternary allow powder consists of from 0.1 to 27.4 mass percent tin, from 0.8 to 5.1 mass percent nickel, from 2.2...
US20140182746 DI- OR POLY-FUNCTIONAL ELECTRON DEFICIENT OLEFINS COATED METAL POWDERS FOR SOLDER PASTE  
The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as...
US20150027589 Solder Paste  
A solder paste which solves any nozzle clogging that suddenly occurs in a case of being used in a discharging method and which also realizes residue-free because flux is decomposed by heating...
US20110311832 FLUX AND SOLDER MATERIAL AND METHOD OF MAKING SAME  
A flux for use in soldering comprises a first constituent and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a...
US20150136461 SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD  
A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the...
US20120055586 VARIABLE MELTING POINT SOLDERS  
The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting...
US20140053954 FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITION  
The present invention is a flux for soldering, containing a base resin and an activating agent, in which the base resin contains a thermoplastic acrylic resin obtained by polymerizing a monomer...
US20150008022 CONDUCTIVE PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE  
Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the...
US20120003465 SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND  
A sintering material having metallic structural particles which are provided with an organic coating. Non-organically coated, metallic and/or ceramic auxiliary particles are provided that do not...
US20150027768 RESIN COMPOSITION FOR SOLDER BUMP FORMATION, SOLDER BUMP FORMATION METHOD, AND MEMBER HAVING SOLDER BUMPS  
The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the...
US20150028085 BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL IS USED  
The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling...
US20150183062 SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD  
A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the...
US20150246417 MIXED ALLOY SOLDER PASTE  
A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a...
US20150224602 MIXED ALLOY SOLDER PASTE  
A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux;...
US20110268985 MIXED ALLOY SOLDER PASTE  
A solder paste comprises an amount of a first solder alloy powder between about 60 wt % to about 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than about 12 wt %;...
US20120042990 ORGANIC ACID- OR LATENT ORGANIC ACID-FUNCTIONALIZED POLYMER-COATED METAL POWDERS FOR SOLDER PASTES  
The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys,...
US20130082094 POLYAMINE, CARBOXYLIC ACID FLUX COMPOSITION AND METHOD OF SOLDERING  
A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing...

Matches 1 - 50 out of 205 1 2 3 4 5 >