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US20060260642 |
Method and apparatus for wafer cleaning
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a... |
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US20060260644 |
Method and apparatus for wafer cleaning
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a... |
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US20060260643 |
Method and apparatus for wafer cleaning
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a... |
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US20080047582 |
Method and apparatus for wafer cleaning
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a... |
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US20100192974 |
METHOD FOR ULTRASONIC CLEANING OF CONTAMINATION ATTACHED TO A SURFACE OF AN OBJECT
An ultrasonic cleaning method in which ultrasonic cleaning of a contamination attached to a surface of an object to be cleaned is performed by directing toward the object to be cleaned, a cleaning... |
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US20080173327 |
TWO-FLUID NOZZLE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus has a two-fluid nozzle having an inner cylindrical member and an outer cylindrical member. Gas flows in the inner cylindrical member which is a gas passage and the... |
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US20070134821 |
CLUSTER TOOL FOR ADVANCED FRONT-END PROCESSING
Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results... |
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US20070123052 |
Process sequence for photoresist stripping and cleaning of photomasks for integrated circuit manufacturing
A method and system for cleaning and/or stripping photoresist from photomasks used in integrated circuit manufacturing comprising a process and means of introducing a mixture of sulfuric acid and... |
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US20150166942 |
CLEANING COMPOSITION FOR REMOVING ORGANIC MATERIAL AND METHOD OF FORMING SEMICONDUCTOR DEVICE USING THE COMPOSITION
Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition... |
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US20060213534 |
Integrated ashing and implant annealing method using ozone
After ion implantation, thermal ashing is performed using ozone at a pressure of between about 0.01 to about 1000 Torr at below 1000° C. to remove the resist. Since the process includes a... |
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US20060051966 |
In-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber
A method and apparatus for cleaning a processing chamber comprising blocking a flow of cooling fluid to a channel within a support member within a processing chamber, elevating the support member... |
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US20090139541 |
Gas dissolved water producing apparatus and method thereof and ultrasonic cleaning equipment and method thereof
A gas dissolved water producing apparatus includes a gas dissolving section, a gas channel for guiding a gas into the dissolving section, a first water channel for guiding water into the... |
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US20070095282 |
Apparatus for manufacturing semiconductor device with pump unit and method for cleaning the pump unit
An apparatus for manufacturing a semiconductor device includes a chamber and an exhaust system for exhausting byproducts from the chamber and adjusting an internal pressure of the chamber. The... |
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US20100258142 |
APPARATUS AND METHOD FOR USING A VISCOELASTIC CLEANING MATERIAL TO REMOVE PARTICLES ON A SUBSTRATE
The embodiments provide apparatus and methods for removing particles from a substrate surface, especially from a surface of a patterned substrate (or wafer). The cleaning apparatus and methods... |
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US20100294306 |
METHOD AND SOLUTION FOR CLEANING SEMICONDUCTOR DEVICE SUBSTRATE
Provided is a method for cleaning a semiconductor device substrate, which is excellent in removability and re-adhesion-preventing properties of contaminations of fine particles or organic matter,... |
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US20080289650 |
LOW-TEMPERATURE CLEANING OF NATIVE OXIDE
Disclosed herein is a method of cleaning oxide from a surface in the fabrication of an integrated device using reducing radicals and UV radiation. For silicon surfaces, the cleaning may be... |
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US20050121051 |
Method for cleaning substrate and apparatus therefor
A substrate cleaning method and an apparatus therefor capable of increasing a particle removal ratio at which particles firmly adhering to a substrate are removed therefrom and increasing a... |
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US20090277472 |
Photoresist Stripping Method and Apparatus
The present invention pertains to methods for removing unwanted material from a work piece. More specifically, the invention pertains to stripping photoresist material from, e.g., a semiconductor... |
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US20090014028 |
METHOD OF CLEANING SUBSTRATES AND SUBSTRATE CLEANER
There is provided a method of efficiently cleaning substrates without damaging a fine pattern formed thereon. It is a method of cleaning one or more substrates in a system processing one or more... |
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US20120012134 |
METHOD FOR CLEANING ELECTRONIC MATERIAL AND DEVICE FOR CLEANING ELECTRONIC MATERIAL
A resist on an electronic material is surely separated and removed in a short time. The electronic material is cleaned with a sulfuric acid solution containing persulfuric acid to separate and... |
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US20090056744 |
WAFER CLEANING COMPOSITIONS AND METHODS
Compositions and methods of removing debris including organic debris from a hydrophobic surface during semiconductor processing are disclosed. The method includes exposing a semiconductor wafer... |
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US20060207631 |
Apparatus and method of cleaning a sustrate
A cleaning apparatus is provided with a processing bath to be filled with a cleaning chemical, an ultrasonic oscillator, and a retainer for holding a substrate to be immersed into a cleaning... |
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US20060070979 |
Using ozone to process wafer like objects
The present invention relates to methods of processing wafer-like objects (e.g., having an exposed copper feature and/or including low-k dielectric material) with ozone. In certain preferred... |
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US20080295871 |
Chemical Supply System
A chemical supply system comprises, as principal elements, a chemical storage tank in which a liquid chemical for cleaning is stored in the state of its formulated concentrate, a chemical supply... |
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US20050098194 |
Semiconductor wafer immersion systems and treatments using modulated acoustic energy
Systems and methods in which one or more wafers are immersed in a sonified liquid during the course of a treatment wherein the sound energy imparted to the liquid is modulated during at least a... |
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US20090032056 |
CONTAMINANT REMOVING METHOD, CONTAMINANT REMOVING MECHANISM, AND VACUUM THIN FILM FORMATION PROCESSING APPARATUS
A contaminant removing method of this invention has a step of emitting, in a vacuum, a directional beam to at least one of the lower surface edge and circumferential surface of a substrate to be... |
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US20070186953 |
Systems and Methods for Photoresist Strip and Residue Treatment in Integrated Circuit Manufacturing
Plasma systems and methods for supplying activation energy to remove cross-linked photoresist crust using ion bombardment of the substrate from a plasma, at reduced temperature, achieved in part... |
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US20070012337 |
IN-LINE METROLOGY FOR SUPERCRITICAL FLUID PROCESSING
The system includes a metrology module coupled to a supercritical processing chamber, and the method includes positioning a substrate on a substrate holder in a metrology chamber, measuring a... |
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US20140102474 |
SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM
A substrate cleaning apparatus for cleaning a substrate back surface includes a first substrate supporting portion supporting the substrate at a first area of the substrate back surface, the back... |
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US20070119476 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate held by a spin chuck is supplied with a chemical solution by a chemical solution nozzle and a processing of the substrate is performed. At this time, the chemical solution supplied to... |
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US20160133486 |
Double Layer Release Temporary Bond and Debond Processes and Systems
A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release... |
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US20090065027 |
SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND SUBSTRATE TREATMENT APPARATUS
A substrate cleaning apparatus is capable of cleaning an entire periphery of a substrate end portion at a time by simple control without polishing the end portion and without generating plasma.... |
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US20050109369 |
Method to use a laser to perform the edge clean operation on a semiconductor wafer
A method for performing the edge clean operation on a semiconductor wafer. A laser beam is used to accurately clean the edge of the wafer. The wafer is clamped concentrically to a chuck and... |
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US20090320875 |
DUAL CHAMBER MEGASONIC CLEANER
Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In... |
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US20050178401 |
Method and apparatus for treating a substrate with an ozone-solvent solution III
A general method and apparatus for treating materials at high speed comprises the steps of dissolving a relatively high concentration ozone gas in a solvent at a relatively low predetermined... |
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US20060021634 |
Method and apparatus for creating ozonated process solutions having high ozone concentration
A method and system for creating an ozonated process solution, such as ozonated deionized water, having high ozone concentration. The system comprises, a static mixer coupled to a recirculation... |
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US20130312789 |
ULTRASONIC CLEANING METHOD AND ULTRASONIC CLEANING APPARATUS
An ultrasonic cleaning method for cleaning an object in a liquid in which a gas is dissolved includes preparing the liquid in which the gas is dissolved and cleaning the object while irradiating... |
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US20080292877 |
Method of Cleaning Gaas Substrate, Method of Producing Gaas Substrate, Method of Fabricating Epitaxial Susbstrate, and Gaas Wafer
The present invention provides a method of cleaning a GaAs substrate with less precipitate particles after cleaning. This cleaning method comprises an acid cleaning step (S11), a deionized water... |
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US20070018284 |
Gallium nitride semiconductor substrate and process for producing the same
When a nitride semiconductor monocrystalline wafer is polished, a process-transformed layer is produced. Etching is required in order to remove the process-transformed layer. Being that nitride... |
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US20140174466 |
AUTOMATIC SOLAR POWER SURFACE-CLEANER
Various embodiments herein include at least one of systems, methods, and software to facilitate automatic solar power surface-cleaning Such embodiments include at least one automatic solar power... |
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US20090095321 |
METHOD FOR CLEANING SILICON WAFER
A method for cleaning a silicon wafer includes (S11) cleaning surfaces of a silicon wafer using an SC-1 cleaning solution according to standard clean 1; (S12) rinsing the surfaces of the silicon... |
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US20060289034 |
Compositions containing free radical quenchers
The invention relates to a method of cleaning the surface of a substrate to remove post-etch residue or post chemical mechanical polishing residues from the surface of a substrate. Specifically,... |
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US20110230054 |
SEMICONDUCTOR SUBSTRATE CLEANING METHOD
In one embodiment, a semiconductor substrate cleaning method is disclosed. The method can clean a semiconductor substrate by using a chemical of 80° C. or above. The method can rinse the... |
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US20080245390 |
Method for cleaning semiconductor wafer surfaces by applying periodic shear stress to the cleaning solution
Systems and methods for cleaning particulate contaminants adhered to wafer surfaces are provided. A cleaning media including dispersed coupling elements suspended within the cleaning media is... |
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US20050145264 |
Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display
An ultrasonic-wave washing unit comprising an ultrasonic-wave vibrating plate to which an ultrasonic-wave vibrator is fixed by adhesive bonding, an ultrasonic-wave transmission plate opposed to... |
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US20130312788 |
ULTRASONIC CLEANING METHOD AND ULTRASONIC CLEANING APPARATUS
An ultrasonic cleaning method for cleaning an object in a liquid in which a first gas is dissolved includes preparing the liquid in which the first gas is dissolved and introducing a second gas... |
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US20090020137 |
CLEANING APPARATUS AND METHOD, EXPOSURE APPARATUS HAVING THE CLEANING APPARATUS, AND DEVICE MANUFACTURING METHOD
A cleaning apparatus includes an irradiation unit configured to irradiate onto a substrate a laser beam having a pulse width of a picosecond-level or femtosecond-level range, and to clean the... |
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US20080223399 |
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM
A substrate processing apparatus includes: a mounting table to have the substrate placed thereon in a process chamber; a first temperature adjusting mechanism temperature-adjusting the substrate... |
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US20050087209 |
Megasonic processing system with gasified fluid
An apparatus and method for substrate processing, specifically including cleaning and/or photoresist stripping, in non-immersion type megasonic processing tools. In one embodiment, the invention... |
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US20150083160 |
ULTRASONIC CLEANING DEVICE
An ultrasonic cleaning device including an ultrasonic transducer (13) for providing ultrasonic energy to a propagation liquid (15), an ultrasonic propagation tube (12) for flowing the propagation... |