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US20060260642 Method and apparatus for wafer cleaning  
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a...
US20060260644 Method and apparatus for wafer cleaning  
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a...
US20060260643 Method and apparatus for wafer cleaning  
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a...
US20080047582 Method and apparatus for wafer cleaning  
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a...
US20100192974 METHOD FOR ULTRASONIC CLEANING OF CONTAMINATION ATTACHED TO A SURFACE OF AN OBJECT  
An ultrasonic cleaning method in which ultrasonic cleaning of a contamination attached to a surface of an object to be cleaned is performed by directing toward the object to be cleaned, a cleaning...
US20080173327 TWO-FLUID NOZZLE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD  
A substrate processing apparatus has a two-fluid nozzle having an inner cylindrical member and an outer cylindrical member. Gas flows in the inner cylindrical member which is a gas passage and the...
US20070134821 CLUSTER TOOL FOR ADVANCED FRONT-END PROCESSING  
Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results...
US20070123052 Process sequence for photoresist stripping and cleaning of photomasks for integrated circuit manufacturing  
A method and system for cleaning and/or stripping photoresist from photomasks used in integrated circuit manufacturing comprising a process and means of introducing a mixture of sulfuric acid and...
US20150166942 CLEANING COMPOSITION FOR REMOVING ORGANIC MATERIAL AND METHOD OF FORMING SEMICONDUCTOR DEVICE USING THE COMPOSITION  
Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition...
US20060213534 Integrated ashing and implant annealing method using ozone  
After ion implantation, thermal ashing is performed using ozone at a pressure of between about 0.01 to about 1000 Torr at below 1000° C. to remove the resist. Since the process includes a...
US20060051966 In-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber  
A method and apparatus for cleaning a processing chamber comprising blocking a flow of cooling fluid to a channel within a support member within a processing chamber, elevating the support member...
US20090139541 Gas dissolved water producing apparatus and method thereof and ultrasonic cleaning equipment and method thereof  
A gas dissolved water producing apparatus includes a gas dissolving section, a gas channel for guiding a gas into the dissolving section, a first water channel for guiding water into the...
US20070095282 Apparatus for manufacturing semiconductor device with pump unit and method for cleaning the pump unit  
An apparatus for manufacturing a semiconductor device includes a chamber and an exhaust system for exhausting byproducts from the chamber and adjusting an internal pressure of the chamber. The...
US20100258142 APPARATUS AND METHOD FOR USING A VISCOELASTIC CLEANING MATERIAL TO REMOVE PARTICLES ON A SUBSTRATE  
The embodiments provide apparatus and methods for removing particles from a substrate surface, especially from a surface of a patterned substrate (or wafer). The cleaning apparatus and methods...
US20100294306 METHOD AND SOLUTION FOR CLEANING SEMICONDUCTOR DEVICE SUBSTRATE  
Provided is a method for cleaning a semiconductor device substrate, which is excellent in removability and re-adhesion-preventing properties of contaminations of fine particles or organic matter,...
US20080289650 LOW-TEMPERATURE CLEANING OF NATIVE OXIDE  
Disclosed herein is a method of cleaning oxide from a surface in the fabrication of an integrated device using reducing radicals and UV radiation. For silicon surfaces, the cleaning may be...
US20050121051 Method for cleaning substrate and apparatus therefor  
A substrate cleaning method and an apparatus therefor capable of increasing a particle removal ratio at which particles firmly adhering to a substrate are removed therefrom and increasing a...
US20090277472 Photoresist Stripping Method and Apparatus  
The present invention pertains to methods for removing unwanted material from a work piece. More specifically, the invention pertains to stripping photoresist material from, e.g., a semiconductor...
US20090014028 METHOD OF CLEANING SUBSTRATES AND SUBSTRATE CLEANER  
There is provided a method of efficiently cleaning substrates without damaging a fine pattern formed thereon. It is a method of cleaning one or more substrates in a system processing one or more...
US20120012134 METHOD FOR CLEANING ELECTRONIC MATERIAL AND DEVICE FOR CLEANING ELECTRONIC MATERIAL  
A resist on an electronic material is surely separated and removed in a short time. The electronic material is cleaned with a sulfuric acid solution containing persulfuric acid to separate and...
US20090056744 WAFER CLEANING COMPOSITIONS AND METHODS  
Compositions and methods of removing debris including organic debris from a hydrophobic surface during semiconductor processing are disclosed. The method includes exposing a semiconductor wafer...
US20060207631 Apparatus and method of cleaning a sustrate  
A cleaning apparatus is provided with a processing bath to be filled with a cleaning chemical, an ultrasonic oscillator, and a retainer for holding a substrate to be immersed into a cleaning...
US20060070979 Using ozone to process wafer like objects  
The present invention relates to methods of processing wafer-like objects (e.g., having an exposed copper feature and/or including low-k dielectric material) with ozone. In certain preferred...
US20080295871 Chemical Supply System  
A chemical supply system comprises, as principal elements, a chemical storage tank in which a liquid chemical for cleaning is stored in the state of its formulated concentrate, a chemical supply...
US20050098194 Semiconductor wafer immersion systems and treatments using modulated acoustic energy  
Systems and methods in which one or more wafers are immersed in a sonified liquid during the course of a treatment wherein the sound energy imparted to the liquid is modulated during at least a...
US20090032056 CONTAMINANT REMOVING METHOD, CONTAMINANT REMOVING MECHANISM, AND VACUUM THIN FILM FORMATION PROCESSING APPARATUS  
A contaminant removing method of this invention has a step of emitting, in a vacuum, a directional beam to at least one of the lower surface edge and circumferential surface of a substrate to be...
US20070186953 Systems and Methods for Photoresist Strip and Residue Treatment in Integrated Circuit Manufacturing  
Plasma systems and methods for supplying activation energy to remove cross-linked photoresist crust using ion bombardment of the substrate from a plasma, at reduced temperature, achieved in part...
US20070012337 IN-LINE METROLOGY FOR SUPERCRITICAL FLUID PROCESSING  
The system includes a metrology module coupled to a supercritical processing chamber, and the method includes positioning a substrate on a substrate holder in a metrology chamber, measuring a...
US20140102474 SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM  
A substrate cleaning apparatus for cleaning a substrate back surface includes a first substrate supporting portion supporting the substrate at a first area of the substrate back surface, the back...
US20070119476 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD  
A substrate held by a spin chuck is supplied with a chemical solution by a chemical solution nozzle and a processing of the substrate is performed. At this time, the chemical solution supplied to...
US20160133486 Double Layer Release Temporary Bond and Debond Processes and Systems  
A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release...
US20090065027 SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND SUBSTRATE TREATMENT APPARATUS  
A substrate cleaning apparatus is capable of cleaning an entire periphery of a substrate end portion at a time by simple control without polishing the end portion and without generating plasma....
US20050109369 Method to use a laser to perform the edge clean operation on a semiconductor wafer  
A method for performing the edge clean operation on a semiconductor wafer. A laser beam is used to accurately clean the edge of the wafer. The wafer is clamped concentrically to a chuck and...
US20090320875 DUAL CHAMBER MEGASONIC CLEANER  
Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In...
US20050178401 Method and apparatus for treating a substrate with an ozone-solvent solution III  
A general method and apparatus for treating materials at high speed comprises the steps of dissolving a relatively high concentration ozone gas in a solvent at a relatively low predetermined...
US20060021634 Method and apparatus for creating ozonated process solutions having high ozone concentration  
A method and system for creating an ozonated process solution, such as ozonated deionized water, having high ozone concentration. The system comprises, a static mixer coupled to a recirculation...
US20130312789 ULTRASONIC CLEANING METHOD AND ULTRASONIC CLEANING APPARATUS  
An ultrasonic cleaning method for cleaning an object in a liquid in which a gas is dissolved includes preparing the liquid in which the gas is dissolved and cleaning the object while irradiating...
US20080292877 Method of Cleaning Gaas Substrate, Method of Producing Gaas Substrate, Method of Fabricating Epitaxial Susbstrate, and Gaas Wafer  
The present invention provides a method of cleaning a GaAs substrate with less precipitate particles after cleaning. This cleaning method comprises an acid cleaning step (S11), a deionized water...
US20070018284 Gallium nitride semiconductor substrate and process for producing the same  
When a nitride semiconductor monocrystalline wafer is polished, a process-transformed layer is produced. Etching is required in order to remove the process-transformed layer. Being that nitride...
US20140174466 AUTOMATIC SOLAR POWER SURFACE-CLEANER  
Various embodiments herein include at least one of systems, methods, and software to facilitate automatic solar power surface-cleaning Such embodiments include at least one automatic solar power...
US20090095321 METHOD FOR CLEANING SILICON WAFER  
A method for cleaning a silicon wafer includes (S11) cleaning surfaces of a silicon wafer using an SC-1 cleaning solution according to standard clean 1; (S12) rinsing the surfaces of the silicon...
US20060289034 Compositions containing free radical quenchers  
The invention relates to a method of cleaning the surface of a substrate to remove post-etch residue or post chemical mechanical polishing residues from the surface of a substrate. Specifically,...
US20110230054 SEMICONDUCTOR SUBSTRATE CLEANING METHOD  
In one embodiment, a semiconductor substrate cleaning method is disclosed. The method can clean a semiconductor substrate by using a chemical of 80° C. or above. The method can rinse the...
US20080245390 Method for cleaning semiconductor wafer surfaces by applying periodic shear stress to the cleaning solution  
Systems and methods for cleaning particulate contaminants adhered to wafer surfaces are provided. A cleaning media including dispersed coupling elements suspended within the cleaning media is...
US20050145264 Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display  
An ultrasonic-wave washing unit comprising an ultrasonic-wave vibrating plate to which an ultrasonic-wave vibrator is fixed by adhesive bonding, an ultrasonic-wave transmission plate opposed to...
US20130312788 ULTRASONIC CLEANING METHOD AND ULTRASONIC CLEANING APPARATUS  
An ultrasonic cleaning method for cleaning an object in a liquid in which a first gas is dissolved includes preparing the liquid in which the first gas is dissolved and introducing a second gas...
US20090020137 CLEANING APPARATUS AND METHOD, EXPOSURE APPARATUS HAVING THE CLEANING APPARATUS, AND DEVICE MANUFACTURING METHOD  
A cleaning apparatus includes an irradiation unit configured to irradiate onto a substrate a laser beam having a pulse width of a picosecond-level or femtosecond-level range, and to clean the...
US20080223399 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM  
A substrate processing apparatus includes: a mounting table to have the substrate placed thereon in a process chamber; a first temperature adjusting mechanism temperature-adjusting the substrate...
US20050087209 Megasonic processing system with gasified fluid  
An apparatus and method for substrate processing, specifically including cleaning and/or photoresist stripping, in non-immersion type megasonic processing tools. In one embodiment, the invention...
US20150083160 ULTRASONIC CLEANING DEVICE  
An ultrasonic cleaning device including an ultrasonic transducer (13) for providing ultrasonic energy to a propagation liquid (15), an ultrasonic propagation tube (12) for flowing the propagation...
Matches 1 - 50 out of 106 1 2 3 >