Matches 1 - 18 out of 18


Match Document Document Title
US20150202700 METHOD OF CUTTING HIGH-HARDNESS MATERIAL WITH MULTI-WIRE SAW  
In a method of cutting a high-hardness material with a multi-wire saw, an ingot of the high-hardness material is sliced into a plurality of wafers by cutting the ingot at multiple points...
US20080257329 Multiware Sawing Machine For The Cutting Of Material In Block Form  
The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support...
US20120024761 METHODS TO SLICE A SILICON INGOT  
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal...
US20110088678 METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW  
The present invention is a method for resuming operation of a wire saw comprising the steps of: slicing the workpiece while measuring and recording a displacement amount in an axial direction of...
US20070178807 Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control  
A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures...
US20100197202 Method and Product for Cutting Materials  
The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron...
US20100163462 METHODS TO RECOVER AND PURIFY SILICON PARTICLES FROM SAW KERF  
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal...
US20100163009 MULTI-WIRE SAW AND METHOD FOR CUTTING INGOT  
To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a...
US20090061740 METHOD FOR MANUFACTURING SILICONE WAFERS  
A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon...
US20100038456 METHOD AND SYSTEM FOR SEPARATING A MULTIPLICITY OF CERAMIC COMPONENTS FROM A COMPONENT BLOCK  
In a method for detaching a plurality of ceramic components (11-15) from a ceramic component block (1), the following steps are provided: providing the component block (1); mounting a plurality of...
US20100252017 METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW  
The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a...
US20100180879 BLOCK-CUTTING GANGSAW FOR CUTTING GRANITE OR OTHER HARD MATERIALS, AND CORRESPONDING CUTTING METHOD  
Block-cutting gangsaw with vertical frame for cutting granite or other hard materials, comprising a blade-holding frame (19) that is supported with the possibility of reciprocating movement on an...
US20110192388 METHOD FOR SLICING A MULTIPLICITY OF WAFERS FROM A CRYSTAL COMPOSED OF SEMICONDUCTOR MATERIAL  
A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The...
US20110083655 MOUNTING PLATE FOR A WIRE SAWING DEVICE, WIRE SAWING DEVICE COMPRISING THE SAME, AND WIRE SAWING PROCESS CARRIED OUT BY THE DEVICE  
The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage...
US20090064982 WORKPIECE MOUNTING AND METHOD FOR WIRE SAWING  
A method and a device for cutting a workpiece in a wire saw is described, wherein a workpiece is fixed in a wire saw by means of a mounting beam. In the method according to the invention, the...
US20160107334 STONE CUTTING DEVICE  
A stone cutting device configured to cut a workpiece with a plurality of cutting tools by swinging the cutting tools within a predetermined angle range. Each of the cutting tools includes: a blade...
US20160082619 CUTTING TOOL AND CUTTING APPARATUS COMPRISING SAME  
A cutting tool and a cutting apparatus including a cutting tool. The cutting tool includes: a blade extending and reciprocating in a length direction of a workpiece for cutting the workpiece; at...
US20140326229 METHOD AND APPARATUS FOR PREPARING CERAMIC BODY SEGMENTS  
A method including providing a ceramic log (300) with a first end and an opposing second end; providing one or more cutting devices (100) comprised of a dual bladed cutting member (200); and...

Matches 1 - 18 out of 18