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US20130129937 Vapor Deposition of Ceramic Coatings  
An apparatus for applying a coating to a substrate comprises a deposition chamber. A crucible may hold a melt pool of coating material. The melt pool is rotated during deposition.
US20120100307 Shower Plate Having Different Aperture Dimensions and/or Distributions  
A shower plate is adapted to be attached to the showerhead and includes a front surface adapted to face the susceptor; and a rear surface opposite to the front surface. The shower plate has...
US20110171390 FIXTURE FOR COATING APPLICATION  
A fixture assembly for use with air plasma spraying coating application processes includes a support member configured to be rotationally indexed, a first buttress, and a second buttress. The...
US20120268845 WRITE POLE AND SHIELD WITH DIFFERENT TAPER ANGLES  
A first trench sidewall has a continuous first taper angle that terminates at a first plane. At least one layer may be deposited that forms a second trench sidewall with a continuous second taper...
US20120304934 POROUS CERAMIC GAS DISTRIBUTION FOR PLASMA SOURCE ANTENNA  
Apparatus and methods for preventing or substantially minimizing unwanted deposits on dielectric covers of an antenna by effectively providing an inert (non-depositing) gas at the surface of the...
US20110147345 PLASMA STAMP, PLASMA TREATMENT DEVICE, METHOD FOR PLASMA TREATMENT AND METHOD FOR PRODUCING A PLASMA STAMP  
The invention relates to a plasma stamp, with which surfaces can be subjected to a plasma treatment. In addition, the invention relates to a plasma treatment device, with which surfaces can be...
US20140299059 VAPOR DELIVERY SYSTEM  
Vapor delivery systems for chemical depositions are shown in which the vapor delivery systems are capable of simultaneous buffering and fast response. The vapor delivery systems achieved the...
US20120217874 Plasma Source with Vertical Gradient  
A plasma source includes upper and lower portions. In a first aspect, an electrical power source supplies greater power to the upper portion than to the lower portion. In a second aspect, the...
US20100323124 SEALED PLASMA COATINGS  
A processing device includes a plurality of walls defining an interior space configured to be exposed to plasma and a surface coating on the interior surface of at least one of the plurality of...
US20110005680 TUNABLE GAS FLOW EQUALIZER  
A tunable gas flow equalizer is described. In an embodiment, the tunable flow equalizer includes a gas flow equalizer plate having primary opening and a secondary opening. The primary opening may...
US20140087085 METHOD AND DEVICE FOR COATING A FLOAT GLASS STRIP  
A method for coating a float glass strip following its production process, the float glass strip being transported out of a float glass bath by a conveyor device in which the float glass strip...
US20140174361 HEATED BACKING PLATE  
The present invention generally relates to a heated backing plate coupled to a gas distribution showerhead in a PECVD chamber. The backing plate is heated by circulating a heating fluid either...
US20050202173 Diamond synthesis  
The present invention relates to a cell, system, and methods to form diamond from carbon in a plasma formed or assisted by the catalysis of atomic hydrogen to lower energy states.
US20120171845 CHUCK FOR CHEMICAL VAPOR DEPOSITION SYSTEMS AND RELATED METHODS THEREFOR  
The present invention provides chucks having a well that supports rods produced during chemical vapor deposition. The chucks can utilize slats and windows around the well up to which the rod can...
US20140248443 SCREEN STENCIL AND METHOD FOR COATING SCREEN STENCILS  
A stencil body of a screen stencil body has a surface coating made up of hydrocarbon-based, organic precursor molecules. A plasma-coating method is used to coat the screen stencil, wherein a layer...
US20150200109 MASK PASSIVATION USING PLASMA  
A gas comprising hydrogen is supplied to a plasma source. Plasma comprising hydrogen plasma particles is generated from the gas. A passivation layer is deposited on a first mask layer on a second...
US20120325148 Method for Positioning Wafers in Multiple Wafer Transport  
A method for positioning wafers in dual wafer transport, includes: simultaneously moving first and second wafers placed on first and second end-effectors to positions over lift pins protruding...
US20110070370 THERMAL GRADIENT ENHANCED CHEMICAL VAPOUR DEPOSITION (TGE-CVD)  
A chemical vapor deposition (CVD) apparatus is configured for thermal gradient enhanced CVD operation by the inclusion of multiple heaters, positioned so as to provide a desired thermal gradient...
US20060182883 Abrasion resistant coatings with color component for gemstones and such  
In accordance with the present invention, there are provided methods for imparting abrasion wear resistant color to “gemstones” by providing an integrated coating consisting of the color imparting...
US20140179114 RADICAL SOURCE DESIGN FOR REMOTE PLASMA ATOMIC LAYER DEPOSITION  
A radical source for supplying radicals during atomic layer deposition semiconductor processing operations is provided. The radical source may include a remote volume, a baffle volume, and a...
US20110223317 DIRECT THERMAL STABILIZATION FOR COATING APPLICATION  
A coating system includes a first work piece, a work piece support for holding the first work piece, a plasma-based coating delivery apparatus configured to apply a coating material to the first...
US20120199070 FILTER FOR ARC SOURCE  
An arc source filter is disposed between an arc cathode and a substrate in a vacuum arc deposition system. The filter includes a plurality of duct elements that surround the arc source. The duct...
US20140248472 SAPPHIRE PROPERTY MODIFICATION THROUGH ION IMPLANTATION  
Systems and methods for strengthening a sapphire part are described herein. One method may take the form of orienting a first surface of a sapphire member relative to an ion implantation device,...
US20150064340 FIXED AND PORTABLE COATING APPARATUSES AND METHODS  
A system and method for depositing a coating may comprise a coating chemical reactor, surface activation component, and a deposition component. A target surface may be prepared for deposition with...
US20120118232 Hydrogen COGas For Carbon Implant  
A system, apparatus and method for increasing ion source lifetime in an ion implanter are provided. Oxidation of the ion source and ion source chamber poisoning resulting from a carbon and...
US20110297319 Reduction of Copper or Trace Metal Contaminants in Plasma Electrolytic Oxidation Coatings  
A method for creating an oxide layer having a reduced copper concentration over a surface of an object comprising aluminum and copper for use in a semiconductor processing system. The oxide layer...
US20150027497 METHOD OF CLEANING A TORCH OF A PLASMA-COATING PLANT AND A PLASMA-COATING PLANT  
The invention provides for a system and method of cleaning a plasma coating torch, wherein the method comprises subjecting a plasma coating torch to a cleaning agent in order to removed spray...
US20130014898 PLASMA BREAKERS AND METHODS THEREFOR  
A plasma processing system comprising of a plasma source having a source enclosure for generating plasma is provided. The plasma processing system also includes a plasma breaker disposed inside...
US20110250763 PLASMA OXIDATION METHOD AND PLASMA OXIDATION APPARATUS  
A plasma oxidation method includes the steps of: generating oxygen-containing plasma with a process gas containing oxygen; applying a bias voltage to a substrate placed on a stage; and radiating...
US20110000433 PLASMA, UV AND ION/NEUTRAL ASSISTED ALD OR CVD IN A BATCH TOOL  
A batch processing chamber includes a chamber housing, a substrate boat for containing a batch of substrates in a process region, and an excitation assembly for exciting species of a processing...
US20130112337 SHOWER PLATE, MANUFACTURING METHOD OF THE SHOWER PLATE, AND PLASMA PROCESSING APPARATUS USING THE SHOWER PLATE  
A manufacturing method of a shower plate includes inserting a green body, a degreasing body, a temporary sintered body or a sintered body of a ceramic member, which has a plurality of gas...
US20110151590 APPARATUS AND METHOD FOR LOW-K DIELECTRIC REPAIR  
A method, a system and a computer readable medium for integrated in-vacuo repair of low-k dielectric thin films damaged by etch and/or strip processing. A repair chamber is integrated onto a same...
US20080011231 Applicator for use in semiconductor manufacturing apparatus  
An applicator for use in a semiconductor manufacturing apparatus is provided, which makes it possible to reuse a relatively expensive copper pipe coil component of such an apparatus by providing a...
US20140090598 ISOTOPICALLY-ENRICHED BORON-CONTAINING COMPOUNDS, AND METHODS OF MAKING AND USING SAME  
An isotopically-enriched, boron-containing compound comprising two or more boron atoms and at least one fluorine atom, wherein at least one of the boron atoms contains a desired isotope of boron...
US20100181024 DIFFUSER SUPPORT  
Embodiments of gas distribution apparatus comprise a diffuser support member coupled to a diffuser and movably disposed through a backing plate. Embodiments of methods of processing a substrate on...
US20140170053 LOW FRICTION COATING LAYER, LOW FRICTION COATING METHOD AND LOW FRICTION COATING APPARATUS  
Disclosed herein is a low friction coating layer wherein the uniform concentration of a low friction metal in the coating layer is increased by increasing a turning-on power of a low friction...
US20110253048 WAFER HOLDER AND METHOD OF HOLDING A WAFER  
A wafer holder including a wafer stage and a wafer stage outer-ring surrounding the wafer stage wherein the wafer stage has a diameter smaller than the diameter of a wafer loaded on the wafer...
US20100323508 PLASMA GRID IMPLANT SYSTEM FOR USE IN SOLAR CELL FABRICATIONS  
A method of ion implantation comprising: providing a plasma within a plasma region of a chamber; positively biasing a first grid plate, wherein the first grid plate comprises a plurality of...
US20120114871 Method And Apparatus For Producing An Ionized Vapor Deposition Coating  
A vapor deposition coating system including a metal vapor source, a power supply coupled to the metal vapor source, at least one thermionic ionizing grid including one or more thermionic...
US20110088846 PLASMA SOURCE  
A plasma source is disclosed. The plasma source includes: a disc-shaped core; “m” number of hubs, “m” being a positive integer, each hub extending a certain length in a horizontal spiral from the...
US20070181065 ETCH RESISTANT HEATER AND ASSEMBLY THEREOF  
An etch resistant heater for use in a wafer processing assembly with an excellent ramp rate of at least 20° C. per minute. The heater is coated with a protective overcoating layer allowing the...
US20150041062 PLASMA PROCESSING CHAMBER WITH REMOVABLE BODY  
An apparatus for plasma processing a wafer is provided. A bottom plate is provided. A tubular chamber wall with a wafer aperture is adjacent to the bottom plate. A bottom removable seal provides a...
US20110185972 BALANCING RF BRIDGE ASSEMBLY  
Embodiments disclosed herein generally relate to a PECVD apparatus. When the RF power source is coupled to the electrode at multiple locations, the current and voltage may be different at the...
US20090047427 Ultrahigh vacuum process for the deposition of nanotubes and nanowires  
A system and method A method of growing an elongate nanoelement from a growth surface includes: a) cleaning a growth surface on a base element;b) providing an ultrahigh vacuum reaction environment...
US20090053882 KRYPTON SPUTTERING OF THIN TUNGSTEN LAYER FOR INTEGRATED CIRCUITS  
A method of depositing a bilayer of tungsten over tungsten nitride by a plasma sputtering process in which krypton is used as the sputter working gas during the tungsten deposition. Argon may be...
US20140165912 APPARATUS FOR PROVIDING PLASMA TO A PROCESS CHAMBER  
Apparatus for providing plasma to a process chamber may include an electrode; a first ground plate disposed beneath the electrode defining a cavity therebetween; an insulator disposed between the...
US20140127912 PLASMA PROCESS ETCH-TO-DEPOSITION RATIO MODULATION VIA GROUND SURFACE DESIGN  
Plasma deposition in which properties of a discharge plasma are controlled by modifying the grounding path of the plasma is potentially applicable in any plasma deposition environment, but finds...
US20140144382 PLASMA APPARATUS  
A plasma apparatus including a chamber, an electrode set and a gas supplying tube set is provided. The chamber has a supporting table. The gas supplying tube set is disposed in the chamber and...
US20140283747 PLASMA PROCESSING APPARATUS AND SHOWER PLATE  
A plasma processing apparatus including a processing vessel 10 in which a plasma process is performed and a plasma generation antenna 20 having a shower plate 100 which supplies a first gas and a...
US20110027457 VAPOUR DELIVERY SYSTEM  
A delivery system (10) for delivering species (12) to a processing (chamber 14) comprises a species container (16) for containing species supplied from a source (18) of liquid species. Heating...