Title:
HEAT DISSIPATION MODULE AND BASE AND MANUFACTURING METHOD THEREOF
Kind Code:
A1


Abstract:
The present invention provides a heat dissipation module, a base thereof and a manufacturing method thereof. The heat dissipation module includes the base having a bottom, a plurality of guiding columns and a plurality of fins. The bottom and the guiding columns are formed as a single piece, and the fins are tightly fitted on the guiding columns.



Inventors:
Chen, Chin-ming (Taoyuan Hsien, TW)
Huang, Yu-hung (Taoyuan Hsien, TW)
Hung, Chun-yang (Taoyuan Hsien, TW)
HO, Sung-ching (Taoyuan Hsien, TW)
Application Number:
12/204332
Publication Date:
04/30/2009
Filing Date:
09/04/2008
Primary Class:
Other Classes:
165/185, 29/890.03
International Classes:
F28F7/00; B21D53/02
View Patent Images:



Primary Examiner:
DUONG, THO V
Attorney, Agent or Firm:
Muncy, Geissler, Olds & Lowe, P.C. (4000 Legato Road Suite 310, Fairfax, VA, 22033, US)
Claims:
What is claimed is:

1. A heat dissipation module, comprising: a base comprising a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece; and at least one fin tightly fitted with the guiding column.

2. The heat dissipation module as claimed in claim 1, wherein the bottom and the guiding column are formed by extrusion and crosscutting.

3. The heat dissipation module as claimed in claim 1, wherein the guiding column has a cross section with a rectangular or polygonal shape.

4. The heat dissipation module as claimed in claim 1, wherein the guiding column comprises a guiding angle located on a top of the guiding column.

5. The heat dissipation module as claimed in claim 1, wherein the fin comprises aluminum, copper or other high thermo-conductive materials, and the fin is formed by punching or extrusion.

6. The heat dissipation module as claimed in claim 1, wherein when the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other, and/or the fins are stacked on the bottom of the base in parallel.

7. The heat dissipation module as claimed in claim 1, wherein the fin comprises at least one through hole for allowing the guiding column to be penetrated and mounted thereon.

8. The heat dissipation module as claimed in claim 7, wherein a protrusion is formed on a periphery of each through hole for increasing contact areas between the fin and the guiding column.

9. The heat dissipation module as claimed in claim 8, wherein when the fin is plural and an upper fin is stacked on a lower adjacent fin, a distance between the lower fin and the upper fin is greater than or equal to a height of the protrusion of the lower fin.

10. The heat dissipation module as claimed in claim 1, wherein when the fin is plural, the sum of a height of the stacked fins is less than or equal to a height of the guiding column.

11. The heat dissipation module as claimed in claim 1, wherein when the guiding column and the fin are plural, the heights of the some guiding columns are different, and the shapes of the some fins are different.

12. A heat dissipating base, comprising: a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece.

13. The heat dissipating base as claimed in claim 12, wherein the bottom and the guiding column are formed by extrusion and crosscutting, and the guiding column comprises a guiding angle located on a top of the guiding column.

14. The heat dissipating base as claimed in claim 12, wherein the guiding column has a cross section with a rectangular or polygonal shape.

15. A manufacturing method of a heat dissipation module, comprising steps of: integrally forming a base wherein the base comprises a bottom and at least one guiding column disposed on the bottom; and tightly fitting at least one fin with the guiding column.

16. The method as claimed in claim 15, wherein the bottom and the guiding column are formed by extrusion and further performing a crosscutting step to form the bottom and the guiding column.

17. The method as claimed in claim 15, wherein a guiding angle is formed on a top of the guiding column of the base.

18. The method as claimed in claim 15, wherein the fin comprises aluminum, copper or other high thermo-conductive materials, and the fin is formed by punching or extrusion.

19. The method as claimed in claim 15, wherein when the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other, or the fins are stacked on the bottom of the base in parallel.

20. The method as claimed in claim 15, wherein the fin comprises at least one through hole for allowing the guiding column to be penetrated and mounted thereon, and a protrusion is formed on a periphery of each through hole for increasing contact areas between the fin and the guiding column.

Description:

CROSS REFERENCE TO RELATED APPLICATIONS

This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 096140395 filed in Taiwan, Republic of China on Oct. 26, 2007, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat dissipation module, and in particular, to a heat dissipation module including an aluminum extruded heat dissipating base with tightly fitted fins.

2. Description of the Related Art

Driven by miniaturization, higher speed and higher efficiency requirements for central process units (CPU) and other electronic products, heat produced by the electronic products has increased substantially. To efficiently dissipate heat, a heat sink is utilized in heat dissipation.

A conventional heat sink is instituted by a base and several fins, both of which are connected by tightly fit. The base is manufactured by forging and then tightly fitted with the fins. However, the forging process results in uneven heights for the guiding columns of the base. An additional process, with the help of computer numerical control, must be applied to cut the guiding columns for an uniform height. Therefore, the base and the guiding columns formed by forging require a high manufacturing cost and an extra cutting process.

Another conventional heat sink has a base with some separated guiding columns. As shown in FIGS. 1A and 1B, the base 11 and the guiding columns 12 are separately formed and then are connected to each other by tightly fit. In other words, the plurality of guiding columns 12 are tightly fitted into the holes 111 of the base 11, respectively. Then, several fins 13 are tightly fitted with the guiding columns 12. However, while fitting the guiding columns 12 into the holes 111 of the base 11, the tolerance between each component will accumulate, and because the guiding columns 12 are not perfectly vertical, tightly fitting the fins 13 becomes more difficult. Moreover, the base 11 and the guiding columns 12 are independent from each other, resulting in decreased heat conductivity.

BRIEF SUMMARY OF THE INVENTION

Accordingly, the present invention provides a heat dissipation module instituted by a heat dissipating base and a plurality of tightly fitted fins.

The present invention provides a heat dissipation module including a base and at least one fin. The base includes a bottom and a guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece. The fin is tightly fitted on the guiding column.

Preferably, the bottom and the guiding column are formed by extrusion. Further, the bottom and the guiding column are formed by crosscutting. The guiding column has a cross section with a rectangular or polygonal shape, and the guiding column includes a guiding angle formed on top of the guiding column.

Also preferably, the fin is made by aluminum, copper or other high thermo-conductive materials, and is formed by punching or extrusion. The fin includes at least one through hole for allowing the guiding column to be penetrated and mounted thereon. When the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column in parallel with each other, and/or the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other.

Furthermore, a protrusion is formed on the periphery of the through hole for increasing contact areas between the fin and the guiding column. When the fin is plural and an upper fin is stacked on a lower adjacent fin, a distance between the lower fin and the upper fin is greater than or equal to a height of the protrusion of the lower fin. Also, when the fin is plural, the sum of a height of the stacked fins is less than or equal to a height of the guiding column. Further, when the guiding column and the fin are plural, the heights of the some guiding columns are different, and the shapes of the some fins are different.

Accordingly, the present invention provides a heat dissipating base including a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece.

Accordingly, the present invention provides a manufacturing method of a heat dissipation module. The steps of the manufacturing method include integrally forming a base, wherein the base includes a bottom and at least one guiding column disposed on the bottom, and tightly fitting at least one fin with the guiding column.

The present invention provides a heat dissipation module with an aluminum extruded heat dissipating base with tightly fit fins, utilizing extrusion to overcome the disadvantages of conventional heat sink, so as to reduce manufacturing cost and time and increase heat conductivity.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

FIG. 1A is an exploded view of a conventional heat sink;

FIG. 1B is a schematic view of the heat sink in FIG. 1A;

FIG. 2A is an exploded view of a heat dissipation module of a preferred embodiment of the present invention;

FIG. 2B is a schematic view of the heat dissipation module in FIG. 2A; and

FIG. 2C is a side view of the heat dissipation module in FIG. 2B.

DETAILED DESCRIPTION OF THE INVENTION

As shown in FIGS. 2A to 2C, heat dissipation module of the present invention includes a base 2 and a plurality of fins 3. The base 2 includes a bottom 21 and a plurality of guiding columns 22 disposed thereon, wherein the bottom 21 and the guiding columns 22 are integrally formed as a single piece by extrusion. The plurality of fins 3 are tightly fitted on the guiding columns 22 piece by piece. Additionally, the bottom 21 and the guiding columns 22 can be formed by crosscutting coordinately.

Each of the guiding columns 22 has a cross section with a rectangular or polygonal shape. The top of each guiding column 22 forms a guiding angle 221 respectively for allowing the fins 3 to be disposed thereon easily. The fins 3 are made by aluminum, copper or other high thermo-conductive materials. And the fins 3 are formed by punching or extrusion.

Also, the fins 3 include a plurality of through holes 31 for allowing the corresponding guiding columns 22 to be penetrated and mounted thereon. In the embodiment, the fins 3 are stacked on the bottom 21 and connected with the guiding columns 22 of the base 2 by keeping a constant distance with each other, and/or the fins are stacked on the bottom 21 of the base 2 in parallel with each other. Moreover, a protrusion 32 is correspondingly formed on the periphery of each of the through holes 31 of each of the fins 3 for increasing contact areas between the fins 3 and the guiding columns 22. In this embodiment, the distance between one fin and its adjacent fin is greater than the height of the protrusion 32 of the fin, i.e. when an upper fin is stacked on the lower adjacent fin, the distance “H” between the lower fin and its upper fin is greater than the height “h” of the protrusion 32 of the lower, as shown in FIG. 2C. Further, the present invention is not limited thereto, for example, the distance between one fin and its adjacent fin can equal to the height of the protrusion 32 of the fin, so that when the upper fin is stacked on the lower adjacent fin, the upper fin can be contact with the protrusion of the lower fin to facilitate positioning of the upper fin, the figure is not shown.

Further, in FIG. 2A, when the heights of the some guiding columns 22 are different from the other guiding columns 22, and the shapes of the some fins 3 are different from the other fins 3. Also, the sum of a height of the stacked fins 3 is less than or equal to a height of the guiding column 22 so that all fins 3 can be sequentially stacked and tightly fitted with the guiding column 22.

The heat dissipating base and the guiding angles of the guiding columns in the present invention are formed by extrusion, and the heat dissipating base and the guiding columns are formed by crosscutting coordinately, and the fins are tightly fitting on the heat dissipating base, this results in lower costs, a simplified technique, an easier process and an efficient manufacturing method. Moreover, the heat dissipating base and the guiding columns are integrally formed as a single piece so as to achieve a high dissipating efficiency. Compared to the conventional heat sink, the heat dissipation module of the present invention improves upon cost reducing, manufacturing efficiency, manufacturing yield and performance.

While the present invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the present invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded with the broadest interpretation so as to encompass all such modifications and similar arrangements.