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 This invention relates to trays used in the semiconductor industry for carrying packaged integrated circuits such as Ball Grid Array (“BGA”), Quad Flat Pack (“QFP”), Thin Quad Flat Pack (“TQFP”), and similar packages. In particular, this invention relates to such a tray with a removable tab capable of being inserted into one edge of the tray thereby to allow a user to identify the particular contents of the tray by means of indicia or color associated with the tab.
 Trays for holding a plurality of assembled packaged semiconductor devices used in electronic equipment such as personal computers, cellular telephones, and servers are well known. A variety of semiconductor devices packages exist, including Ball Grid Array (“BGA”) packages, Quad Flat Pack (“QFP”) packages, and Thin Quad Flat Pack (“TQFP”) packages, for example. Trays of the type shown in plan view in
 In accordance with this invention, a method and structure are provided for allowing a user to easily identify the type of devices in a tray carrying packaged semiconductor devices.
 In one embodiment of this invention, a removable tab, capable of being inserted into an edge of the tray, is used to allow the user, by means of indicia on the tab, to identify the particular type of devices contained in the tray.
 In another embodiment, the removable tab denotes the type of devices contained in the tray by the color of the tab. The tab can have any one of a plurality of colors or combination of colors, the color or combination of colors indicating the type of devices contained in the tray.
 In accordance with another embodiment of this invention, the tab contains indicia such as letters or numbers or a combination thereof identifying the particular packaged semiconductor devices contained in the tray.
 An advantage of this invention is that a user is able to easily identify the type of devices contained in a tray by matching either the color of the tab or the indicia on the tab to a predetermined list identifying the particular device associated with each color or indicia. The possibility of error in placing an assembled packaged semiconductor device on a printed circuit board in an electronic system is substantially reduced, if not eliminated by the method and structure of this invention.
 This invention will be more fully understood in accordance with the following detailed description taken together with the drawings.
 The following detailed description illustrates several embodiments of this invention. This description is meant to be illustrative only and not limiting, and thus other embodiments of this invention will be obvious in view of this description to those skilled in the art.
 In accordance with this invention, the tray
 In one embodiment of the invention as shown in
 The back view of tab
 An indentation
 Note that flat edges
 A removable plug
 Of course, more than one tab
 While several embodiments of this invention have been described, other embodiments of this invention will be obvious to those skilled in the art in view of the above description. This invention is intended to be limited only by the following claims.