<?xml version="1.0" encoding="UTF-8"?>

<rss version="2.0">
    <channel>
        <image>
            <title>freepatentsonline.com</title>
            <width>141</width>
            <height>131</height>
            <link>http://www.freepatentsonline.com/</link>
            <url>http://www.freepatentsonline.com/images/logo.gif</url>
        </image>
        
        <title>Free Patents Online: Abrading</title>
        <link>http://www.freepatentsonline.com/rssfeed/rsspat451.xml</link>
        <description>USPTO Class 451 Abrading</description>
        <language>en-us</language>
        <lastBuildDate>Tue, 21 May 2013 08:00:00 EDT</lastBuildDate>
        <item>
            <title><![CDATA[Method for manufacturing semiconductor device]]></title>
            <link>http://www.freepatentsonline.com/8445360.html</link>
            <description><![CDATA[A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Method of manufacturing a foam composition roller brush]]></title>
            <link>http://www.freepatentsonline.com/8444890.html</link>
            <description><![CDATA[The invention is directed toward a chemical mechanical polishing/planarizing (CMP) brush with an embedded mandrel. PVA foam injected into the substantially hollow mandrel expands through apertures in the mandrel to fill a mold in the desired shape of the brush with the foam in the mandrel being integral with the outer foam covering the brush.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Plasma treated abrasive article and method of making same]]></title>
            <link>http://www.freepatentsonline.com/8444458.html</link>
            <description><![CDATA[An abrasive article, such as a structured abrasive article, can be treated by subjecting it to plasma whereby the outer surface can be eroded exposing at least a portion of the abrasive particles dispersed within a cross-linked binder forming the abrasive composites. Depending on the process conditions for the plasma treatment, it is possible to erode only a small portion or substantially all of the cross-linked binder from the outer surface. Thus, the initial cut-rate of the abrasive article can be controlled since it is possible to precisely control the degree, height, or area of the exposed abrasive particles.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Universal abrasive sheet]]></title>
            <link>http://www.freepatentsonline.com/8444457.html</link>
            <description><![CDATA[A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Electrode securing platens and electrode polishing assemblies incorporating the same]]></title>
            <link>http://www.freepatentsonline.com/8444456.html</link>
            <description><![CDATA[In one embodiment, an electrode polishing assembly may include an electrode securing platen, a plurality of electrode locating fasteners, and an electrode. Each of the electrode locating fasteners may include an electrode spacing shoulder, a variance cancelling shoulder extending from the electrode spacing shoulder, a threaded platen clamping portion extending from the variance cancelling shoulder, and a threaded nut that engages the threaded platen clamping portion. The electrode locating fasteners clamp the electrode securing platen between the threaded nut and the electrode spacing shoulder. The variance cancelling shoulder is at least partially within one of a plurality of variance cancelling passages of the electrode securing platen. A minimum position stack-up is equal to a minimum passage size minus a maximum shoulder size. A maximum position stack-up is equal to a maximum passage size minus a minimum shoulder size. The maximum position stack-up is greater than the minimum position stack-up.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Polishing pad and method for polishing a semiconductor wafer]]></title>
            <link>http://www.freepatentsonline.com/8444455.html</link>
            <description><![CDATA[A semiconductor wafer is polished, wherein in a first step, the rear side of the wafer is polished by a polishing pad comprising fixedly bonded abrasives having a grain size of 0.1-1.0 μm, while supplying a polishing agent free of solid materials having a pH of at least 11.8, and, in a second step, the front side of the semiconductor wafer is polished, wherein a polishing agent having a pH of less than 11.8 is supplied. A polishing pad for use in apparatuses for polishing semiconductor wafers, has a layer containing abrasives, a layer composed of a stiff plastic and also a compliant, non-woven layer, wherein the layers are bonded to one another by means of pressure-sensitive adhesive layers.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Interface pad for use between an abrasive article and a support tool]]></title>
            <link>http://www.freepatentsonline.com/8444454.html</link>
            <description><![CDATA[The present invention relates to an interface pad for use between an abrasive article and a support tool. In one particular embodiment, an interface pad for use between a perforated abrasive article and a support tool is provided. In general, the interface pads described herein contain apertures and at least one channel configured such that an interface pad can be used between an abrasive article having a particular configuration of apertures and a support tool having different configuration of dust collection apertures. In one embodiment, the interface pads described herein contain apertures and at least one channel configured such that the interface pad can be used between any perforated abrasive article and any support tool with dust extraction capabilities. Abrasive tools which include an interface pad and methods for using the interface pads are also described.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Device and method for fine or finest processing of a rotationally symmetric work piece surface]]></title>
            <link>http://www.freepatentsonline.com/8444453.html</link>
            <description><![CDATA[A device for fine or finest processing of a rotationally symmetric work piece surface of a work piece (14), with a drive mechanism (12) for driving the work piece (14) around an axis of rotation (16), two guidance mechanisms (20, 22) acting in radial directions with respect to the axis of rotation (16) and at least one tool (38) acting in a radial direction, and a pressing mechanism (42) for pressing the work piece (14) against the drive mechanism (12), wherein the work piece (14) can be disposed between the drive mechanism (12) and the pressing mechanism (42). The pressing mechanism (42) acts in a pressing plane (74) that is offset from the axis of rotation (16) towards a space (78) in which the guidance mechanisms (20, 22) are disposed.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Method for utilizing an electronic lapping guide for a beveled pole in a magnetic recording transducer]]></title>
            <link>http://www.freepatentsonline.com/8443510.html</link>
            <description><![CDATA[A method for providing at least one transducer including magnetic structure and having an air-bearing surface (ABS) are described. The method includes providing a lapping electronic lapping guide (lapping ELG) and a targeting ELG. The lapping ELG and targeting ELG each are coplanar with the desired thickness of the magnetic structure and have a back edge at the distance from the ABS such that the ELG back edges are substantially aligned with the flare point. The targeting ELG has a front edge at a front edge distance from the ABS corresponding to an intersection of the bevel and the desired thickness. The method further includes lapping the transducer and terminating the lapping based on a first resistance of the lapping ELG and a second resistance of the targeting ELG.]]></description>
            <pubDate>Tue, 21 May 2013 08:00:00 EDT</pubDate>
        </item>
    </channel>
</rss>