<?xml version="1.0" encoding="UTF-8"?>

<rss version="2.0">
    <channel>
        <image>
            <title>freepatentsonline.com</title>
            <width>141</width>
            <height>131</height>
            <link>http://www.freepatentsonline.com/</link>
            <url>http://www.freepatentsonline.com/images/logo.gif</url>
        </image>
        
        <title>Free Patents Online: Heat exchange</title>
        <link>http://www.freepatentsonline.com/rssfeed/rsspat165.xml</link>
        <description>USPTO Class 165 Heat exchange</description>
        <language>en-us</language>
        <lastBuildDate>Tue, 07 Feb 2012 08:00:00 EST</lastBuildDate>
        <item>
            <title><![CDATA[Water heater and method of controlling the same]]></title>
            <link>http://www.freepatentsonline.com/8111980.html</link>
            <description><![CDATA[A water heater including a water inlet line having an inlet opening that introduces cold water to a tank, a water outlet line having an outlet opening that withdraws heated water from the tank, and a heating element. The water heater further includes a control circuit. The heating element can be an electrical resistance heating element, a gas heating element, or a combination thereof. In one construction, the gas heating element includes a first combustive section and a second combustive section separately controlled from the first combustive section.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Heat sink assembly, portable electronic device using same and wireless modem using the heat sink assembly]]></title>
            <link>http://www.freepatentsonline.com/8111517.html</link>
            <description><![CDATA[A heat sink assembly, a portable electronic device using the same and a wireless modem using the heat sink assembly are disclosed. The heat sink assembly assembled within the portable electronic for dissipating the heat source generated within the portable electronic device to the outside. The heat sink assembly includes a frame, a cover and an absorbing sheet. The frame includes a through opening formed and surrounded thereby. The cover foldably or bendably extends outwardly from one side of the frame and is configured to be alternatively accommodated within the opening of the frame for covering the opening or forming an angle relative to the frame. The absorbing sheet is fixedly covered on the other side of the frame opposite to the cover.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Housing used as heat collector]]></title>
            <link>http://www.freepatentsonline.com/8111516.html</link>
            <description><![CDATA[A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Methods and apparatuses for transferring heat from stacked microfeature devices]]></title>
            <link>http://www.freepatentsonline.com/8111515.html</link>
            <description><![CDATA[Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Industrial computer]]></title>
            <link>http://www.freepatentsonline.com/8111513.html</link>
            <description><![CDATA[An industrial computer includes a first casing, a second casing, a storage unit, a cover, and a heat dissipation unit. The second casing and the first casing form a closed casing, and the outside of the second casing has a containing area. The storage unit is disposed at the containing area. The cover is removably assembled at the second casing to cover the containing area and contact the storage unit. The heat dissipation unit is disposed at the cover.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Substrate processing apparatus and temperature control device]]></title>
            <link>http://www.freepatentsonline.com/8110044.html</link>
            <description><![CDATA[A first flow passage (16), which cools a temperature controlled object by a circulating first cooling water (15), and a second flow passage (19) separate from the first flow passage are provided so as to exchange heat between a second cooling water (18) flowing through the second flow passage (19) and the first cooling water (15). There is no need to store the first cooling water (15) in a tank of a constant capacity, and the first cooling water (15) flowing through the first flow passage (16) of a chiller corresponding part is absorbed substantially in its entirety by the second cooling water (18). A response becomes quick with respect to a load fluctuation of the temperature controlled object, and waste of energy can be reduced while improving accuracy of temperature control.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Heat-dissipating fan]]></title>
            <link>http://www.freepatentsonline.com/8109713.html</link>
            <description><![CDATA[A heat-dissipating fan includes a housing, a stator, a rotor and at least one retaining member. The stator and rotor are received inside the housing. The rotor includes an impeller having a plurality of blades. The at least one retaining member is removably mounted to the housing and includes a retaining plate. In an axial direction of the rotor, the retaining plate extends to be above and within a rotational area of the blades to retain the rotor to avoid departure of the rotor from the housing, even if the heat-dissipating fan is hit hard while it is packed, moved, transported or operating. Besides, the arrangement of the retaining member won't result in reduction of air input. Consequently, the retaining member can be quickly mounted to the housing at a predetermined position to enhance convenience of assembly.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Fluid temperature control device]]></title>
            <link>http://www.freepatentsonline.com/8109328.html</link>
            <description><![CDATA[A fluid temperature control device, which is particularly suitably applied to the temperature control of a processing liquid in a semiconductor device manufacturing process, capable of performing quickly and precisely the temperature control of a temperature-controlled fluid, and the device can also be made as small as possible. This fluid temperature control device includes a body block having flow passage grooves formed therein; heat transfer plates which are disposed on surfaces of the body block to form flow passages where a temperature-controlled fluid flows; heaters which heat the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates; and thermoelectric modules which heat and cool the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Temperature control system having heat exchange modules with indirect expansion cooling and in-tube electric heating]]></title>
            <link>http://www.freepatentsonline.com/8109327.html</link>
            <description><![CDATA[A temperature control system for a container includes a refrigeration circuit having a primary fluid circulating therein and a secondary fluid circuit in communication with a first compartment of the container and a second compartment of the container. The secondary fluid circuit has a secondary fluid separate from the primary fluid circulating therein. The secondary fluid circuit includes a first heat exchange module in communication with an interior load space of the first compartment and a second heat exchange module in communication with an interior load space of the second compartment. Each of the first and second heat exchange modules includes a pump, a heater, a heat exchanger, and a three-way valve. A heat exchange interface between the refrigeration circuit and the secondary fluid circuit is operable to transfer heat from the secondary fluid to the primary fluid.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Heat transfer plate for plate heat exchanger with even load distribution in port regions]]></title>
            <link>http://www.freepatentsonline.com/8109326.html</link>
            <description><![CDATA[The invention relates to a heat transfer plate (1) intended to constitute, together with other heat transfer plates, a plate stack (2) with permanently connected plates for a heat exchanger (3), which heat transfer plate (1) has a first long side (4) and an opposite second long side (5), a first short side (6) and an opposite second short side (7), a heat transfer surface (8) exhibiting a pattern (9) of ridges (10) and valleys (11), first and second port regions (12 and 13), the first port region (12) being situated in a first corner portion (14) formed at the meeting between the first long side (4) and the first short side (6), the second port region (13) being situated in a second corner portion (15) formed at the meeting between the second long side (5) and the first short side (6), and the first port region (12) being connected to a number of ridges (10a-d) and valleys (11a-e), which ridges (10a-d) and valleys (11a-e) have in principle an extent from the first port region (12) diagonally towards the second long side (5).]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Heat transfer system]]></title>
            <link>http://www.freepatentsonline.com/8109325.html</link>
            <description><![CDATA[A thermodynamic system includes a cyclical heat exchange system and a heat transfer system coupled to the cyclical heat exchange system to cool a portion of the cyclical heat exchange system. The heat transfer system includes an evaporator including a wall configured to be coupled to a portion of the cyclical heat exchange system and a primary wick coupled to the wall and a condenser coupled to the evaporator to form a closed loop that houses a working fluid.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling]]></title>
            <link>http://www.freepatentsonline.com/8109324.html</link>
            <description><![CDATA[A microchannel cooler containing a slurry having a particulate liquid/solid phase change material is provided balancing the interdependent factors of microencapsulated particle size with microchannel size and shape and flow conditions for the removal of high heat flux with low space and low power requirements.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Heat dissipation device having a clip]]></title>
            <link>http://www.freepatentsonline.com/8109323.html</link>
            <description><![CDATA[A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Heat plate type cooler module]]></title>
            <link>http://www.freepatentsonline.com/8109322.html</link>
            <description><![CDATA[A heat plate type cooler module includes a heat plate, which is formed of a bottom cover plate and a top cover plate and having a working fluid filled in a vacuum chamber between the top cover plate and the bottom cover plate; heat pipes each having a cold end and a top end; a locating plate covered on the heat plate to hold the hot end of each heat pipe in contact with the heat plate; and radiation fins fastened to the cold ends of the heat pipe by press-fitting.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members]]></title>
            <link>http://www.freepatentsonline.com/8109321.html</link>
            <description><![CDATA[A modular heat sink assembly is disclosed. The heat sink assembly includes a main (larger) heat sink member having one or more voids through the member. The heat sink assembly also includes one or more additional (smaller) heat sink members that fit within the voids of the main heat sink member and are able to move (float) within the voids while thermally connected to main heat sink member. The thermal connection to the main heat sink member may be accomplished by incorporating heat pipes as a bridge between the heat sink members, so that heat spreading, and regulation thereof, occurs over the additional heat sink members and the main heat sink member.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
        <item>
            <title><![CDATA[Automotive ventilation apparatus and automotive ventilation method]]></title>
            <link>http://www.freepatentsonline.com/8109108.html</link>
            <description><![CDATA[A ventilation flow path through which air present in an internal space at an instrument panel is drawn and discharged to the outside of the cabin as a blower fan operates is formed in a ventilation mode without forming an air-conditioning flow path for blowing inside air or outside air into the cabin and the air-conditioning flow path is formed without forming the ventilation flow path in a mode other than the ventilation mode.]]></description>
            <pubDate>Tue, 07 Feb 2012 08:00:00 EST</pubDate>
        </item>
    </channel>
</rss>
