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<title>freepatentsonline.com: Heat exchange</title>
<link>http://www.freepatentsonline.com/result.html?query_txt=ccl/165%20and%20isd/04/29/2008&amp;uspat=on</link>
<description>USPTO Class 165 Heat exchange</description>
<language>en-us</language>
<lastBuildDate>Wed Apr 30 16:35:05 EDT 2008</lastBuildDate>

<item>
<title><![CDATA[Heat transfer of a remote heat source using a loop heat pipe]]></title>
<link>http://www.freepatentsonline.com/7363960.html</link>
<description><![CDATA[Heat transfer systems and methods 30 for use on a spacecraft that use a loop heat pipe to transfer heat from a remotely located heat source to a thermal radiator or other heat dissipating apparatus. The loop heat pipe is a two phase heat transfer device that has an evaporator coupled to the heat source and a condenser coupled to the thermal radiator or other heat dissipating apparatus. The loop heat pipe comprises thin walled tubing to connect the evaporator and condenser. The thin walled tubing allows the loop heat pipe to be flexible. This flexibility offers significant advantages in terms of routing and accommodating design]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Heat dissipation device]]></title>
<link>http://www.freepatentsonline.com/7363963.html</link>
<description><![CDATA[A heat dissipation device for electronic devices on a substrate comprises a base contacting one of the electronic devices for absorbing heat therefrom. A plurality of fins arranged on the base for dissipating heat. A plurality of airflow channels is defined between the fins, and each channel defines an intake and an outlet. A fan is located adjacent to the intakes and provides airflow entering the channels through the intakes and leaving the channels through the outlets. A first guiding member is located adjacent to the outlets. The airflow out of the outlets is guided, by the first guiding member, to be deflected towards the substrate for cooling other electronic devices neighboring the one contacting with the base.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Onboard hydrogen storage unit with heat transfer system for use in a hydrogen powered vehicle]]></title>
<link>http://www.freepatentsonline.com/7363965.html</link>
<description><![CDATA[An onboard hydrogen storage unit with heat transfer system for a hydrogen powered vehicle. The system includes a hydrogen storage vessel containing a hydrogen storage alloy configured to receive a stream of hydrogen and provide hydrogen for use in powering a vehicle. During refueling a cooling/heating loop is used to remove the heat of hydride formation from the hydrogen storage alloy and during operation of the vehicle the heating/cooling loop is used to supply heat to the hydrogen storage alloy to aid in hydrogen desorption.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Heat sink]]></title>
<link>http://www.freepatentsonline.com/7363964.html</link>
<description><![CDATA[A heat sink includes a base, a set of fins mounted to the base and a plurality of fixing portions, wherein the fixing portions extend from a surface of the base and the set of fins are mounted on an opposite surface of the base. The heat sink is secured to a printed circuit board with at least one heat generating component through the fixing portion of the base. The heat sink is improved by forming one or more slots at lateral sides of the base such that one or more deformable portions can be defined on the base. Thus, the deformable length of the base is increased and the heat stress is relaxed.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Heat exchanger support structure of motor vehicle and supporting method]]></title>
<link>http://www.freepatentsonline.com/7363961.html</link>
<description><![CDATA[A heat exchanger support structure has a heat exchanger, a heat exchanger support supporting the heat exchanger, and motor fan units. The heat exchanger support is integrally formed with motor fan shroud portions for directing the air flow caused by motor fans. Electric motors driving the fans are respectively surrounded by a cylindrical shroud member, which has stays received in holding portions formed on the shroud portion with an elastic member interposed between the stay and the holding portion. The arrangement of the shroud member, the motor fan unit, and the elastic member functions as a dynamic damper.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Heat dissipating assembly with fan fastening device]]></title>
<link>http://www.freepatentsonline.com/7365979.html</link>
<description><![CDATA[A heat dissipating device ( 8 ) includes a heat sink ( 40 ), a first and a second fixing members ( 2, 3 ) mounted on the heat sink, a lever ( 1 ) pivotably mounted to the second fixing member, a fan holder ( 5 ) and a fan ( 6 ) mounted on the fan holder. A pair of mounting holes ( 26 ) is defined in the first fixing member. A catch ( 38 ) is bent from the second fixing member for clasping the lever. The fan holder includes a pair of tongues engaged in the mounting holes of the first fixing member, and a U-shaped receiving portion ( 58 ) receiving and downwardly pressed by the lever.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Heat dissipating device for computer add-on cards]]></title>
<link>http://www.freepatentsonline.com/7365989.html</link>
<description><![CDATA[A heat dissipating device mounted onto a VGA card ( 10 ) includes a base ( 22 ) contacting with a GPU ( 12 ) attached on the VGA card, a cover ( 21 ) mounted on the base, and a plurality of fins ( 24 ) received between and thermally connecting the cover and the base. The base defines a slot ( 222 ) above the GPU. A fan ( 28 ) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Cold plate for beer dispensing tower]]></title>
<link>http://www.freepatentsonline.com/7363962.html</link>
<description><![CDATA[A cold plate for a beverage chilling apparatus comprising a plurality of beverage conducting tubes sinuously arranged within a cast aluminum jacket. Interleaved between the beer conducting tubes are coolant conducting lines arranged in heat exchanging relation. The coolant lines are derived from a main coolant line pumping coolant to the cold plate, where a coolant inlet is divided into two separate smaller intermediate coolant segments at a first stage. Each intermediate glycol segment is then subdivided at a second stage into four heat exchanging coolant lines. At each subdivision of the coolant fluid conducting system, a pair of smaller lines equal distance from a feed line and having a smaller diameter than the feed line are incorporated using a two-for-one splitter so that each stage doubles the number of lines from the previous stage.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Grease protecting apparatus for heat sink]]></title>
<link>http://www.freepatentsonline.com/7365983.html</link>
<description><![CDATA[A grease protecting apparatus ( 10 ) includes a heat sink ( 12 ) defining a plurality of receiving cavities ( 124 ) therein, a layer of grease ( 16 ) spread on a surface ( 122 ) of the heat sink, and a grease cover ( 14 ) attached to the surface of the heat sink for protecting the grease from contamination. The cover includes a main body ( 142 ) defining a protecting space ( 143 ) therein for covering the grease, two wings ( 144 ) extending from two opposite sides of the main body, and a plurality of projections ( 148 ) extending from the wings for being snapped in the receiving cavities of the heat sink. The projection has a trapezium-shaped cross section.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Electronic device with dual heat dissipating structures]]></title>
<link>http://www.freepatentsonline.com/7365972.html</link>
<description><![CDATA[An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed on the first and second heat producing surfaces of the circuit board respectively, and the connective portion connecting the auxiliary heat dissipating structure and the major heat dissipating structure. The second heat producing surface of the circuit board is a high-temperatured area relative to the first heat producing surface of the circuit board in the electronic system, thereby the heat produced by the second heat producing surface of the circuit board can be conducted to the major heat dissipating structure through the auxiliary heat dissipating structure and the connective portion for heat dissipation.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Display module]]></title>
<link>http://www.freepatentsonline.com/7365984.html</link>
<description><![CDATA[A display module having an improved heatsink effect may include a display panel reproducing an image, a chassis supporting the display panel, a driving circuit board disposed on a surface of the chassis opposite to the display panel to generate an electrical signal for driving the display panel, the driving circuit board including at least one heat emissive circuit element, a first heatsink disposed on the heat emissive circuit element and a second heatsink disposed on the chassis. The first heatsink and the second heatsink may be thermally connected by a foldable connecting member.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[System and method for managing indoor air through cooperation between air conditioner and mobile assistant device]]></title>
<link>http://www.freepatentsonline.com/7366588.html</link>
<description><![CDATA[A method and system for efficiently managing indoor air through cooperation between a mobile device and a stationary air conditioner. The system may include at least one stationary air conditioner and at least one mobile assistant device that move with a predetermined management area and cooperates with the air conditioner. The air conditioner may include an air quality improving unit improving a value of a predetermined air quality index into an appropriate range, a first forced flow unit generating a main flow to transport improved air toward the abnormal region, and a control unit controlling the air quality improving unit and the first forced flow unit to perform a main operation on the abnormal region and transmitting a command instructing the assistant device to perform an assistant operation on the abnormal region to the assistant device.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Heat dissipation device having a fan holder for attachment of a fan]]></title>
<link>http://www.freepatentsonline.com/7365975.html</link>
<description><![CDATA[A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions extending from the base portion. The heat sink has two slits extending through two opposite sides thereof. A fan holder having a fan mounted thereon is attached to a face of the heat sink. The fan holder includes two brackets each having a rib engaged in a corresponding slit of the heat sink to thereby attach the fan holder to the heat sink, and a faceplate having the fan thereon. The faceplate has an ear secured to a corresponding wing portion of the heat sink by a screw and a tab extending upwardly beyond a top end of the heat sink.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Liquid cooling device]]></title>
<link>http://www.freepatentsonline.com/7365982.html</link>
<description><![CDATA[A liquid cooling device ( 10 ) includes a heat sink ( 12 ), a reservoir ( 14 ) containing liquid therein and distant from the heat sink, and a heat-transfer member. The heat-transfer member includes a heat-absorbing segment ( 162 ) contacting the heat sink and a heat-discharging segment ( 164 ) submerged in the liquid of the reservoir.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Method of making a heat pipe]]></title>
<link>http://www.freepatentsonline.com/7363701.html</link>
<description><![CDATA[An encapsulated heat pipe is made by placing a removable elongated solid partially within a mold, filling the mold with a solid dielectric material, and removing the elongated solid from the dielectric material defining an elongated cavity that extends within the solid dielectric material. Next, a wick material is inserted into the periphery of the elongated cavity, then a coolant liquid is inserted into the elongated cavity and the open end of the elongated cavity is sealed.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Method for electronics equipment cooling having improved EMI control and reduced weight]]></title>
<link>http://www.freepatentsonline.com/7365974.html</link>
<description><![CDATA[An air cooling apparatus for an aircraft includes a cabinet that is configured to house a plurality of modules in a plurality of module accepting regions, respectively, wherein the cabinet has a backplane region. The apparatus further includes a plurality of air flow passages provided between adjacent ones of the respective module accepting regions of the cabinet. The apparatus also includes a primary air flow unit for providing primary air flow from the backplane region and through the plurality of air flow passages, to thereby cool the plurality of modules housed within the cabinet.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Fluid-cooled electronic system]]></title>
<link>http://www.freepatentsonline.com/7365981.html</link>
<description><![CDATA[A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

<item>
<title><![CDATA[Micropin heat exchanger]]></title>
<link>http://www.freepatentsonline.com/7365980.html</link>
<description><![CDATA[An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. The micropins are arranged in a pixel like pattern over the substrate.]]></description>
<pubDate>April 29, 2008</pubDate>
</item>

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