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        <title>Free Patents Online: Heat exchange</title>
        <link>http://www.freepatentsonline.com/rssfeed/rssapp165.xml</link>
        <description>USPTO Class 165 Heat exchange</description>
        <language>en-us</language>
        <lastBuildDate>Thu, 23 May 2013 08:00:00 EDT</lastBuildDate>
        <item>
            <title><![CDATA[FORMED METALLIC HEAT SINK SUBSTRATE, CIRCUIT SYSTEM, AND FABRICATION METHODS]]></title>
            <link>http://www.freepatentsonline.com/y2013/0130439.html</link>
            <description><![CDATA[A thermally conductive substrate for suitable for use as a three dimensional heat sink for electrical device systems. The substrate comprises a base element with a cavity comprising a recessed device mounting site. Associated device systems include one or more devices arranged in the three dimensional heat sink which can be encapsulated into a device package and associated construction methodologies.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[TEMPERATURE CONTROL ELEMENT FOR HEATING AND RAPIDLY COOLING MEASUREMENT SAMPLES]]></title>
            <link>http://www.freepatentsonline.com/y2013/0128915.html</link>
            <description><![CDATA[A temperature control element for a measuring device for controlling the temperature of a measurement sample, comprising first and second heating elements delivering thermal energy to the measurement sample, and control means for controlling the heating of the measurement sample, wherein the first and second heating elements heat the measurement sample until a limit temperature has been reached, and wherein thermal resistivity between the first and second heating elements is increased starting at the limit temperature, and the control means disconnects the contact between the first and second heating elements when the limit temperature is reached. A cooling element withdraws thermal energy, and the control means controls cooling of the measurement sample, wherein thermal energy is withdrawn from measurement sample by bringing the cooling element closer to the shut-off of the first heating element, and interrupting the contact between the cooling element and the shut-off of the first heating element.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[COOLING DEVICE AND ELECTRONIC DEVICE]]></title>
            <link>http://www.freepatentsonline.com/y2013/0128461.html</link>
            <description><![CDATA[The cooling device comprises a base with a recessed part in a first surface, a plurality of heat radiating fins standing erect on a second surface on the reverse side of the first surface, and a flat, plate-like thermal diffusion part housed inside the recessed part. The upper surface of the thermal diffusion part makes thermal contact with the upper surface of the recessed part, the side surface of the thermal diffusion part makes thermal contact with the side surface of the recessed part, and the thermal diffusion part diffuses in the planar and orthogonal directions heat from the heat generating element arranged on the bottom surface of the thermal diffusion part by vaporizing and condensing coolant sealed inside.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[ENVIRONMENTAL CONTROL FOR MODULE HOUSING ELECTRONIC EQUIPMENT RACKS]]></title>
            <link>http://www.freepatentsonline.com/y2013/0128455.html</link>
            <description><![CDATA[A system is provided in one example embodiment that includes at least one rack for electronic equipment, each rack including: at least one sensor configured to measure an environmental condition, an air conditioning system, an ingress port configured to allow air to flow into a corresponding rack from an environment surrounding the racks, and an egress port configured to allow air to flow out of a corresponding rack and into the environment surrounding the racks. The system also includes a housing that surrounds the racks and that defines the environment surrounding the racks. The air that flows out through the egress ports of the racks conditions the air in the environment surrounding the racks.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Radiator Module System for Automatic Test Equipment]]></title>
            <link>http://www.freepatentsonline.com/y2013/0127483.html</link>
            <description><![CDATA[A radiator module system for automatic test equipment, wherein the automatic test equipment comprises at least one test arm, with the front end of the test arm being configured with a test head, and a closed-loop circulating cooling device is installed on the test arm. The closed-loop circulating cooling device includes a conduit which is in contact with the cooling device, internally contains an working fluid and is connected to the test head, a cooling device, a set of fans and a driving source for driving the working fluid. The closed-loop circulating cooling device can operate to circulate and exchange heat energy generated by a device under test (DUT) tightly stressed by downward pressure applied with the test arm, and brings up airflows by means of the fans to perform heat exchange on the cooling device thereby dissipating the generated heat energy.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT TRANSFER COMPOSITIONS]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126778.html</link>
            <description><![CDATA[The invention provides a heat transfer composition comprising (i) a first component selected from trans-1,3,3,3-tetrafluoropropene (R-1234ze(E)), cis-1,3,3,3-tetrafluoropropene (R-1234ze(Z)) and mixtures thereof; (ii) carbon dioxide (R-744); and (iii) a third component selected from 2,3,3,3-tetrafluoropropene (R-1234yf), 3,3,3-trifluoropropene (R-1243zf), and mixtures thereof.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT TRANSFER COMPOSITIONS]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126777.html</link>
            <description><![CDATA[The invention provides a heat transfer composition comprising (i) a first component selected from trans-1,3,3,3-tetrafluoropropene (R-1234ze(E)), cis-1,3,3,3-tetrafluoropropene (R-1234ze(Z)) and mixtures thereof; (ii) carbon dioxide (R-744); and (iii) a third component selected from 1,1-difluoroethane (R-152a), fluoroethane (R-161), and mixtures thereof.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT TRANSFER COMPOSITIONS]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126776.html</link>
            <description><![CDATA[The invention provides a heat transfer composition comprising (i) a first component selected from trans-1,3,3,3-tetrafluoropropene (R-1234ze(E)), cis-1,3,3,3-tetrafluoropropene (R-1234ze(Z)) and mixtures thereof; (ii) carbon dioxide (R-744); and (iii) a third component selected from propylene (R-1270), propane (R-290), n-butane (R-600), isobutane (R-600a), and mixtures thereof.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Fuel Cell Heat Pump]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126625.html</link>
            <description><![CDATA[A heating, ventilation, and air conditioning (HVAC) system includes a fuel cell configured to generate electricity and rejected heat, a hydronic coil, and a circulatory loop configured to selectively circulate a fluid between the fuel cell and the hydronic coil.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[FAN CONTROL SYSTEM AND METHOD]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126150.html</link>
            <description><![CDATA[A fan control system for controlling the rotation speed of a number of fans includes one or more first motherboards with baseboard management controllers (BMCs), one or more second motherboards without any BMCs, one or more temperature sensors for detecting the temperature in the area of the second motherboards, and a fan control board (FCB). Based on determining whether there are any BMCs mounted in the motherboards or not, the FCB reads motherboard temperature from the BMCs mounted in the first motherboards, or reads the temperature from the temperature sensors, thereby controlling the corresponding fans.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT EXCHANGER FOR VEHICLE]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126149.html</link>
            <description><![CDATA[A heat exchanger for a vehicle may include a heat radiating portion provided with first, second and third connecting lines and receiving first, second, and third operating fluids respectively and a bifurcating portion connecting one of inflow holes formed to the heat radiating portion for flowing one operating fluid of the first, second, and third operating fluids with one of exhaust holes formed to the heat radiating portion for exhausting the one operating fluid, wherein the bifurcating portion may be mounted at an exterior of the heat radiating portion, and wherein the bifurcating portion bypasses the one operating fluid from the heat radiating portion according to a temperature of the one operating fluid.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[SYSTEM AND METHOD FOR A SWITCHABLE HEAT SINK]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126148.html</link>
            <description><![CDATA[According to an embodiment of the disclosure, a system for selectively dissipating thermal energy includes a heat-generating structure, a first heat sink, a second heat sink, and a heat transfer element. The heat-generating structure generates thermal energy. The first heat sink is in thermal communication with the heat-generating structure. The heat transfer element is configured to be selectively positioned between the first heat sink and the second heat sink to establish a path for the transfer of thermal energy between the first heat sink and the second heat sink. Upon positioning the heat transfer element between the first heat sink and the second heat sink, at least a portion of the thermal energy from the heat-generating structure is allowed to travel through the first heat sink and through the heat transfer element to the second heat sink.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[THERMOSTAT DEVICE]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126147.html</link>
            <description><![CDATA[The present invention relates to a temperature control device with at least one heat source and, additionally or alternatively, a heat sink and with at least one temperature detector for monitoring the temperature of the temperature control device. It is provided that the temperature control device comprises a sensor temperature control device that can be selectably switched on in order to additionally temper the temperature detector at least in some operating stages.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[PLANAR THERMAL DISSIPATION PATCH M AND THE METHOD OF THE SAME]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126146.html</link>
            <description><![CDATA[A planar thermal dissipation patch comprises a polymer substrate; an adhesive layer attached under the polymer substrate; a protection sheet over the adhesive layer, the protection sheet is removed from the adhesive layer before attaching the planar thermal dissipation patch; a thermal dissipation layer formed on the polymer substrate; wherein the thermal dissipation layer is formed of CNT, conductive polymer, graphite or the combination thereof.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT SINK WITH ORIENTABLE FINS]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126145.html</link>
            <description><![CDATA[A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[COOLING JACKET]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126144.html</link>
            <description><![CDATA[A cooling jacket for cooling an electric motor is provided. The cooling jacket has one or more than one wave-shaped pipe, covering the electric motor, for conducting working fluid, wherein each wave-shaped pipe has a forwarding portion and a reversed portion, parallel to the axis of the electric motor, for conducting the working fluid to flow in opposite directions, wherein the forwarding portion includes at least two forwarding sub-pipes, and the reversed portion includes at least two reversed sub-pipes; and a turning portion, connected between the forwarding portion and the reversed portion.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[COOLING JACKET]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126143.html</link>
            <description><![CDATA[A cooling jacket for cooling an electric motor is provided. The cooling jacket has one or more continuous S-shaped pipes, covering the electric motor, for conducting working fluid, wherein each continuous S-shaped pipe at least has: a forwarding portion and a reversed portion, respectively extending along two circumferential directions which are parallel but opposite to each other; and a turning portion connected between the forwarding portion and the reversed portion.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[REAR DOOR HEAT EXCHANGER]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126142.html</link>
            <description><![CDATA[A rear door heat exchanger adapted to be mounted on the rear of a rack or other arrangement of heat-generating electronic equipment, and to cool air which passes therethrough when the rear door heat exchanger is in use. It comprises an upstream header and a downstream header with a multiplicity of substantially parallel microchannels extending between and in fluid communication with both the upstream header and the downstream header. Thus both headers are common to the microchannels of the said multiplicity of microchannels.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT EXCHANGER]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126141.html</link>
            <description><![CDATA[A heat exchanger 302 comprising: an inlet manifold 304; an outlet manifold 306; and a tube matrix 310 comprising a plurality of tubes 308, each tube 308 being connected at one end to the inlet manifold 304 and at the other end to the outlet manifold 306; wherein each tube extends generally along a longitudinal axis defined between the connection of the tube 308 with the inlet manifold 304 and the connection of the tube 308 with the outlet manifold 306; and wherein a single portion 314 of each tube 308 is offset to one side of the longitudinal axis.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT EXCHANGER]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126140.html</link>
            <description><![CDATA[A heat exchanger is provided. The heat exchanger may include a plurality of refrigerant tubes extending in a horizontal direction, at least one fin coupled to the plurality of refrigerant tubes, a vertically oriented header coupled to corresponding ends of the plurality of refrigerant tubes, the header distributing refrigerant into the plurality of refrigerant tubes, and a partition device that partitions an inner space of the header, the partition device including at least two through holes that guide refrigerant into the plurality of refrigerant tubes.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT TRANSPORTING UNIT, ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126139.html</link>
            <description><![CDATA[The heat transporting unit according to the Present Disclosure comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT TRANSFER PLATE AND METHOD OF MANUFACTURING THE SAME]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126138.html</link>
            <description><![CDATA[A method of manufacturing a heat transfer plate includes: an insertion process of inserting a heat medium pipe in a concave groove formed in a bottom face of a lid groove open to an obverse of a base member; a lid groove closing process of arranging a lid plate in the lid groove; and a main joining process of moving a main joining rotation tool along butt portions (V1, V2) between sidewalls of the lid groove and side faces of the lid plate, wherein in the main joining process a plastic fluidizing material (Q), where the base member and the lid plate are fluidized due to frictional heat, is made to flow in air gap portions (P1, P2) formed around the heat medium pipe.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[STACKED PLATE HEAT EXCHANGER]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126137.html</link>
            <description><![CDATA[A stacked plate heat exchanger may include a plurality of elongated plates on top of and connected to one another. The elongated plates may define a first cavity in the longitudinal direction of the plates and be configured to cool a medium. The elongated plates may define a second cavity for conducting a coolant therethrough, wherein in two end regions of each elongated plate, a through hole may be arranged for supplying the medium to be cooled. The through hole may be at least partially surrounded at its boundary by a dome and arranged approximately at the edge of the elongated plates. At least one of the dome and the through hole may be integrated in the edge of the elongated plate.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126136.html</link>
            <description><![CDATA[A heat exchange system and a method of manufacturing the same are provided. The heat exchange system may include a first heat exchanger, a second heat exchanger spaced apart from the first heat exchanger, a connection device provided between the first and second heat exchangers to guide refrigerant into the first and second heat exchangers, and one or more connection pipes that couple the connection device to the first and second heat exchangers, the connection pipes including at least one bent portion.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT EXCHANGER PLATE AND A PLATE HEAT EXCHANGER]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126135.html</link>
            <description><![CDATA[A plate heat exchanger comprises several heat exchanger plates provided beside each other, which form first and second alternating plate interspaces. Every second heat exchanger plate forms a primary plate and every second secondary plate. Each heat exchanger plate extends in an extension plane and comprises a heat transfer area and an edge area around the heat transfer area. The heat transfer area comprises a corrugation of longitudinally extending ridges and valleys. The ridges have two edge surfaces and a support surface between the edge surfaces, with a first width transversally to the longitudinal direction. The valleys have two edge surfaces and a support surface between the edge surfaces, with a second width transversally to the longitudinal direction. The support surface of valleys of the primary plates slopes relative to the extension plane and the support surface of ridges of the secondary plates slopes relative to the extension plane.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[CROSS FLOW FAN AND AIR CONDITIONER HAVING THE SAME]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126134.html</link>
            <description><![CDATA[A cross flow fan and an air conditioner having the same are provided. The cross flow fan may include a fixing member having a plate shape, and a plurality of blades fixed to one surface of the fixing member. The plurality of blades may be arranged spaced apart from each other in a circumferential direction. An inner edge may define an end of a side of each of the plurality of blades, the inner edge extending toward a rotational shaft of the plurality of blades, and an outer edge may define an end opposite to the inner edge. A protrusion may protrude from the outer edge in one direction.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT PIPE STRUCTURE]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126133.html</link>
            <description><![CDATA[A heat pipe structure includes a tubular body. The tubular body has a chamber, a working fluid and a first capillary structure. The chamber is defined with at least one first section, a second section and a third section. The first, second and third sections are connected with each other. The first capillary structure is disposed in the second section. By means of the above arrangement, the pressure impedance of the chamber of the heat pipe is lowered to greatly increase vapor-liquid circulation efficiency of the working fluid in the chamber.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[VAPOR CHAMBER WITH INTEGRALLY FORMED WICK STRUCTURE AND METHOD OF MANUFACTURING SAME]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126132.html</link>
            <description><![CDATA[A vapor chamber includes a main body and a wick structure. The main body includes a first and a second plate, which are closed to each other to define a chamber therein between. A working fluid is filled in the chamber. The wick structure is integrally formed on two facing inner surfaces of the first and the second plate by way of mechanical processing, and is projected from the first and second plates toward a central space in the chamber. By integrally forming the wick structure on the first and second plates, the vapor chamber can be manufactured at reduced time and labor to obtain increased yield. A method of manufacturing vapor chamber with integrally formed wick structure is also disclosed.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT PIPE STRUCTURE]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126131.html</link>
            <description><![CDATA[A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first chamber and a working fluid. A first capillary structure is disposed on outer circumference of the second tubular body. The second tubular body is disposed in the first chamber and has a second chamber. In the heat pipe structure, the vapor-phase working fluid flows within the first chamber, while the liquid-phase working fluid flows within the second chamber in separation from the vapor-phase working fluid. Accordingly, the impedance against the vapor is greatly reduced and the heat transfer efficiency is greatly enhanced to achieve excellent heat dissipation effect.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT SINK OF A LARGE AREA]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126130.html</link>
            <description><![CDATA[The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT-DISSIPATING FINS]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126129.html</link>
            <description><![CDATA[The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT PIPE AND METHOD OF MANUFACTURING HEAT PIPE]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126128.html</link>
            <description><![CDATA[The method of manufacturing heat pipe is disclosed to insert a center bar into a metal tube such that the center bar contacts a clearance area of the inner sidewall of the metal tube. Then, the method is to fill the interval between the center bar and the metal tube with powder for sintering. At last, the method is to perform a sintering, extract the center bar, inject working fluid, and close the metal tube. A heat pipe is therefore formed. Because of no sintered powder on the clearance area, the heat pipe can be bent at the clearance area without damaging the capillary structure formed by the sintered powder. The flow path of the working fluid is not interrupted or influenced, so the heat transfer efficiency can be maintained, which overcomes the decrement of the heat transfer efficiency of a bent heat pipe in the prior art.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[HEAT EXCHANGER AND REFRIGERATION AND AIR-CONDITIONING APPARATUS]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126127.html</link>
            <description><![CDATA[A heat exchanger includes a first flat pipe including plural through-holes through which a high-temperature fluid flows, a second flat pipe including plural through-holes through which a low-temperature fluid flows, a first tubular shape inlet header connected to one end of the first flat pipe, a first tubular shape outlet header connected to another end of the first flat pipe, a second tubular shape inlet header connected to one end of the second flat pipe, and a second tubular shape outlet header connected to another end of the second flat pipe. The first and second flat pipes are stacked with contacting flat surfaces. The low-temperature fluid flowing into the through-holes in the second flat pipe from the second inlet header is a fluid in a two-phase gas-liquid state, and flows into those through-holes in a substantially horizontal direction or in an upward direction relative to the substantially horizontal direction.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[Condenser for Vehicle]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126126.html</link>
            <description><![CDATA[A condenser for a vehicle may include first and second headers, a heat-exchanging portion disposed between the first and second headers, a coolant tank mounted at an outer side of the first header and having a coolant inlet and a coolant outlet, the coolant tank to supply the coolant to the heat-exchanging portion and to receive through the first header the coolant passing through the heat-exchanging portion and the second header, and a receiver-drier portion connected to the second header to perform gas-liquid separation and moisture removal from the coolant having passed through the heat-exchanging portion, wherein an inner space of the coolant tank is divided into an upper portion and a lower portion by a first partition disposed between the coolant inlet and the coolant outlet, and a spiral groove for causing the coolant to rotate is formed at the upper portion connected to the coolant inlet.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[THIN HEAT SINK]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126125.html</link>
            <description><![CDATA[The heat sink includes a fastener and a heat pipe. The fastener has a receiving space, an upper claw and a lower claw. The upper claw and the lower claw are formed in the receiving space. The heat pipe has a first end and a second end. The first end is received in the receiving space and clipped between the upper claw and the second claw, and the upper claw or the lower claw is partially embedded in the heat pipe to be flush with each other.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[ENHANCED SURFACE AREA FOR SIDEPLATE HEAT EXCHANGER BRACKET]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126124.html</link>
            <description><![CDATA[A connecting device is used in combination with a heat exchanger. The heat exchanger has orthogonally oriented first and second mount members. The connecting device includes a body having opposed first and second sidewalls. A first sidewall extension is integrally connected to and extends orthogonally with respect to the first sidewall, and includes a first planar mount surface. A second sidewall extension is integrally connected to and extends orthogonally with respect to the second sidewall. The second sidewall extension is oppositely facing with respect to the first sidewall extension and includes a second planar mount surface. A mounting wall extension is integrally connected to and extends orthogonally with respect to the first and second sidewall extensions and includes a third planar mount surface. The first, second and third planar mount surfaces are oriented coplanar with respect to each other and are connected to the first mount member using brazing joints.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[ARCHITECTURAL HEAT AND MOISTURE EXCHANGE]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126123.html</link>
            <description><![CDATA[An architectural heat and moisture exchanger. The exchanger defines an interior channel which is divided into a plurality of sub-channels by a membrane configured to allow passage of water vapor and to prevent substantial passage of air. In some embodiments, the exchanger includes an opaque housing configured to form a portion of a building enclosure, such as an exterior wall, an interior wall, a roof, a floor, or a foundation.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[High-temperature heat store for solar-thermal power plants]]></title>
            <link>http://www.freepatentsonline.com/y2013/0126122.html</link>
            <description><![CDATA[Proposed is a cheap and durable high-temperature heat store which utilizes ambient air as a heat carrier medium and which is at least partially filled with a granular and/or porous storage medium (6).]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[MOLD AND METHOD FOR SECTIONALLY ADJUSTING COOLING EFFICIENCY OF THE MOLD]]></title>
            <link>http://www.freepatentsonline.com/y2013/0125603.html</link>
            <description><![CDATA[The present invention provides a method for sectionally controlling a cooling efficiency of a mold. The method comprises steps of: (a) configuring at least a cooling passage including a first section having a first heat-dissipating inner surface area and a second section having a second heat-dissipating inner surface area in the mold; and (b) adjusting the first and the second heat-dissipating inner surface areas unequally by using a heat-dissipating element.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
        <item>
            <title><![CDATA[AIR CONDITIONER]]></title>
            <link>http://www.freepatentsonline.com/y2013/0125578.html</link>
            <description><![CDATA[An air conditioner is provided. The air conditioner may include a compressor, a condenser, an expansion device and an evaporator. The condenser or the evaporator may include a heat exchange tube formed of an aluminum material and allowing refrigerant to flow therein, and a fin connected to the heat exchange tube, the fin being formed of the same metal material as that of the heat exchange tube so as to prevent potential corrosion of the heat exchange tube.]]></description>
            <pubDate>Thu, 23 May 2013 08:00:00 EDT</pubDate>
        </item>
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