Matches 1 - 39 out of 39


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9842828 Stacked semiconductor package with compliant corners on folded substrate  
One or more embodiments are directed to stacked packages, such as Package-on-Package (PoP) packages, that are stacked on a flexible folded substrate. The stacked packages have compliant corners....
1000
US20170358555 STACKED SEMICONDUCTOR PACKAGE WITH COMPLIANT CORNERS ON FOLDED SUBSTRATE  
One or more embodiments are directed to stacked packages, such as Package-on-Package (PoP) packages, that are stacked on a flexible folded substrate. The stacked packages have compliant corners....
895
US20180096923 TAPELESS LEADFRAME PACKAGE WITH UNDERSIDE RESIN AND SOLDER CONTACT  
The present disclosure is directed to a semiconductor die on a tapeless leadframe and covered in encapsulant. The semiconductor package includes leads formed from the leadframe and electrically...
895
US20160190031 SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS  
One or more embodiments are directed to semiconductor packages with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The...
895
US20160379846 SEMICONDUCTOR PACKAGES SEPARATED USING A SACRIFICIAL MATERIAL  
One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The...
895
US20160190072 STACKED SEMICONDUCTOR PACKAGES WITH CANTILEVER PADS  
One or more embodiments are directed to semiconductor packages, including stacked packages, with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package...
895
9536756 Semiconductor packages separated using a sacrificial material  
One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The...
895
US20160293523 SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE CLIP WITH FLEXIBLE LEADS AND RELATED METHODS  
An integrated circuit (IC) device may include a leadframe and an IC die having a first surface coupled to the lead frame and a second surface opposite the first surface. The IC device may further...
895
US20160183369 LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL  
Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The...
895
US20180130767 METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH SIDEWALL RECESS AND RELATED DEVICES  
A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of the lead frame, and mounting an IC on...
877
US20180197809 SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS  
A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to...
877
US20180144952 SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS  
One or more embodiments are directed to semiconductor packages with one or more cantilever pads and methods of making same. In one embodiment a recess is located in a substrate of the package...
877
10008472 Method for making semiconductor device with sidewall recess and related devices  
A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of the lead frame, and mounting an IC on...
799
9972558 Leadframe package with side solder ball contact and method of manufacturing  
The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a...
799
US20170110340 LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL  
Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The...
731
US20180068932 LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS  
Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral...
731
9947636 Method for making semiconductor device with lead frame made from top and bottom components and related devices  
A method for making a semiconductor device may include bonding a top lead frame component, having recesses, with a bottom lead frame component to form a lead frame, the top and bottom lead frame...
716
US20150348891 METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH LEAD FRAME MADE FROM TOP AND BOTTOM COMPONENTS AND RELATED DEVICES  
A method for making a semiconductor device may include bonding a top lead frame component, having recesses, with a bottom lead frame component to form a lead frame, the top and bottom lead frame...
716
US20170005028 LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS  
Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral...
716
9947612 Semiconductor device with frame having arms and related methods  
A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to...
716
9578744 Leadframe package with pre-applied filler material  
Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The...
716
9847281 Leadframe package with stable extended leads  
Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral...
716
9490146 Semiconductor device with encapsulated lead frame contact area and related methods  
A semiconductor device may include an IC, and lead frame contact areas adjacent the IC. Each lead frame contact area may have a lead opening. The semiconductor device may include bond wires, each...
716
9899236 Semiconductor package with cantilever pads  
One or more embodiments are directed to semiconductor packages with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The...
716
9818675 Semiconductor device including conductive clip with flexible leads and related methods  
An integrated circuit (IC) device may include a leadframe and an IC die having a first surface coupled to the lead frame and a second surface opposite the first surface. The IC device may further...
716
US20150348879 SEMICONDUCTOR DEVICE WITH ENCAPSULATED LEAD FRAME CONTACT AREA AND RELATED METHODS  
A semiconductor device may include an IC, and lead frame contact areas adjacent the IC. Each lead frame contact area may have a lead opening. The semiconductor device may include bond wires, each...
716
9768126 Stacked semiconductor packages with cantilever pads  
One or more embodiments are directed to semiconductor packages, including stacked packages, with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package...
716
US20170162479 SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS  
A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to...
716
US20160379916 METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH SIDEWALL RECESS AND RELATED DEVICES  
A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of the lead frame, and mounting an IC on...
716
US20160293450 SEMICONDUCTOR DEVICE WITH SLOPED SIDEWALL AND RELATED METHODS  
A semiconductor device may include a multi-layer interconnect board having in stacked relation a lower conductive layer, a dielectric layer, and an upper conductive layer. The dielectric layer may...
516
US20170141014 SEMICONDUCTOR PACKAGE WITH INTEGRATED HEATSINK  
One or more embodiments are directed to semiconductor packages having an integrated heatsink and methods of forming same. In one embodiment, a package includes a plurality of leads that support...
516
US20180190576 MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES  
The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the...
516
US20180204786 DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING  
The present disclosure is directed to a die having a metallized sidewall and methods of manufacturing the same. A contiguous metal layer is applied to each edge of a backside of a wafer. The wafer...
516
EP3026696A1 PACKAGE FOR SEMICONDUCTOR DEVICES SENSITIVE TO MECHANICAL AND THERMO-MECHANICAL STRESSES, SUCH AS MEMS PRESSURE SENSORS  
A surface mounting device (50) has one body (6) of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region (15) carrying the body, a cap (20) and...
516
9165867 Semiconductor device with lead frame contact solder balls and related methods  
A semiconductor device may include an integrated circuit (IC), and lead frame contact areas adjacent the IC. Each lead frame contact area may have an opening therein. The semiconductor device may...
413
9627224 Semiconductor device with sloped sidewall and related methods  
A semiconductor device may include a multi-layer interconnect board having in stacked relation a lower conductive layer, a dielectric layer, and an upper conductive layer. The dielectric layer may...
413
9841341 Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors  
A surface mounting device has one body of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals....
413
US20160146692 PACKAGE FOR SEMICONDUCTOR DEVICES SENSITIVE TO MECHANICAL AND THERMO-MECHANICAL STRESSES, SUCH AS MEMS PRESSURE SENSORS  
A surface mounting device has one body of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals....
413
9842794 Semiconductor package with integrated heatsink  
One or more embodiments are directed to semiconductor packages having an integrated heatsink and methods of forming same. In one embodiment, a package includes a plurality of leads that support...
413


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