Matches 151 - 200 out of 232 < 1 2 3 4 5 >


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6137299 Method and apparatus for testing integrated circuit chips  
Formation of a contact probe having a pattern of dendritic textured contacts complementary to that of a contact pad array on a bare chip allows formation of simultaneous temporary connections to...
6114181 Pre burn-in thermal bump card attach simulation to enhance reliability  
The present invention provides a method for detecting integrated circuit component failures that would normally be triggered during the final card attach step of the manufacturing process....
6104082 Metallization structure for altering connections  
A tailorable metallization level between a first set of pads connected to internal circuits of an electronic structure and a second set of pads for external connection provides for altering the...
6091405 Input device  
An input device for a visual display comprising a light source and a scanner for angularly scanning a light beam from the light source across a plane. A photodetector detects interruption of the...
6090660 Method of fabricating a gate connector  
The present invention is a DRAM cell, comprising a transistor having a gate, the gate having an individual segment of gate conductor and a conductive spacer rail wordline in contact with the...
6090507 Methods for repair of photomasks  
A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused...
6078189 Dynamic test reordering  
A method of dynamically modifying a test program makes testing more efficient and less costly while avoiding errors from manual operations. In one embodiment the order of functional tests in the...
6068881 Spin-apply tool having exhaust ring  
A spin-apply tool avoids contamination of a substrate back surface by providing exhaust along or beyond a periphery of a splash shield. The peripheral exhaust pulls a mist of droplets of liquid...
6063687 Formation of trench isolation for active areas and first level conductors  
A trench isolation structure for a semiconductor is provided including an isolation ring and an isolation path. The isolation ring surrounds active semiconductor areas and is bordered on the...
6058496 Self-timed AC CIO wrap method and apparatus  
A method and apparatus for testing a semiconductor chip includes providing the semiconductor chip with a common input/output (I/O) or bidirectional I/O pad. The I/O pad is electrically coupled to...
6037210 Memory cell with transfer device node in selective polysilicon  
A memory cell is constructed with one electrode of the transfer device extending over a trench capacitor, saving about 6.5% of cell area. Selective polysilicon for a strap seeded from the trench...
6036821 Enhanced collimated sputtering apparatus and its method of use  
A sputtering apparatus using a collimator disposed between a wafer holder for holding a wafer and a target to intercept some of the particles ejected from the target, wherein the collimator is...
6030855 Self-aligned connector for stacked chip module  
A semiconductor structure includes a stack of two semiconductor chips. An edge of the chips forms a side surface of the stack. Insulation and adhesive is located between the chips, and a wire...
6022791 Chip crack stop  
A serpentine pattern has been found to be effective at interrupting propagation of delamination cracks in thin film layers. The ring is provided on a semiconductor chip to suppress crack...
6022781 Method for fabricating a MOSFET with raised STI isolation self-aligned to the gate stack  
A semiconductor structure comprising a transistor having a gate conductor that has first and second edges bounded by raised isolation structures (e.g. STI). A source diffusion is self-aligned to...
6020750 Wafer test and burn-in platform using ceramic tile supports  
A plurality of multilayer glass-ceramic substrates are arranged in coplanar relationship in a tile pattern within a support platform. The glass-ceramic substrates and the support platform are both...
6020250 Stacked devices  
Chips having subsurface structures within or adjacent a horizontal trench in bulk single crystal semiconductor are presented. Structures include three terminal devices, such as FETs and bipolar...
5998569 Environmentally stable optical filter materials  
A composition of matter comprising a polyamic acid/ester having an amide pendant group directly substituting an acid site of the polyamic acid is provided, which composition when cured provides a...
5996601 Polymer protected component  
The present invention is a method and apparatus for mechanically bonding a polymer to a convex surface of a substrate to provide intimate contact therebetween for improved energy transport between...
5993615 Method and apparatus for detecting arcs  
The present invention is a thin film deposition tool with arc detection capabilities. An arc detector is provided in the power supply line between the power supply and the sputter deposition tool....
5983380 Weighted random pattern built-in self-test  
An integrated circuit comprising logic circuits and self-test circuits for testing logic circuits including a pseudo random pattern generator for generating at least one pseudo random pattern and...
5981992 Mechanical supports for very thin stacked capacitor plates  
A stacked capacitor having very thin fins and subminimum dimension supports for the fins is described. The capacitor includes a stack of conductive layers on a substrate. A plurality of subminimum...
5978501 Adaptive inspection method and system  
A method and system for detecting defects in the design of a photolithographic mask or a printed wafer. It derives an adaptive inspection algorithm that allows for a tighter inspection of a mask...
5977787 Large area multiple-chip probe assembly and method of making the same  
A multiple-chip probe assembly suitable for wafer testing over a wide temperature range includes a plurality of individual buckling beam probe elements. A support structure supports the plurality...
5972765 Use of deuterated materials in semiconductor processing  
Method of forming a film for a semiconductor device in which a source material comprising a deuterated species is provided during formation of the film.
5963329 Method and apparatus for measuring the profile of small repeating lines  
A method for nondestructively determining the line profile or topographical cross-section of repeating lines on a substrate is provided, including line thickness, line width, and the shape of the...
5959845 Universal chip carrier connector  
A circuit board for receiving different chip modules at each chip module site has a site for receiving a chip module having electrical connectors thereon and a first set of contacts at the chip...
5956575 Microconnectors  
Microconnectors are described that can be fabricated on circuitry, the microconnectors for physically and/or electrically connecting separate structures. The microconnectors permit partitioning of...
5952160 Method and system for controlling the relative size of images formed in light-sensitive media  
A method of exposing a radiation-sensitive medium through a mask and using an imaging system having a given depth of focus to control for pattern dependent distortion. The steps comprise:...
5947053 Wear-through detector for multilayered parts and methods of using same  
The present invention relates to wear-through detection in multilayered parts. This invention specifically encompasses, in one aspect, wear-through detection in semiconductor vacuum processing...
5935763 Self-aligned pattern over a reflective layer  
An opening in an insulator on a substrate is self-aligned to a reflective region on the substrate. The opening is formed by shining blanket radiation on photoresist on the insulator and developing...
5933309 Apparatus and method for monitoring the effects of contact resistance  
An electronic module tester measures the difference between the voltage provided by the tester during testing and the voltage actually delivered to an electronic device. The difference corresponds...
5932908 Trench EPROM  
A two-device nonvolatile memory cell is described. The cell comprises a planar FET and a vertical FET in series. The vertical FET has a floating gate that is predominantly capacitively coupled to...
5930640 Mechanical supports for very thin stacked capacitor plates  
A stacked capacitor having very thin fins and subminimum dimension supports for the fins is described. The capacitor includes a stack of conductive layers on a substrate. A plurality of subminimum...
5930619 Method of making trench EPROM simultaneously with forming a DRAM cell  
A two-device nonvolatile memory cell is described. The cell comprises a planar FET and a vertical FET in series. The vertical FET has a floating gate that is predominantly capacitively coupled to...
5904502 Multiple 3-dimensional semiconductor device processing method and apparatus  
A method of making a multiple 3-dimensional semiconductor device substrate includes the steps of providing a plurality of devices each device including a semiconductor die and having a reference...
5903059 Microconnectors  
Microconnectors are described that can be fabricated on circuitry, the microconnectors for physically and/or electrically connecting separate structures. The microconnectors permit partitioning of...
5903045 Self-aligned connector for stacked chip module  
A semiconductor structure includes a stack of two semiconductor chips. An edge of the chips forms a side surface of the stack. Insulation and adhesive is located between the chips, and a wire...
5888838 Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information  
A method is described by which the mechanical strength of chips of semiconductor devices can be controlled by appropriate wafer finishing and sorted by knowledge of the finishing method and chip...
5882823 Fib repair method  
A method of repairing a defect on a substrate includes the steps of shining a beam, such as a focused ion beam, on a substrate to remove a portion of the defect and to leave a thin wall of the...
5874895 Method and apparatus for testing operation of a sensor controlled device  
The present invention is directed to a method and apparatus for testing the operation of a sensor controlled monitor device by using a test device connected in parallel to the monitor device. When...
5868882 Polymer protected component  
The present invention is a method and apparatus for mechanically bonding a polymer to a convex surface of a substrate to provide intimate contact therebetween for improved energy transport between...
5842825 Incremented rotated wafer placement on electro-static chucks for metal etch  
A method of orienting wafers in an apparatus having a wafer receiving-workpiece holder such as an electro-static chuck for processing of the wafers and eliminating etch debris build-up at the...
5801089 Method of forming stacked devices  
Chips having subsurface structures within or adjacent a horizontal trench in bulk single crystal semiconductor are presented. Structures include three terminal devices, such as FETs and bipolar...
5796990 Hierarchical fault modeling system and method  
A system and method for generating a fault model for a logic circuit includes a data storage device for storing information relative to fault models or primitive elements in a logic circuit and...
5794017 Method and system of updating graphics memory in a graphics display system through multiple address transferring of pixel data  
The graphics display system comprises a data bus for transferring a set of application pixels, wherein a set consists of W number of blocks of data, and wherein each application pixel is M number...
5789324 Uniform gas flow arrangements  
A uniform gas flow is provided at the surface of a planar device or wafer in a processing system having a substantially cylindrical chamber through which processing gases flow toward an...
5782690 Curtain fire damper  
A damper door system that includes an opening in a planar wall, a retractable damper door and a track extending through said opening. The damper door includes slots that are conformable to the...
5776801 Leadframe having contact pads defined by a polymer insulating film  
A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided....
5764342 Method and system for controlling the relative size of images formed in light-sensitive media  
A method of exposing a radiation-sensitive medium through a mask and using an imaging system having a given depth of focus to control for pattern dependent distortion. The steps comprise:...


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