Matches 1 - 50 out of 75 1 2 >
Match Document Document Title
7405487 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7385298 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7378723 Method and apparatus for decoupling conductive portions of a microelectronic device package  
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7365424 Microelectronic component assemblies with recessed wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7332376 Method of encapsulating packaged microelectronic devices with a barrier  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7307340 Wafer-level electronic modules with integral connector contacts  
An electronic module comprises a monolithic microelectronic substrate including at least one integrated circuit die, e.g., a plurality of unseparated memory dice or a mixture of different types of...
7306974 Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies  
Packaged microelectronic devices, methods for packaging microelectronic devices, and methods of operating microelectronic devices. In one embodiment, a packaged microelectronic device comprises a...
7298025 Microelectronic component assemblies and microelectronic component lead frame structures  
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of...
7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7259451 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7250328 Microelectronic component assemblies with recessed wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7247520 Microelectronic component assemblies and microelectronic component lead frame structures  
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of...
7218001 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components  
The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one...
7195957 Packaged microelectronic components  
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
7183485 Microelectronic component assemblies having lead frames adapted to reduce package bow  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the...
7183138 Method and apparatus for decoupling conductive portions of a microelectronic device package  
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member...
7157310 Methods for packaging microfeature devices and microfeature devices formed by such methods  
Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one...
7132734 Microelectronic component assemblies and microelectronic component lead frame structures  
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of...
7122905 Microelectronic devices and methods for mounting microelectronic packages to circuit boards  
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
7109588 Method and apparatus for attaching microelectronic substrates and support members  
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
7101737 Method of encapsulating interconnecting units in packaged microelectronic devices  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7095122 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7091064 Method and apparatus for attaching microelectronic substrates and support members  
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
7071421 Stacked microfeature devices and associated methods  
Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding...
7067905 Packaged microelectronic devices including first and second casings  
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
7057281 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7049685 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices  
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
7041537 Method for fabricating semiconductor component with on board capacitor  
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the...
7037756 Stacked microelectronic devices and methods of fabricating same  
Certain methods of the invention permit spacerless manufacture of stacked microelectronic devices by mechanically supporting a second microelectronic component with a wire coating. This wire...
7037751 Fabrication of stacked microelectronic devices  
Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a...
7022418 Fabrication of stacked microelectronic devices  
Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a...
7002248 Semiconductor components having multiple on board capacitors  
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the...
6995026 Methods for coupling a flowable conductive material to microelectronic substrates  
A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus...
6983551 Interconnecting substrates for electrical coupling of microelectronic components  
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
6982386 Interconnecting substrates for electrical coupling of microelectronic components  
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
6979595 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices  
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
6951982 Packaged microelectronic component assemblies  
Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular...
6943450 Packaged microelectronic devices and methods of forming same  
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
6936916 Microelectronic assemblies and electronic devices including connection structures with multiple elongated members  
A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus...
6933170 Packaged microelectronic component assemblies  
Various aspects of the present invention provide microelectronic component assemblies and methods for packaging such assemblies. In one example, a microelectronic component assembly includes a...
6924550 Packaged microelectronic devices and methods for assembling microelectronic devices  
Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an...
6921860 Microelectronic component assemblies having exposed contacts  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
6906409 Multichip semiconductor package  
A multichip semiconductor package and method of making is provided that has a plurality of semiconductor chips fabricated in electrical isolation one from another integrally on a singular...
6896760 Fabrication of stacked microelectronic devices  
Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a...
6891248 Semiconductor component with on board capacitor  
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the...
6882021 Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead  
Packaged microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, the device includes an image sensor die having a first side with a...
6879050 Packaged microelectronic devices and methods for packaging microelectronic devices  
Methods and apparatuses for packaging a microelectronic device. One embodiment can include a packaged microelectronic device comprising a microelectronic die, an interposer substrate, and a casing...
6876066 Packaged microelectronic devices and methods of forming same  
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
6870276 Apparatus for supporting microelectronic substrates  
058804113 A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The...
Matches 1 - 50 out of 75 1 2 >