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7366575 Wafer polishing control  
Methods of controlling polishing of wafers are disclosed. In one aspect, a method may include measuring one or more pre-polish thicknesses of one or more layers of a wafer. The one or more layers...
7074118 Polishing carrier head with a modified pressure profile  
A polishing carrier head including a retaining ring for defining an area of a polishing pocket region used to polish a predetermined object, is provided. The polishing carrier head may further...
Matches 1 - 2 out of 2