Matches 1 - 17 out of 17
Match Document Document Title
7429536 Methods for forming arrays of small, closely spaced features  
Methods of forming arrays of small, densely spaced holes or pillars for use in integrated circuits are disclosed. Various pattern transfer and etching steps can be used, in combination with...
7419852 Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies  
Low temperature processed back side redistribution lines (RDLs) are disclosed. Low temperature processed back side RDLs may be electrically connected to the active surface devices of a...
7413981 Pitch doubled circuit layout  
In one embodiment of the present invention, a method for connecting a plurality of bit lines to sense circuitry includes providing a plurality of bit lines extending from a memory array in a first...
7396781 Method and apparatus for adjusting feature size and position  
Variations in the pitch of features formed using pitch multiplication are minimized by separately forming at least two sets of spacers. Mandrels are formed and the positions of their sidewalls are...
7393789 Protective coating for planarization  
Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed,...
7390746 Multiple deposition for integration of spacers in pitch multiplication process  
Pitch multiplication is performed using a two step process to deposit spacer material on mandrels. The precursors of the first step react minimally with the mandrels, forming a barrier layer...
7368362 Methods for increasing photo alignment margins  
Methods and structures are provided for increasing alignment margins when contacting pitch multiplied interconnect lines with other conductive features in memory devices. The portions of the lines...
7361569 Methods for increasing photo-alignment margins  
Methods and structures are provided for increasing alignment margins when contacting pitch multiplied interconnect lines with other conductive features in memory devices. The portions of the lines...
7323778 Semiconductor device with improved design freedom of external terminal  
A semiconductor device comprises: a semiconductor chip; an extension portion formed in contact with the side surfaces so as to surround the semiconductor chip; an insulating film formed on a...
7322138 Shelf edge sign holder  
A sign holder for a retail display comprises a resilient plastic molded body. The body includes two or more resilient clasps projecting from a common base to resiliently hold a retail display sign...
7301229 Electrostatic discharge (ESD) protection for integrated circuit packages  
An integrated circuit package includes a package substrate with a plurality of pins coupled to a semiconductor chip having a plurality of bond pads, some of which are ic bond pads coupled to an...
7268054 Methods for increasing photo-alignment margins  
Methods and structures are provided for increasing alignment margins when contacting pitch multiplied interconnect lines with other conductive features in memory devices. The portions of the lines...
7256116 Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts  
A method for fabricating a semiconductor component includes the steps of providing a semiconductor die, forming a plurality of redistribution contacts on the die, forming a plurality of...
7223634 Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus  
Exemplary embodiments of the present invention include a semiconductor device, a method for manufacturing the same, a circuit board and an electronic apparatus with increased productivity and...
7041537 Method for fabricating semiconductor component with on board capacitor  
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the...
7002248 Semiconductor components having multiple on board capacitors  
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the...
6916725 Method for manufacturing semiconductor device, and method for manufacturing semiconductor module  
To form through electrodes effectively without deteriorating the quality of the through electrodes, a semiconductor substrate is spin etched at its back surface, thereby thinning down the...
Matches 1 - 17 out of 17