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7366575 Wafer polishing control  
Methods of controlling polishing of wafers are disclosed. In one aspect, a method may include measuring one or more pre-polish thicknesses of one or more layers of a wafer. The one or more layers...
6736696 Method of improving uniformity control on wafers during chemical mechanical polishing  
A method of improving uniformity control in chemical mechanical polishing (CMP). A CMP apparatus is provided with at least a platen, a polishing pad disposed on the platen and at least a polishing...
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