Matches 1 - 22 out of 22
Match Document Document Title
7393718 Unmolded package for a semiconductor device  
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such...
7371616 Clipless and wireless semiconductor die package and method for making the same  
A method for making a semiconductor die package is disclosed. In some embodiments, the method includes using a leadframe structure including at least one lead structure having a lead surface. A...
7368374 Super high density module with integrated wafer level packages  
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
7301235 Semiconductor device module with flip chip devices on a common lead frame  
The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each...
7285849 Semiconductor die package using leadframe and clip and method of manufacturing  
A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead...
7256072 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device  
A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor...
7230329 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device  
A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes onto lands, which are formed on a first carrier substrate,...
7217594 Alternative flip chip in leaded molded package design and method for manufacture  
A semiconductor package is disclosed. The package includes a leadframe structure comprising a die attach region and plurality of leads. A molding material is molded around at least a portion of the...
7202113 Wafer level bumpless method of making a flip chip mounted semiconductor device package  
A wafer level bumpless method of making flip chip mounted semiconductor device packages is disclosed. The method includes the steps of solder mask coating a semiconductor die wafer frontside,...
7196313 Surface mount multi-channel optocoupler  
An optocoupler package is disclosed. The optocoupler package includes a substrate comprising a leadframe and a molding compound, and a plurality of optocouplers, each optocoupler including (i) an...
7154168 Flip chip in leaded molded package and method of manufacture thereof  
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when...
7122884 Robust leaded molded packages and methods for forming the same  
A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach...
7101734 Flip chip substrate design  
A chip device that includes a leadframe that has a die attach cavity. The memory device further includes a die that is placed within the die attach cavity. The die attach cavity is substantially...
7091619 Semiconductor device, semiconductor package, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device  
A method is provided to enhance the connection reliability in three-dimensional mounting while considering the warping of packages. Opening diameters of the openings provided corresponding to...
7052938 Flip clip attach and copper clip attach on MOSFET device  
A chip device including a leadframe that includes source and gate connections, a bumped die including solder bumps on a top side that is attached to the leadframe such that the solder bumps contact...
7029947 Flip chip in leaded molded package with two dies  
A chip device including two stacked dies. The chip device includes a leadframe that includes a plurality of leads. A first die is coupled to a first side of the leadframe with solder and a second...
7008868 Passivation scheme for bumped wafers  
A bumped wafer for use in making a chip device. The bumped wafer includes two titanium layers sputtered alternatingly with two copper layers over a non-passivated die. The bumped wafer further...
6989588 Semiconductor device including molded wireless exposed drain packaging  
A semiconductor device including a leadframe and a die coupled thereto. A drain pad is coupled to the drain region of the die in a body that substantially envelopes the leadframe and the die. The...
6953998 Unmolded package for a semiconductor device  
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such...
6949410 Flip chip in leaded molded package and method of manufacture thereof  
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when...
6870254 Flip clip attach and copper clip attach on MOSFET device  
A chip device including a leadframe that includes source and gate connections, a bumped die including solder bumps on a top side that is attached to the leadframe such that the solder bumps contact...
6798044 Flip chip in leaded molded package with two dies  
A chip device including two stacked dies. The chip device includes a leadframe that includes a plurality of leads. A first die is coupled to a first side of the leadframe with solder and a second...
Matches 1 - 22 out of 22