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7411237 |
Lanthanum hafnium oxide dielectrics
Dielectric layers containing a lanthanum hafnium oxide layer, where the lanthanum hafnium oxide layer is arranged as a structure of one or more monolayers, provide an insulating layer in a variety...
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7410668 |
Methods, systems, and apparatus for uniform chemical-vapor depositions
Integrated circuits, the key components in thousands of electronic and computer products, are generally built layer by layer on a silicon substrate. One common technique for forming layers is...
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7405454 |
Electronic apparatus with deposited dielectric layers
An atomic layer deposited dielectric layer and a method of fabricating such a dielectric layer produce a reliable dielectric layer having an equivalent oxide thickness thinner than attainable using...
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7378719 |
Low leakage MIM capacitor
Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between...
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7368343 |
Low leakage MIM capacitor
Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between...
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7329615 |
Atomic layer deposition method of forming an oxide comprising layer on a substrate
This invention includes atomic layer deposition methods of depositing oxide comprising layers on substrates. In one implementation, a substrate is positioned within a deposition chamber. A first...
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7326980 |
Devices with HfSiON dielectric films which are Hf-O rich
A dielectric film containing atomic layer deposited HfSiON and a method of fabricating such a dielectric film produce a reliable dielectric layer having an equivalent oxide thickness thinner than...
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7288808 |
Capacitor constructions with enhanced surface area
A capacitor fabrication method may include forming a first capacitor electrode over a substrate, the first electrode having an inner surface area per unit area and an outer surface area per unit...
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7279041 |
Atomic layer deposition methods and atomic layer deposition tools
An atomic layer deposition method includes positioning a plurality of semiconductor wafers into an atomic layer deposition chamber. Deposition precursor is emitted from individual gas inlets...
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7235501 |
Lanthanum hafnium oxide dielectrics
Dielectric layers containing a lanthanum hafnium oxide layer, where the lanthanum hafnium oxide layer is formed as a structure of one or more monolayers, and methods of fabricating such dielectric...
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7217615 |
Capacitor fabrication methods including forming a conductive layer
A capacitor fabrication method may include atomic layer depositing a conductive barrier layer to oxygen diffusion over the first electrode. A method may instead include chemisorbing a layer of a...
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7199023 |
Atomic layer deposited HfSiON dielectric films wherein each precursor is independendently pulsed
A dielectric film containing atomic layer deposited HfSiON and a method of fabricating such a dielectric film produce a reliable dielectric layer having an equivalent oxide thickness thinner than...
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7199001 |
Method of forming MIM capacitor electrodes
A novel method for forming electrodes in the fabrication of an MIM (metal-insulator-metal) capacitor, is disclosed. The method improves MIM capacitor performance by preventing plasma-induced damage...
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7183186 |
Atomic layer deposited ZrTiO4 films
After pulsing the second purging gas, a zirconium-containing precursor is pulsed into reaction chamber 220, at block 430. In an embodiment, the zirconium-containing precursor is ZTB. In other...
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7170174 |
Contact structure and contact liner process
A contact structure and a method of forming thereof for semiconductor devices or assemblies are described. The method provides process steps to create a contact structure encompassed by a...
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7160577 |
Methods for atomic-layer deposition of aluminum oxides in integrated circuits
The present inventors devised unique atomic-layer deposition systems, methods, and apparatus suitable for aluminum-oxide deposition. One exemplary method entails providing an outer chamber...
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7119034 |
Atomic layer deposition method of forming an oxide comprising layer on a substrate
This invention includes atomic layer deposition methods of depositing oxide comprising layers on substrates. In one implementation, a substrate is positioned within a deposition chamber. A first...
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7112503 |
Enhanced surface area capacitor fabrication methods
A capacitor fabrication method may include atomic layer depositing a conductive barrier layer to oxygen diffusion over the first electrode. A method may instead include chemisorbing a layer of a...
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7109542 |
Capacitor constructions having a conductive layer
A capacitor fabrication method may include atomic layer depositing a conductive barrier layer to oxygen diffusion over the first electrode. A method may instead include chemisorbing a layer of a...
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7105065 |
Metal layer forming methods and capacitor electrode forming methods
A capacitor electrode forming method includes chemisorbing a layer of at least one metal precursor at least one monolayer thick on a substrate, the layer including non-metal components from the...
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7081421 |
Lanthanide oxide dielectric layer
A ruthenium gate for a lanthanide oxide dielectric layer and a method of fabricating such a combination gate and dielectric layer produce a reliable structure for use in a variety of electronic...
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7067438 |
Atomic layer deposition method of forming an oxide comprising layer on a substrate
This invention includes atomic layer deposition methods of depositing oxide comprising layers on substrates. In one implementation, a substrate is positioned within a deposition chamber. A first...
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7053432 |
Enhanced surface area capacitor fabrication methods
A capacitor fabrication method may include forming a first capacitor electrode over a substrate and atomic layer depositing an insulative barrier layer to oxygen diffusion over the first electrode....
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7018675 |
Method for forming a ruthenium metal layer
A method for forming a ruthenium metal layer comprises combining a ruthenium precursor with a measured amount of oxygen to form a ruthenium oxide layer. The ruthenium oxide is annealed in the...
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6946342 |
Semiconductor device and method for manufacturing the same
A semiconductor device and a method for forming the same. A dielectric layer is formed on a semiconductor substrate or on a lower electrode of a capacitor. Vacuum annealing is performed on the...
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6916380 |
System for depositing a layered film
The present invention relates to an electrically conductive film stack for semiconductors and methods and apparatus for providing same. A film stack comprising a first layer of a platinum-rhodium...
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6916374 |
Atomic layer deposition methods and atomic layer deposition tools
An atomic layer deposition method includes positioning a plurality of semiconductor wafers into an atomic layer deposition chamber. Deposition precursor is emitted from individual gas inlets...
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6897106 |
Capacitor of semiconductor memory device that has composite Al2O3/HfO2 dielectric layer and method of manufacturing the same
A semiconductor memory device that includes a composite Al 2 O 3 /HfO 2 dielectric layer with a layer thickness ratio greater than or equal to 1, and a method of manufacturing the capacitor are...
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6896730 |
Atomic layer deposition apparatus and methods
An atomic layer deposition method includes positioning a semiconductor substrate within an atomic layer deposition chamber. A fixed volume first precursor gas charge is provided within a gas flow...
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6852167 |
Methods, systems, and apparatus for uniform chemical-vapor depositions
Integrated circuits, the key components in thousands of electronic and computer products, are generally built layer by layer on a silicon substrate. One common technique for forming layers is...
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6759705 |
Platinum-rhodium stack as an oxygen barrier in an integrated circuit capacitor
The present invention relates to an electrically conductive film stack for semiconductors and methods and apparatus for providing same. A film stack comprising a first layer of a platinum-rhodium...
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6740554 |
Methods to form rhodium-rich oxygen barriers
A structure and method are disclosed for forming a capacitor for an integrated circuit. The capacitor includes a rhodium-rich structure, a rhodium oxide layer in direct contact with the...
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