Matches 1 - 34 out of 34
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7368014 Variable temperature deposition methods  
A deposition method may include, at a first temperature, contacting a substrate with a first precursor and chemisorbing a first layer at least one monolayer thick over the substrate. At a second...
7356377 System, method, and medium for monitoring performance of an advanced process control system  
A method for monitoring performance of an advanced process control system for at least one process output includes calculating a variance of a prediction error for a processing performance and/or a...
7354332 Technique for process-qualifying a semiconductor manufacturing tool using metrology data  
A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with...
7349753 Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error  
A method, system and medium are provided for enabling improved feedback and feedforward control. An error, or deviation from target result, is observed during manufacture of semi conductor chips....
7337019 Integration of fault detection with run-to-run control  
Semiconductor wafers are processed in conjunction with a manufacturing execution system using a run-to-run controller and a fault detection system. A recipe is received from the manufacturing...
7333871 Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools  
A method, system and medium of automation performed on a semiconductor manufacturing tool. The method creates a designed set of experiments for the tool and runs the created set of experiments. The...
7272459 Method, system and medium for controlling manufacture process having multivariate input parameters  
A method, system, and medium of modeling and/or for controlling a manufacturing process is disclosed. In particular, a method according to embodiments of the present invention includes the step of...
7225047 Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements  
Methods, systems, and mediums of controlling a semiconductor manufacturing process are described. The method comprises the steps of measuring at least one critical dimension of at least one device...
7221990 Process control by distinguishing a white noise component of a process variance  
A method, system and medium is provided for enabling improved control systems. An error, or deviation from a target result, is observed for example during manufacture of semiconductor chips. The...
7205228 Selective metal encapsulation schemes  
A method and system of processing a semiconductor substrate includes, in one or more embodiments, depositing a protective layer on the substrate surface comprising a conductive element disposed in...
7201936 Method of feedback control of sub-atmospheric chemical vapor deposition processes  
A method of film deposition in a sub-atmospheric chemical vapor deposition (CVD) process includes (a) providing a model for sub-atmospheric CVD deposition of a film that identifies one or more film...
7192888 Low selectivity deposition methods  
A deposition method includes forming a nucleation layer over a substrate, forming a layer of a first substance at least one monolayer thick chemisorbed on the nucleation layer, and forming a layer...
7189626 Electroless plating of metal caps for chalcogenide-based memory devices  
A method of forming a metal cap over a conductive interconnect in a chalcogenide-based memory device is provided and includes, forming a layer of a first conductive material over a substrate,...
7188142 Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility  
A system, method and medium of sending messages in a distributed data processing network is described, and contemplates receiving a message that includes subject information that is generated based...
7174230 Computer integrated manufacturing techniques  
The present invention provides a novel distributed factory system framework including a novel factory automation lifecycle ( 200 ) having lifecycle activities for SW developing and integrating (...
7160739 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles  
A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies...
7102235 Conformal lining layers for damascene metallization  
Method and structures are provided for conformal lining of dual damascene structures in integrated circuits. Trenches and contact vias are formed in insulating layers. The trenches and vias are...
7101799 Feedforward and feedback control for conditioning of chemical mechanical polishing pad  
A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a...
7096085 Process control by distinguishing a white noise component of a process variance  
A method, system and medium is provided for enabling improved control systems. An error, or deviation from a target result, is observed for example during manufacture of semiconductor chips. The...
7094690 Deposition methods and apparatuses providing surface activation  
A deposition method includes, at a first temperature, contacting a substrate with a surface activation agent and adsorbing a first layer over the substrate. At a second temperature greater than the...
7087535 Deposition methods  
A deposition method includes contacting a substrate with a first initiation precursor and forming a first portion of an initiation layer on the substrate. At least a part of the substrate is...
7082345 Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities  
The invention relates to a method, system and computer program useful for producing a product, such as a microelectronic device, for example in an assembly line, where the production facility...
7069101 Computer integrated manufacturing techniques  
The present invention provides a novel distributed factory system framework including a novel factory automation lifecycle ( 200 ) having lifecycle activities for SW developing and integrating (...
7047099 Integrating tool, module, and fab level control  
Semiconductor wafers are processed in a fab in a manner that integrates control at multiple functional unit levels. Examples of functional units include fabs, modules, tools, and the like....
6999836 Method, system, and medium for handling misrepresentative metrology data within an advanced process control system  
A system, method and medium of controlling a semiconductor manufacturing tool using a feedback control mechanism. The feedback control mechanism includes features for receiving data points relating...
6987073 Low selectivity deposition methods  
A deposition method includes forming a nucleation layer over a substrate, forming a layer of a first substance at least one monolayer thick chemisorbed on the nucleation layer, and forming a layer...
6984198 Experiment management system, method and medium  
Systems, methods and mediums are provided for automating experiments within an automated environment without the need to disassociate the test subject (e.g., the semiconductor chip or chips) from...
6961626 Dynamic offset and feedback threshold  
A method, system and medium are provided for enabling improved feedback and feedforward control. An error, or deviation from target result, is observed during manufacture of semi conductor chips....
6951816 Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst  
A metal layer is formed by means of an electroless plating process, wherein a surface region of an underlying material is catalytically activated in that a catalyst is deposited or incorporated by...
6913938 Feedback control of plasma-enhanced chemical vapor deposition processes  
A method of film deposition in a chemical vapor deposition (CVD) process includes (a) providing a model for CVD deposition of a film that defines a plurality of regions on a wafer and identifies...
6910947 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life  
A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a...
6708074 Generic interface builder  
Generic interface adapter builder software generates an interface adapter to tie tools into a centralized manufacturing execution system. As contemplated by embodiments of the present invention,...
6640151 Multi-tool control system, method and medium  
A system/method for interactively monitoring and adjusting product output from a module that includes two or more preparation tools. The output is a result of the coordinated effort of the two or...
6627260 Deposition methods  
A deposition method includes contacting a substrate with a first initiation precursor and forming a first portion of an initiation layer on the substrate. At least a part of the substrate is...
Matches 1 - 34 out of 34