Matches 1 - 8 out of 8
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7372129 Two die semiconductor assembly and system including same  
A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the...
7368320 Method of fabricating a two die semiconductor assembly  
A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the...
7273767 Method of manufacturing a cavity package  
A method of making a package for an integrated circuit die. In one embodiment the method comprises providing a semiconductor wafer having a plurality of integrated circuit die formed thereon, each...
7109588 Method and apparatus for attaching microelectronic substrates and support members  
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
7091064 Method and apparatus for attaching microelectronic substrates and support members  
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
6960491 Integrated circuit packaging for improving effective chip-bonding area  
A packaging process for improving effective chip-bonding area is disclosed in the present invention. An A-stage liquid paste is formed on a substrate and partially cured to become a B-stage film...
6784538 Heat transfer structure for a semiconductor device utilizing a bismuth glass layer  
The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said...
6768193 Heat transfer structure for a semiconductor device utilizing a bismuth glass layer  
The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said...
Matches 1 - 8 out of 8