Matches 1 - 50 out of 60 1 2 >
Match Document Document Title
7408245 IC package encapsulating a chip under asymmetric single-side leads  
A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a...
7372129 Two die semiconductor assembly and system including same  
A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the...
7368320 Method of fabricating a two die semiconductor assembly  
A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the...
7361533 Stacked embedded leadframe  
A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of...
7332375 Method of making an integrated circuit package  
A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces...
7321162 Semiconductor package having reduced thickness  
A semiconductor package is disclosed that comprises a chip paddle and a semiconductor chip that has a plurality of bond pads. The semiconductor chip is located on an upper surface of the chip...
7253503 Integrated circuit device packages and substrates for making the packages  
Integrated circuit device packages and substrates for making the packages are disclosed. One embodiment of a substrate includes a planar sheet of polyimide having a first surface, an opposite...
7247523 Two-sided wafer escape package  
A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an...
7245007 Exposed lead interposer leadframe package  
An interposer for use in an external lead or land pattern semiconductor package. The interposer includes an interposer body which is molded from a dielectric material. The interposer body defines...
7217991 Fan-in leadframe semiconductor package  
A semiconductor package comprising a plurality of elongate leads which each have opposed inner and outer ends, opposed first and second surfaces, and a third surface which is disposed in opposed...
7214326 Increased capacity leadframe and semiconductor package using the same  
In accordance with the present invention, there is provided a method for manufacturing a semiconductor package. The method comprises the initial step of applying first and second photoresist layers...
7211879 Semiconductor package with chamfered corners and method of manufacturing the same  
A semiconductor package comprising a die paddle defining multiple corners and opposed first and second surfaces. At least one set of leads extends at least partially about the die paddle in spaced...
7211471 Exposed lead QFP package fabricated through the use of a partial saw process  
A QFP exposed pad package which includes leads exposed within the bottom surface of the package body of the package in addition to those gull-wing leads protruding from the sides of the package...
7202554 Semiconductor package and its manufacturing method  
A semiconductor package comprising paddle and a plurality of leads which extend at least partially about the die paddle in spaced relation thereto. Attached to the die paddle is a semiconductor die...
7192807 Wafer level package and fabrication method  
A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising...
7190062 Embedded leadframe semiconductor package  
A semiconductor package comprising a substrate having opposed top and bottom surfaces and a conductive pattern formed thereon. Disposed on the top surface of the substrate is a semiconductor die...
7183630 Lead frame with plated end leads  
A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of...
7176062 Lead-frame method and assembly for interconnecting circuits within a circuit module  
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are...
7170150 Lead frame for semiconductor package  
A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting...
7144517 Manufacturing method for leadframe and for semiconductor package using the leadframe  
In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer,...
7138707 Semiconductor package including leads and conductive posts for providing increased functionality  
A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the...
7115445 Semiconductor package having reduced thickness  
A semiconductor package is disclosed that comprises a chip paddle and a semiconductor chip that has a plurality of bond pads. The semiconductor chip is located on an upper surface of the chip...
7112474 Method of making an integrated circuit package  
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
7095103 Leadframe based memory card  
A media card comprising a leadframe having first and second die pads, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts towards the first...
7091594 Leadframe type semiconductor package having reduced inductance and its manufacturing method  
A semiconductor die comprising a heat sink having opposed top and bottom surfaces and defining a peripheral edge. Attached to the top surface of the heat sink is a semiconductor die. Extending at...
7071541 Plastic integrated circuit package and method and leadframe for making the package  
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
7071033 Method for forming semiconductor device including stacked dies  
A semiconductor device including a leadframe and two stacked dies, a first of which is on a top surface of a leadframe while the second one is on a bottom surface of the leadframe. The drain region...
7067908 Semiconductor package having improved adhesiveness and ground bonding  
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
7064009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same  
A thermally enhanced, chip-scale, Lead-on-Chip (“LOC”) semiconductor package includes a substrate having a plurality of metal lead fingers in it. A semiconductor chip having an active surface...
7057280 Leadframe having lead locks to secure leads to encapsulant  
A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the...
7057268 Cavity case with clip/plug for use on multi-media card  
An electronic device such as a storage device or memory card comprising a unitary case having opposed first and second sides, a closed first end, an open second end, and an interior chamber...
7045883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same  
A thermally enhanced, chip-scale, Lead-on Chip (“LOC”) semiconductor packages includes a substrate having a plurality of metal lead fingers in it. A semiconductor chip having an active surface...
7045882 Semiconductor package including flip chip  
A semiconductor package comprising a plurality of leads. Each of the leads defines opposed first and second surfaces. Also included in the semiconductor package is a semiconductor chip which...
7045396 Stackable semiconductor package and method for manufacturing same  
Leadframe-type semiconductor packages that allow the semiconductor packages to be stacked on top of each other. One aspect of the semiconductor package includes a leadframe, a plurality of...
7030474 Plastic integrated circuit package and method and leadframe for making the package  
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
7008825 Leadframe strip having enhanced testability  
A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an...
7005326 Method of making an integrated circuit package  
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
7001799 Method of making a leadframe for semiconductor devices  
A semiconductor package comprising a leadframe which includes a die paddle having an opening formed therein. In addition to the die paddle, the leadframe includes a plurality of leads, at least one...
6998702 Front edge chamfer feature for fully-molded memory cards  
A memory card comprising a leadframe having a plurality of contacts. Electrically connected to the leadframe is at least one semiconductor die. A body at least partially encapsulates the leadframe...
6995459 Semiconductor package with increased number of input and output pins  
In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least...
6967395 Mounting for a package containing a chip  
A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive...
6965157 Semiconductor package with exposed die pad and body-locking leadframe  
A very thin, small outline, thermally enhanced semiconductor package includes a leadframe that is coined to form locking features on an exposed die pad and on a plurality of extremely narrow,...
6965154 Semiconductor device  
A semiconductor device and a manufacturing method thereof are provided with downsizing and densification achieved by reducing the thickness of the semiconductor device without increase in area....
6953988 Semiconductor package  
A semiconductor package is disclosed that bonds a semiconductor chip to a leadframe using a flip chip technology. An exemplary semiconductor package includes a semiconductor chip having a plurality...
6921967 Reinforced die pad support structure  
A semiconductor package comprising a die pad defining opposed top and bottom surfaces and a peripheral edge. Attached to the peripheral edge of the die pad is a plurality of support feet which...
6897550 Fully-molded leadframe stand-off feature  
A memory card comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad....
6893900 Method of making an integrated circuit package  
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
6885106 Stacked microelectronic assemblies and methods of making same  
A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one atop the other with the first microelectronic element disposed between...
6879034 Semiconductor package including low temperature co-fired ceramic substrate  
A semiconductor package comprising a low temperature co-fired ceramic substrate defining opposed top and bottom surfaces. The substrate comprises at least two stacked ceramic layers and...
6876068 Semiconductor package with increased number of input and output pins  
In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least...
Matches 1 - 50 out of 60 1 2 >