Matches 1 - 15 out of 15
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7367845 Modular sockets using flexible interconnects  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7273788 Ultra-thin semiconductors bonded on glass substrates  
A method for forming a semiconductor on insulator structure includes providing a glass substrate, providing a semiconductor wafer, and performing a bonding cut process on the semiconductor wafer...
7271445 Ultra-thin semiconductors bonded on glass substrates  
A method for forming a semiconductor on insulator structure includes providing a glass substrate, providing a semiconductor wafer, and performing a bonding cut process on the semiconductor wafer...
7262428 Strained Si/SiGe/SOI islands and processes of making same  
A process of making a strained silicon-on-insulator structure is disclosed. A recess is formed in a substrate to laterally isolate an active area. An undercutting etch forms a bubble recess under...
7192311 Apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7153753 Strained Si/SiGe/SOI islands and processes of making same  
A process of making a strained silicon-on-insulator structure is disclosed. A recess is formed in a substrate to laterally isolate an active area. An undercutting etch forms a bubble recess under...
7153164 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7094108 Apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7040930 Modular sockets using flexible interconnects  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7008854 Silicon oxycarbide substrates for bonded silicon on insulator  
A method for forming a semiconductor on insulator structure includes forming a semiconductor layer on an insulating substrate, where the substrate is a different material than the semiconductor...
6760970 Method for forming modular sockets using flexible interconnects and resulting structures  
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
6758696 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in...
6751859 Method for forming modular sockets using flexible interconnects and resulting structures  
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor die 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
6724204 Probe structure for testing semiconductor devices and method for fabricating the same  
Disclosed are a probe structure for testing semiconductor devices and a method for fabricating the probe structure. The fabricated probe structure of the present invention satisfies the high...
6646458 Apparatus for forming coaxial silicon interconnects  
An interconnect apparatus for testing bare semiconductor dice comprises raised contact members on a semiconductive substrate. The contact members are covered with an insulation layer and a...
Matches 1 - 15 out of 15