Matches 1 - 42 out of 42
Match Document Document Title
7427819 Film-bulk acoustic wave resonator with motion plate and method  
An apparatus and method for measuring a target environmental variable (TEV) that employs a film-bulk acoustic resonator with motion plate. The film-bulk acoustic resonator (FBAR) includes an...
7425787 Acoustic galvanic isolator incorporating single insulated decoupled stacked bulk acoustic resonator with acoustically-resonant electrical insulator  
Embodiments of the acoustic galvanic isolator comprise a carrier signal source, a modulator connected to receive an information signal and the carrier signal, a demodulator, and an...
7424772 Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth  
The band-pass filter has a stacked pair of film bulk acoustic resonators (FBARs) and an acoustic decoupler between the FBARs. Each of the FBARs has opposed planar electrodes and a layer of...
7423503 Acoustic galvanic isolator incorporating film acoustically-coupled transformer  
Embodiments of the acoustic galvanic isolator comprise a carrier signal source, a modulator connected to receive an information signal and the carrier signal, a demodulator, and, connected between...
7422929 Wafer-level packaging of optoelectronic devices  
In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on...
7413917 Integrated optics and electronics  
An optoelectronic device includes a submount and a lid. The submount includes a substrate and a lens and a laser above the substrate. The lid defines a cavity having a surface coated with a...
7408428 Temperature-compensated film bulk acoustic resonator (FBAR) devices  
The temperature-compensated film bulk acoustic resonator (FBAR) device comprises an FBAR stack. The FBAR stack comprises an FBAR and a temperature-compensating element. The FBAR is characterized by...
7400217 Decoupled stacked bulk acoustic resonator band-pass filter with controllable pass bandwith  
The band-pass filter has an upper film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and, between the FBARs, an acoustic decoupler comprising a layer of acoustic...
7393758 Wafer level packaging process  
Wafer level packaging process for packaging MEMS or other devices. In some embodiments, a MEMS wafer with normal thickness is firstly bonded to a cap wafer of normal thickness, followed by a...
7391286 Impedance matching and parasitic capacitor resonance of FBAR resonators and coupled filters  
A film acoustically-coupled transformer (FACT) has a first and a second stacked bulk acoustic resonator (SBAR 1 , SBAR 2 ). Each SBAR has a stacked pair of film bulk acoustic resonators (FBARs)...
7391285 Film acoustically-coupled transformer  
One embodiment of the film acoustically-coupled transformer (FACT) includes a decoupled stacked bulk acoustic resonator (DSBAR) having a lower film bulk acoustic resonator (FBAR) an upper FBAR...
7388455 Film acoustically-coupled transformer with increased common mode rejection  
The film acoustically-coupled transformer (FACT) has a first and second decoupled stacked bulk acoustic resonators (DSBARs). Each DSBAR has a lower film bulk acoustic resonator (FBAR), an upper...
7388454 Acoustic resonator performance enhancement using alternating frame structure  
Disclosed is an acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and an alternating frame region. The first electrode is...
7369013 Acoustic resonator performance enhancement using filled recessed region  
An acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and a fill region. The first electrode is adjacent the substrate, and the...
7367095 Method of making an acoustically coupled transformer  
Embodiments of an acoustically-coupled transformer have a first stacked bulk acoustic resonator (SBAR) and a second SBAR. Each of the SBARs has a lower film bulk acoustic resonator (FBAR) and an...
7362198 Pass bandwidth control in decoupled stacked bulk acoustic resonator devices  
The decoupled stacked bulk acoustic resonator (DSBAR) device has a lower film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and an acoustic decoupler between the FBARs....
7358831 Film bulk acoustic resonator (FBAR) devices with simplified packaging  
The encapsulated film bulk acoustic resonator (FBAR) device comprises a substrate, an FBAR stack over the substrate, an element for acoustically isolating the FBAR stack from the substrate,...
7358109 Surface emitting laser package having integrated optical element and alignment post  
A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging...
7357017 Wafer level capped sensor  
A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion....
7343535 Embedded testing capability for integrated serializer/deserializers  
Testing capability for an integrated circuit having more than one serializer/deserializer (SERDES) block includes embedding a tester within each block, so that the blocks can be tested...
7332985 Cavity-less film bulk acoustic resonator (FBAR) devices  
The film bulk acoustic resonator (FBAR) device comprises a substrate, an acoustic Bragg reflector over the substrate, a piezoelectric element over the acoustic Bragg reflector, and a remote-side...
7312675 Vertically separated acoustic filters and resonators  
An apparatus including vertically separated acoustic resonators are disclosed. The apparatus includes a first acoustic resonator on a substrate and a second acoustic resonator vertically separated...
7298030 Structure and method of making sealed capped chips  
A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly...
7282433 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads  
Microelectronic workpieces that have bump sites over bond-pads and methods of fabricating such bump sites. One embodiment of such a workpiece, for example, includes a substrate having a plurality...
7275424 Wafer level capped sensor  
A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion....
7265440 Methods and apparatus for packaging integrated circuit devices  
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an...
7247949 Semiconductor device with stacked chips  
A method of manufacturing a semiconductor device which can solve a problem in which a wafer is warped by the influence of thermal contraction of a sealing resin due to a difference in thermal...
7224056 Back-face and edge interconnects for lidded package  
A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion...
7202560 Wafer bonding of micro-electro mechanical systems to active circuitry  
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS...
7129576 Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps  
A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface...
7038559 Vertically separated acoustic filters and resonators  
An apparatus including vertically separated acoustic resonators are disclosed. The apparatus includes a first acoustic resonator on a substrate and a second acoustic resonator vertically separated...
6998691 Optoelectronic device packaging with hermetically sealed cavity and integrated optical element  
A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the...
6982437 Surface emitting laser package having integrated optical element and alignment post  
A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging...
6969667 Electrical device and method of making  
An electrical device includes a plurality of integrated circuits respectively fabricated in a first substrate bonded to a second substrate by a bond that deforms above, but not below, a deformation...
6953990 Wafer-level packaging of optoelectronic devices  
A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first...
6936918 MEMS device with conductive path through substrate  
A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive...
6900509 Optical receiver package  
A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the...
6852570 Method of manufacturing a stacked semiconductor device  
A method of manufacturing a semiconductor device which can solve a problem in which a wafer is warped by the influence of thermal contraction of a sealing resin due to a difference in thermal...
6777263 Film deposition to enhance sealing yield of microcap wafer-level package with vias  
A method for forming a wafer package includes forming a die structure, wherein the die structure includes a first wafer, a device mounted on the first wafer, a second wafer mounted atop the first...
6675474 Electronic component mounted member and repair method thereof  
An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic...
6538332 Semiconductor device and method of production of same  
A semiconductor device thinner than the past and improved in reliability of electrical connection between semiconductor chips and an interconnection substrate including a polyimide film (insulating...
6512183 Electronic component mounted member and repair method thereof  
An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic...
Matches 1 - 42 out of 42