Matches 1 - 19 out of 19
Match Document Document Title
7420272 Two-sided wafer escape package  
A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an...
7413929 Integrated chip package structure using organic substrate and method of manufacturing the same  
An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic...
7397117 Chip package with die and substrate  
A thin film semiconductor die circuit package is provided utilizing low dielectric constant (k) polymer material for the insulating layers of the metal interconnect structure. Five embodiments...
7368374 Super high density module with integrated wafer level packages  
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
7345365 Electronic component with die and passive device  
An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic...
7297614 Method for fabricating circuitry component  
An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic...
7132750 Semiconductor component having conductors with wire bondable metalization layers  
A semiconductor component includes a semiconductor die, a low k polymer layer on the die and redistribution conductors on the polymer layer. The component also includes bonding pads on the...
7045835 High-density inter-die interconnect structure  
An interconnect architecture for connecting a plurality of closely-spaced electrical elements on a first integrated circuit fabricated structure with operative circuits on a second integrated...
7042074 Power semiconductor module and method for producing it  
A power semiconductor module and a method for producing it, wherein the module includes a substrate, with conductor tracks disposed on it to suit circuitry with which the module is used and with...
7042010 Intermediate semiconductor device having activated oxide-based layer for electroless plating  
An intermediate semiconductor device that includes a semiconductor substrate and an oxide-based layer over the substrate. The oxide-based layer has an activated catalytic surface on at least one...
6969638 Low cost substrate for an integrated circuit device with bondpads free of plated gold  
Disclosed herein is a process for assembling an integrated circuit, as well as the assembly resulting from the process, employing a surface treatment of bondpad surfaces. In one aspect, a method of...
6900128 Activation of oxides for electroless plating  
The present invention provides approaches for electroless deposition of conductive materials onto the surface of oxide-based materials, including nonconductive metal oxides, in a manner that does...
6894399 Microelectronic device having signal distribution functionality on an interfacial layer thereof  
A microelectronic device includes a microelectronic die having an interfacial metal layer deposited over an active surface thereof to perform a signal distribution function within the device. The...
6887787 Method for fabricating semiconductor components with conductors having wire bondable metalization layers  
A semiconductor component includes a semiconductor die, a low k polymer layer on the die and redistribution conductors on the polymer layer. The component also includes bonding pads on the...
6872659 Activation of oxides for electroless plating  
The present invention provides approaches for electroless deposition of conductive materials onto the surface of oxide-based materials, including nonconductive metal oxides, in a manner that does...
6784544 Semiconductor component having conductors with wire bondable metalization layers  
A semiconductor component includes a semiconductor die, a low k polymer layer on the die and redistribution conductors on the polymer layer. The component also includes bonding pads on the...
6762075 Semiconductor module and producing method therefor  
For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically...
6639324 Flip chip package module and method of forming the same  
A flip-chip package module consists of a semiconductor chip, a heat sink plate, a dielectric layer and a metal interconnect layer. The semiconductor chip has a positive side with a plurality of die...
6603210 Semiconductor module and producing method therefor  
For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically...
Matches 1 - 19 out of 19