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EP1930944A2 |
Wafer applied thermal-mechanical interface
An improved semiconductor assembly that provides a highly efficient heat-dissipating property, while also providing enhanced mechanical properties, includes a semiconductor device mounted on a...
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7300203 |
Non-contacting sensor multichip module with integral heat-sinks
A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber....
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7064963 |
Multi-substrate circuit assembly
Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a...
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7023699 |
Liquid cooled metal thermal stack for high-power dies
The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an...
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6998706 |
Relaxed tolerance flip chip assembly
A method and assembly ( 10 ) for conducting heat from a semiconductor device, such as a power flip chip ( 12 ). The assembly ( 10 ) is generally constructed to dissipate heat from the flip chip (...
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6918431 |
Cooling assembly
A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within...
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6873043 |
Electronic assembly having electrically-isolated heat-conductive structure
An electronic assembly equipped with a heat-conductive structure, and to a method of conducting heat from a circuit device within such an assembly. The heat-conductive structure comprises an...
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6821816 |
Relaxed tolerance flip chip assembly
A method and assembly ( 10 ) for conducting heat from a semiconductor device, such as a power flip chip ( 12 ). The assembly ( 10 ) is generally constructed to dissipate heat from the flip chip (...
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6804118 |
Thermal dissipation assembly for electronic components
An electrical assembly 10 is provided, including a heat sink 14, a heat generating component 12, a gap 22 defined between the heat generating component 12 and the heat sink 14, at least...
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6700195 |
Electronic assembly for removing heat from a flip chip
An electronic assembly for conducting heat from a semiconductor device, such as a power flip chip, attached to a substrate. The substrate has a first region with conductors thereon, a second region...
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