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7400525 |
Memory cell with independent-gate controlled access devices and memory using the cell
A memory cell includes double-gate first and second access devices configured to selectively interconnect cross-coupled inverters with true and complementary bit lines. Each access device has a...
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7362617 |
Nonvolatile semiconductor memory device and method of rewriting data thereof
The nonvolatile semiconductor memory device of the present invention includes a memory cell array wherein data is stored in a nonvolatile state based on a difference in memory information between...
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7333370 |
Method to prevent bit line capacitive coupling
Structures, systems and methods for memory cells utilizing trench bit lines formed within a buried layer are provided. A memory cell is formed in a triple well structure that includes a substrate,...
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7326992 |
Nonvolatile memory cell with multiple floating gates formed after the select gate
In a memory cell ( 110 ) having multiple floating gates ( 160 ), the select gate ( 140 ) is formed before the floating gates. In some embodiments, the memory cell also has control gates ( 170 )...
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7301196 |
Nonvolatile memories and methods of fabrication
In a nonvolatile memory, substrate isolation regions (220) are formed in a semiconductor substrate (120). The substrate isolation regions are dielectric regions protruding above the substrate. Then...
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7294883 |
Nonvolatile memory cells with buried channel transistors
In a nonvolatile memory cell ( 110 ), the select gate transistor is formed as a buried channel transistor to increase the transistor current.
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7274063 |
Nonvolatile memory cell with multiple floating gates formed after the select gate and having upward protrusions
In a nonvolatile memory cell having at least two floating gates, each floating gate ( 160 ) has an upward protruding portion. This portion can be formed as a spacer over a sidewall of the select...
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7230295 |
Nonvolatile memory cell with multiple floating gates formed after the select gate
In a memory cell ( 110 ) having multiple floating gates ( 160 ), the select gate ( 140 ) is formed before the floating gates. In some embodiments, the memory cell also has control gates ( 170 )...
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7214585 |
Methods of fabricating integrated circuits with openings that allow electrical contact to conductive features having self-aligned edges
A widened contact area ( 170 X) of a conductive feature ( 170 ) is formed by means of self-alignment between an edge ( 170 E 2 ) of the conductive feature and an edge ( 140 E) of another feature (...
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7195964 |
Fabrication of dielectric on a gate surface to insulate the gate from another element of an integrated circuit
A gate dielectric ( 150 ) for a gate ( 160 ) is formed by thermal oxidation simultaneously with as a dielectric on a surface of another gate ( 140 ). The dielectric thickness on the other gate is...
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7190019 |
Integrated circuits with openings that allow electrical contact to conductive features having self-aligned edges
A widened contact area ( 170 X) of a conductive feature ( 170 ) is formed by means of self-alignment between an edge ( 170 E 2 ) of the conductive feature and an edge ( 140 E) of another feature (...
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7169667 |
Nonvolatile memory cell with multiple floating gates formed after the select gate
In a memory cell ( 110 ) having multiple floating gates ( 160 ), the select gate ( 140 ) is formed before the floating gates. In some embodiments, the memory cell also has control gates ( 170 )...
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7101757 |
Nonvolatile memory cells with buried channel transistors
In a nonvolatile memory cell ( 110 ), the select gate transistor is formed as a buried channel transistor to increase the transistor current.
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7060565 |
Fabrication of dielectric for a nonvolatile memory cell having multiple floating gates
A memory cell ( 110 ) has a select gate ( 140 ) and at least two floating gates ( 160 ). A gate dielectric ( 150 ) for the floating gates ( 160 ) is formed by thermal oxidation simultaneously with...
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7057231 |
Nonvolatile memory cell with a floating gate at least partially located in a trench in a semiconductor substrate
A floating gate ( 110 ) of a nonvolatile memory cell is formed in a trench ( 114 ) in a semiconductor substrate ( 220 ). A dielectric ( 128 ) covers the surface of the trench. The wordline ( 140 )...
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7053438 |
Fabrication of gate dielectric in nonvolatile memories in which a memory cell has multiple floating gates
In fabrication of a nonvolatile memory cell having two floating gates, one or more peripheral transistor gates are formed from the same layer ( 140 ) as the select gate. The gate dielectric ( 130 )...
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7052947 |
Fabrication of gate dielectric in nonvolatile memories in which a memory cell has multiple floating gates
In fabrication of a nonvolatile memory cell having two floating gates, one or more peripheral transistor gates are formed from the same layer ( 140 ) as the select gate. The gate dielectric ( 130 )...
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7045854 |
Non-volatile semiconductor memory
An object of the present invention is to provide a semiconductor memory device suitable for larger-capacity storage because of its ability to store 3 or more bits in one element and capable of a...
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7018895 |
Nonvolatile memory cell with multiple floating gates formed after the select gate
In a memory cell ( 110 ) having multiple floating gates ( 160 ), the select gate ( 140 ) is formed before the floating gates. In some embodiments, the memory cell also has control gates ( 170 )...
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7005338 |
Nonvolatile memory cell with a floating gate at least partially located in a trench in a semiconductor substrate
A floating gate ( 110 ) of a nonvolatile memory cell is formed in a trench ( 114 ) in a semiconductor substrate ( 220 ). A dielectric ( 128 ) covers the surface of the trench. The wordline ( 140 )...
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6995060 |
Fabrication of integrated circuit elements in structures with protruding features
A structure is obtained having a semiconductor substrate, the structure having an upward protruding feature ( 140 ). A first layer ( 160 ) is formed on the structure. The first layer ( 160 ) has a...
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6977869 |
Non-volatile memory and method of operation
A method of programming and erasing an electrically erasable programmable read-only memory (EEPROM)device includes performing a band-to-band tunneling induced hot-electrons program and performing a...
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6974739 |
Fabrication of dielectric on a gate surface to insulate the gate from another element of an integrated circuit
A gate dielectric ( 150 ) for a gate ( 160 ) is formed by thermal oxidation simultaneously with as a dielectric on a surface of another gate ( 140 ). The dielectric thickness on the other gate is...
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6962852 |
Nonvolatile memories and methods of fabrication
To fabricate a nonvolatile memory, a select gate ( 140 ) is formed over a semiconductor substrate. A dielectric ( 810, 1010, 1030 ) is formed over the select gate. A floating gate layer ( 160 ),...
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6962851 |
Nonvolatile memories and methods of fabrication
In a nonvolatile memory, substrate isolation regions ( 220 ) are formed in a semiconductor substrate ( 120 ). The substrate isolation regions are dielectric regions protruding above the substrate....
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6951782 |
Nonvolatile memory cell with multiple floating gates formed after the select gate and having upward protrusions
In a nonvolatile memory cell having at least two floating gates, each floating gate ( 160 ) has an upward protruding portion. This portion can be formed as a spacer over a sidewall of the select...
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6930348 |
Dual bit split gate flash memory
The dual bit split gate flash memory of the invention comprises a plurality of memory cells wherein each memory cell comprises a select gate overlying a substrate and isolated from the substrate by...
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6919607 |
Structure of two-bit mask read-only memory device and fabricating method thereof
A structure of a 2-bit mask ROM device and a fabrication method thereof are provided. The memory structure includes a substrate, a gate structure, a 2-bit coding implantation region, a spacer, a...
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6902974 |
Fabrication of conductive gates for nonvolatile memories from layers with protruding portions
A control gate layer ( 170 ) for a nonvolatile memory cell is formed over a select gate ( 140 ). The control gate layer protrudes upward over the select gate. An auxiliary layer (1710) is formed...
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6894915 |
Method to prevent bit line capacitive coupling
Structures, systems and methods for memory cells utilizing trench bit lines formed within a buried layer are provided. A memory cell is formed in a triple well structure that includes a substrate,...
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6885044 |
Arrays of nonvolatile memory cells wherein each cell has two conductive floating gates
In a nonvolatile memory array in which each cell ( 110 ) has two floating gates ( 160 ), for any two consecutive memory cells, one source/drain region ( 174 ) of one of the cells and one...
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6846712 |
Fabrication of gate dielectric in nonvolatile memories having select, floating and control gates
In a nonvolatile memory, one or more peripheral transistor gates are formed from the same layer ( 140 ) as the select gate. The gate dielectric ( 130 ) for these peripheral transistors and the gate...
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6844586 |
Fabrication of gate dielectric in nonvolatile memories having select, floating and control gates
In a nonvolatile memory, one or more peripheral transistor gates are formed from the same layer ( 140 ) as the select gate. The gate dielectric ( 130 ) for these peripheral transistors and the gate...
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6744664 |
Dual-bit floating-gate flash cell structure and its contactless flash memory arrays
A dual-bit floating-gate flash cell structure comprises a gate region being formed between a common-source region and a common-drain region. The gate region comprises a pair of floating-gates being...
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6704222 |
Multi-state operation of dual floating gate array
Novel memory cells utilize source-side injection, allowing very small programming currents. If desired, to-be-programmed cells are programmed simultaneously while not requiring an unacceptably...
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6587381 |
Programming method for non-volatile semiconductor memory device
A method is provided for programming data for a memory element of a twin memory cell (i). The word line WL 1 is set to a programming word line selection voltage, the control gate CG[i+1] is set to...
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6480414 |
Multi-level memory cell
A multi-level memory cell has a substrate, a first floating gate, a second floating gate and a control gate. A first doped region, a second doped region and a channel region located between the...
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