Matches 1 - 27 out of 27
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7368374 Super high density module with integrated wafer level packages  
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
7347348 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece  
Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a...
7285850 Support elements for semiconductor devices with peripherally located bond pads  
A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at...
7269897 Manufacturing process of a stacked semiconductor device  
A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor...
7245008 Ball grid array package, stacked semiconductor package and method for manufacturing the same  
A BGA package including a substrate, a plurality of solder balls on the semiconductor and an encapsulant, which leaves the solder balls partially exposed on the semiconductor chip, thereby reducing...
7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods  
A multichip assembly includes semiconductor devices or semiconductor device components with outer connectors on peripheral edges thereof. The outer connectors are formed by creating via holes along...
7214566 Semiconductor device package and method  
A method of making semiconductor device packages includes the steps of attaching a wafer to a dielectric layer, testing semiconductor devices in the wafer, and then dicing the layered assembly. The...
7208335 Castellated chip-scale packages and methods for fabricating the same  
A method for fabricating a chip-scale package includes securing a device substrate that carries at least two adjacent semiconductor devices to a sacrificial substrate. The sacrificial substrate may...
7179688 Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method  
A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of...
7132303 Stacked semiconductor device assembly and method for forming  
One embodiment relates to using a robust metal layer of a semiconductor device to form landing pads. In one embodiment, a sputterable, nonwettable refractory metal is used as a solder mask for the...
7109586 System for reducing or eliminating semiconductor device wire sweep  
Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of...
6955949 System and method for reducing or eliminating semiconductor device wire sweep  
A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing...
6936525 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof  
A method of manufacturing the semiconductor chips comprises the steps of: pasting on a substrate an adhesive sheet having a property to retain its adhesive strength prior to a processing, then lose...
RE38747 Vial filling apparatus  
Apparatus for filling sterile containers is disclosed which defines an elongated but narrow sterile zone in which a number of operating stations are disposed. An elongated vertical wall is armed by...
6911737 Semiconductor device package and method  
A method of making semiconductor device packages includes the steps of attaching a wafer to a dielectric layer, testing semiconductor devices in the wafer, and then dicing the layered assembly. The...
6847122 System and method for preventing and alleviating short circuiting in a semiconductor device  
A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device,...
6845901 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece  
Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a...
6841863 Ball grid array package with stacked center pad chips and method for manufacturing the same  
Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the...
6841454 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof  
In order to have a thin type semiconductor chips featuring a high yield and a low cost in production, an excellent packaging reliability, and a robust structure against damages, there is provided a...
6818474 Method for manufacturing stacked chip package  
The present invention relates to manufacture of a stacked chip package. A first substrate including a first center window is attached to a first semiconductor chip having a plurality of bonding...
6774640 Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration  
A new method is provided for evaluating the alignment of inner layers of interconnect layers. A test pattern is inserted within and as part of the process of creating a saw singulated plastic ball...
6762117 Method of fabricating metal redistribution layer having solderable pads and wire bondable pads  
A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip...
EP1434267A1 Manufacturing process of a stacked semiconductor device and corresponding device  
A manufacturing process of a stacked semiconductor device (14) is described, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realised...
6746898 Integrated chip package structure using silicon substrate and method of manufacturing the same  
An integrated chip package structure and method of manufacturing the same is by adhering dies on a silicon substrate and forming a thin-film circuit layer on top of the dies and the silicon...
6620649 Method for selectively providing adhesive on a semiconductor device  
In a method of fabricating a semiconductor device, a semiconductor wafer is provided with a plurality of semiconductor elements formed thereon. An insulating adhesive is selectively provided over...
RE37471 Vial filling apparatus  
Apparatus for filling sterile containers is disclosed which defines an elongated but narrow sterile zone in which a number of operating stations are disposed. An elongated vertical wall is carried...
EP0957240A1 Method and installation for introducing fibrous material into a housing, and housing produced in accordance with the method  
A method for introducing at least one fill of fibrous material (107) into a housing of a product, such as the housing of a silencer, comprises the provision of a fibrous material (107) in bulk...
Matches 1 - 27 out of 27