Matches 1 - 19 out of 19
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7265087 Exendin improves β-cell response in subjects with impaired glucose tolerance  
A composition for the treatment of impaired glucose tolerance (IGT) including a compound which binds to a receptor for glucagon-like peptide-1, and a pharmaceutical carrier. The amount of the...
7238671 Human glucagon-like-peptide-1 mimics and their use in the treatment of diabetes and related conditions  
The present invention provides novel human glucagon-like peptide-1 (GLP-1) peptide mimics that mimic the biological activity of the native GLP-1 peptide and thus are useful for the treatment or...
7238670 Human glucagon-like-peptide-1 mimics and their use in the treatment of diabetes and related conditions  
The present invention provides novel human glucagon-like peptide-1 (GLP-1) peptide mimics that mimic the biological activity of the native GLP-1 peptide and thus are useful for the treatment or...
7138486 Insulinotropic hormone derivatives and uses thereof  
Derivatives of glucagon-like peptide I (GLP-1) and especially GLP-1 (7-37) have been found to have insulinotropic activity. The invention pertains to a composition comprising an acid addition salt...
7022282 Lead-free solder and soldered article  
A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight...
6884579 GLP-1 as a diagnostic test to determine β-cell function and the presence of the condition of IGT and type-II diabetes  
Since glucagon-like peptide-1 (GLP-1) is the most potent insulinotropic hormone known and has been shown to stimulate insulin secretion strongly in patients with type II diabetes, this invention...
6849708 Insulinotropic hormone and uses thereof  
Derivatives of glucagon-like peptide I (GLP-1) and especially GLP-1(7-36) have been found to have insulinotropic activity. The invention pertains to the use of GLP-1(7-36) for the treatment of type...
EP0878265B1 SOLDER, SOLDER PASTE AND SOLDERING METHOD  
Abstract not available for EP0878265 Abstract of corresponding document: EP0787559 The present invention relates to a soldering alloy composed mainly of Sn and free from lead which is a toxic...
6503338 Lead-free solder alloys  
A lead-free solder alloy which has a relatively low melting temperature and which is suitable for soldering electronic devices consists essentially of from 5 to 9 mass % of Zn, from 2 to 15 mass %...
6488888 Lead-free solder alloys  
A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to...
6472086 Bearing material  
A material for use as a bearing sliding surface and a bearing having the material are described, the material comprises tin and having therein from 1 to 5 wt % of a metal selected from the group...
6428745 Solder, solder paste and soldering method  
Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest....
6267823 Solder, solder paste and soldering method  
Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest....
6241942 Lead-free solder alloys  
A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to...
6224690 Flip-Chip interconnections using lead-free solders  
An interconnection structure suitable for the connection of microelectronic circuit chips to packages is provided by this invention. In particular, the invention pertains to the area-array or...
6086687 Lead-free tin alloy  
A lead-free tin alloy for solder joints comprising up to 0.25% by weight of indium and a grain refiner which is an alloy consisting of, by weight, 2.5 to 10% aluminium, 1 to 5% magnesium and...
5985212 High strength lead-free solder materials  
Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or...
5733501 Lead-free solder alloy  
A lead-free solder alloy comprises 0.8 to 5.0% inclusive by weight of Ag, not less than 0.1% by weight of In, not less than 0.1% by weight of Bi, the total amount of In and Bi being not more than...
5658528 Lead-free solder  
A lead-free solder consisting of 1 to 4 wt % of Ag, at least one of Bi and In in respective amounts meeting the conditions that the value of expression (1), A, is equal to or greater than 5.00 and...
Matches 1 - 19 out of 19