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7423336 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices  
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations...
7418163 Optoelectrical package  
An integrated optoelectrical package for optoelectrical integrated circuits (ICs) is disclosed. The package includes a package substrate having contact receiving members on an upper surface. The...
7412119 Apparatus and method for making flexible waveguide substrates for use with light based touch screens  
Flexible optical waveguide substrates that can be used with touch screen displays. The waveguide substrates include a flexible base material. A first optical layer having a first index of...
7411807 System and method for optically interconnecting memory devices  
A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled to an address decoder and control...
7386200 Photonic circuit board  
A photonic circuit board comprises a connection setting circuit, a group of electric wires for connecting the connection setting circuit and a plurality of devices, an optical I/O (input/output)...
7382639 System and method for optically interconnecting memory devices  
A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled to an address decoder and control...
7376295 Opto-electronic processors with reconfigurable chip-to-chip optical interconnections  
Disclosed are reconfigurable optical interconnections for opto-electronic processors in general, and for scalable computer architectures and scalable network servers in particular. The...
7370134 System and method for memory hub-based expansion bus  
A system memory includes a memory hub controller, a memory module accessible by the memory hub controller, and an expansion module having a processor circuit coupled to the memory module and also...
7368754 Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus  
The invention provides a semiconductor integrated circuit which allows a plurality of devices to be integrated compactly, that is, with high density; a signal transmitting device; an...
7366864 Memory hub architecture having programmable lane widths  
A processor-based system includes a processor coupled to a system controller through a processor bus. The system controller is used to couple at least one input device, at least one output device,...
7366368 Optical add/drop interconnect bus for multiprocessor architecture  
An optical bus interconnects two or more processors in a multiprocessor system. One or more electrical-to-optical (“E-O”) transmitters are optically coupled to the optical bus using optical...
7349592 Optoelectronic circuit board with optical waveguide and optical backplane  
An optical transmission device comprises an optical transmission medium and a plurality of optical receivers, and the optical transmission medium has a linear line waveguide. At least one of the...
7348261 Wafer scale thin film package  
A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple...
7342276 Method and apparatus utilizing monocrystalline insulator  
A semiconductor device, including: a semiconductor material; a conductive element; and a substantially monocrystalline insulator disposed between the semiconductor material and the...
7333683 Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board  
An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient...
7329481 Substrate optical waveguides having fiber-like shape and methods of making the same  
Substrate optical waveguides having curved major surfaces and methods for making the same are disclosed. In one exemplary embodiment, a photosensitive cladding layer is pattern exposed to actinic...
7306689 Optical waveguide and method for producing same  
An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit...
7282805 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element  
A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that...
7282397 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices  
A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The...
7265027 Bond method and structure using selective application of spin on glass  
A method for bonding substrate structures. The method includes providing a transparent substrate structure, the transparent substrate structure comprising a face region and an incident light...
7257295 Attachment-type optical coupler apparatuses  
Optical couplers having attachment features are disclosed. A typical coupler according to the present invention couples an optical signal from an optical fiber to a channel waveguide by overlapping...
7256069 Wafer-level package and methods of fabricating  
A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device,...
7254149 Submount, pedestal, and bond wire assembly for a transistor outline package with reduced bond wire inductance  
The present invention relates generally to optoelectronic devices, and particularly to a submount, pedestal, and bond wire assembly for a transistor outline package. A bottom surface of the...
7229219 Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnection  
Disclosed are apparatuses and methods for fast and reliable integration of opto-electric components onto optical routing substrates. Accurate alignment of optical signals to and from the...
7211852 Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate  
High quality epitaxial layers of GaN can be grown overlying large silicon wafers ( 200 ) by forming an amorphous layer ( 210 ) on the substrate. The amorphous layer dissipates strain and permits...
7209621 Optical apparatuses providing optical interconnections among a plurality of electronic components  
Optical apparatuses providing optical interconnections among a plurality N of electronic components. One exemplary apparatus comprises a slab waveguide having a core layer that enables light beams...
7180924 Semiconductor apparatus and a semiconductor unit, the semiconductor unit including a functional layer including a semiconductor element, and a highly conductive layer  
The invention provides a semiconductor unit and a semiconductor apparatus having a low electric resistance as a whole, even when the electric resistance of a functional layer or a semiconductor...
7178994 Fiber optic circuit connector  
A circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable...
7169619 Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process  
High quality epitaxial layers of monocrystalline oxide materials ( 24 ) can be grown overlying monocrystalline substrates ( 22 ) such as large silicon wafers. The monocrystalline oxide layer ( 24 )...
7163598 Optical waveguide and method for producing same  
An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit...
7161227 Structure and method for fabricating semiconductor structures and devices for detecting an object  
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the...
7149389 Optical printed circuit board system having tapered waveguide  
An optical printed circuit board system having a tapered optical waveguide is provided. The optical printed circuit board system includes a substrate as a printed circuit board having an electrical...
7141778 Semiconductor device, optoelectronic board, and production methods therefor  
The semiconductor device of the present invention comprises an optical transmission region, and a light receiving part for converting light propagating through the optical transmission region to an...
7110629 Optical ready substrates  
An article of manufacture comprising an optical-ready substrate made of a first semiconductor layer, an insulating layer on top of the first semiconductor layer, and a second semiconductor layer on...
7105866 Heterojunction tunneling diodes and process for fabricating same  
High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating...
7101725 Solution to thermal budget  
A method of fabricating on optical detector, the method including providing a substrate that includes an optical waveguide formed therein and having a surface for fabricating microelectronic...
7095937 Multi-level waveguide  
A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material...
7092424 Integrated arrays of modulators and lasers on electronics  
A unit has an array of lasers having an emission surface through which beams can be emitted in a substantially vertical direction so as to define an emission side, drive electronics connected to a...
7072534 Optical ready substrates  
An article of manufacture comprising an optical ready substrate made of a first semiconductor layer, an insulating layer on top of the first semiconductor layer, and a second semiconductor layer on...
7067856 Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same  
High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating...
7045815 Semiconductor structure exhibiting reduced leakage current and method of fabricating same  
A semiconductor structure exhibiting reduced leakage current is formed of a monocrystalline substrate ( 101 ) and a strained-layer heterostructure ( 105 ). The strained-layer heterostructure has a...
7044657 Transistor outline package with exteriorly mounted resistors  
An optoelectronic assembly includes an optoelectronic device, housed in a transistor outline (TO) package having a base and a signal lead traversing an aperture in the base, and a circuit...
7043106 Optical ready wafers  
An optical ready substrate made at least in part of a first semiconductor material and having a front side and a backside, the front side having a top surface that is of sufficient quality to...
7042067 Transmission line with integrated connection pads for circuit elements  
An optoelectronic assembly includes a circuit board having a set of signal traces, where one or more of the signal traces has a junction point that integrates a pad of a circuit element. Exemplary...
7027700 Planar waveguide for heat assisted magnetic recording  
Recording heads are provided that comprise a magnetic write pole, and a planar waveguide positioned adjacent to the magnetic write pole, the planar waveguide including a first metal layer, a second...
7020374 Optical waveguide structure and method for fabricating the same  
An optical waveguide structure ( 10 ) is provided. The optical waveguide structure ( 10 ) has a monocrystalline substrate ( 12 ), an amorphous interface layer ( 14 ) overlying the monocrystalline...
7019332 Fabrication of a wavelength locker within a semiconductor structure  
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the...
7012291 Monolithic three-dimensional structures  
Three-dimensional structures of arbitrary shape are fabricated on the surface of a substrate through a series of processing steps wherein a monolithic structure is fabricated in successive layers....
7010088 Multi-slice CT multi-layer flexible signal transmission detector circuit  
A flexible detector array transmission circuit ( 12 ) for an x-ray imaging system ( 10 ) may include an electrically conductive substrate layer ( 70 ) that is electrically coupled to a detector (...
7005717 Semiconductor device and method  
Circuit ( 10 ) has a dual layer gate dielectric ( 29 ) formed over a semiconductor substrate ( 14 ). The gate dielectric includes an amorphous layer ( 40 ) and a monocrystalline layer ( 42 ). The...
Matches 1 - 50 out of 129 1 2 3 >