Matches 1 - 5 out of 5
Match Document Document Title
7368374 Super high density module with integrated wafer level packages  
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
7122401 Area array type semiconductor package fabrication method  
An area array type semiconductor package includes a plurality of conductive media such as solder bumps or solder balls, attached to respective bond pads of a chip. The conductive media act as...
6828173 Semiconductor device including edge bond pads and methods  
A vertically mountable semiconductor device including at least one bond pad disposed on an edge thereof. The bond pad includes a conductive bump disposed thereon. The semiconductor device may also...
6800505 Semiconductor device including edge bond pads and related methods  
A semiconductor device including at least one contact pad disposed on an edge thereof. The semiconductor device may also include a protective overcoat layer. The present invention also includes a...
6510976 Method for forming a flip chip semiconductor package  
An oxidized ( 220 ) copper leadframe and a semiconductor die with copper posts extending from die pads, and with solder balls coated ( 225 ) with flux on the end of the copper posts, are provided....
Matches 1 - 5 out of 5