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7368391 Methods for designing carrier substrates with raised terminals  
A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent...
7334881 Method and system to deposit drops  
A system to deposit drops on a substrate includes a dispenser to dispense the drops, a shutter disposed between the dispenser and the substrate to focus the drops, and a screen, disposed between...
7302990 Method of forming concavities in the surface of a metal component, and related processes and articles  
A method of forming at least one concavity of a selected size and shape within a surface of an internal passageway of a metallic component comprises: depositing a ceramic-based material by a...
7282806 Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material  
Devices include at least one semiconductor die including at least one surface that is at least partially covered by a photopolymer material. The photopolymer material includes a plurality of...
7276298 Substance for intermediate layer of organic electroluminescent device and organic electroluminescent device using the same  
The present invention is related to an intermediate layer of an organic electroluminescent device comprising an amine derivative substance which may further comprise a functional group capable of...
7275925 Apparatus for stereolithographic processing of components and assemblies  
An apparatus for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic processing....
7273802 Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads  
Methods for fabricating conductive structures on contact pads of semiconductor device components or other electronic components and for securing conductive structures to contact pads include...
7261779 System, method, and apparatus for continuous synthesis of single-walled carbon nanotubes  
A process for producing single-walled carbon nanotubes in a continuous manner includes carbon plasma generation, plasma stabilization, and product deposition. The plasma is generated by electrical...
7244665 Wafer edge ring structures and methods of formation  
An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one...
7239015 Heat sinks including nonlinear passageways  
A stereolithographically fabricated heat sink may include non-linear, or convoluted passageways therethrough, through which air can flow. The heat sink may also include a heat dissipation element...
7216009 Machine vision systems for use with programmable material consolidation system and associated methods and structures  
Programmable material consolidation systems employing a machine vision system in combination with a 3-D printing system for accurately locating a position over a support element and optionally on a...
7205654 Programmed material consolidation methods for fabricating heat sinks  
Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that...
7189600 Methods for fabricating stiffeners for flexible substrates  
Methods for fabricating stiffeners for flexible substrates, including, but not limited to, tapes, films, or other connective structures, which are configured to be secured to other semiconductor...
7170171 Support ring for use with a contact pad and semiconductor device components including the same  
Dielectric rings are configured to be disposed around contact pads on a surface of a semiconductor device or another substrate. The rings may be fabricated or otherwise disposed around the contact...
7169693 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same  
Dielectric collars to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the collars on semiconductor devices and...
7168935 Solid freeform fabrication apparatus and methods  
An apparatus for formation of a three dimensional object comprising a sealed container; an electron beam subsystem capable of directing energy within said container; a positioning subsystem...
7166925 Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same  
A method for forming packaged substrates includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate...
7138724 Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask  
A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier...
7138653 Structures for stabilizing semiconductor devices relative to test substrates and methods for fabricating the stabilizers  
Stabilizers to be disposed on a surface of a semiconductor device or test substrate and methods of fabricating and disposing the stabilizers on semiconductor devices and test substrates....
7138334 Systems for forming insulative coatings for via holes in semiconductor devices  
An insulative coating for an aperture of a semiconductor device component includes a plurality of adjacent, mutually adhered regions. The adjacent, mutually adhered regions may be formed by...
7137193 Programmed material consolidation methods for fabricating printed circuit board  
Methods for fabricating semiconductor device components include use of programmed material consolidation processes to form the substrates or conductive elements thereof. The features that are...
7128551 Surface smoothing of stereolithographically formed 3-D objects  
A stereolithographic method and apparatus for forming polymeric structures comprising a plurality of overlying layers, each layer formed by polymerizing a thin layer of liquid photopolymer on a...
7125748 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask  
A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier...
7115981 Semiconductor device assemblies including interposers with dams protruding therefrom  
A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the...
7109106 Methods for providing support for conductive structures protruding from semiconductor device components  
Methods of fabricating and disposing supports around contact pads of semiconductor device components and other substrates include use of stereolithographic techniques. The supports may be preformed...
7095106 Collars, support structures, and forms for protruding conductive structures  
Collars, support structures, or forms for protruding conductive structures include apertures or receptacles through which the conductive structure may extend. The aperture or receptacle may be...
7093358 Method for fabricating an interposer  
An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with an interposer substrate. The fence may include edges that are...
7087984 Methods for protecting intermediate conductive elements of semiconductor device assemblies  
A method for protecting intermediate conductive elements, such as bond wires, of semiconductor device assemblies, includes sequentially fabricating one or more material layers of one or more...
7084013 Methods for forming protective layers on semiconductor device substrates  
Methods for forming protective layers on semiconductor devices, including semiconductor devices that are carried by fabrication substrates, that are parts of assemblies, and that include individual...
7084012 Programmed material consolidation processes for protecting intermediate conductive structures  
A method for protecting intermediate conductive elements, such as bond wires, of semiconductor device assemblies includes selectively altering a state of substantially unconsolidated material...
7067901 Semiconductor devices including protective layers on active surfaces thereof  
A stereolithographic method of applying material to form a protective layer on a preformed semiconductor die with a high degree of precision, either in the wafer stage, when attached to a lead...
7064010 Methods of coating and singulating wafers  
Separating and coating semiconductor dice at the wafer level to form individual chip-scale packages. In one embodiment, channels are formed in the active surface of a wafer to expose side surfaces...
7064002 Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers  
A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the...
7063524 Apparatus for increased dimensional accuracy of 3-D object creation  
A stereolithographic (STL) apparatus for forming structures such as semiconductor die packages is described which uses a laser beam focused to a generally annular “spot” having an annulus of...
7061124 Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks  
A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are...
7043830 Method of forming conductive bumps  
A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed...
7041533 Stereolithographic method for fabricating stabilizers for semiconductor devices  
One or more stabilizers are disposed on the surface of a semiconductor device component prior to bonding the same to a higher-level substrate. Upon assembly of the semiconductor device component...
7041532 Methods for fabricating interposers including upwardly protruding dams  
A method for fabricating an interposer includes providing an interposer substrate with at least one slot or aperture therethrough and forming at least one upwardly protruding dam on the interposer...
7041513 Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates  
One or more of stabilizers are disposed on the surface of a semiconductor device or test substrate that includes bond pads or contact pads located at or proximate to a centerline thereof prior to...
7029954 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same  
Stiffeners for tapes, films, or other connective structures, which are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated...
7026191 Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same  
A stereolithographically fabricated heat sink includes a heat transfer element cofigured to be disposed proximate a semiconductor device so as to absorb heat from the semiconductor device during...
7021915 Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length  
An apparatus and method for controlling the surface level of a liquid residing within a relatively vertically stationary workpiece support platform disposed within a reservoir for use in...
7018871 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods  
A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating...
7001672 Laser based metal deposition of implant structures  
A method of depositing a hard wear resistant surface onto a porous or non-porous base material of a medical implant. The medical implant device formed by a Laser Based Metal Deposition (LBMD)...
6998334 Semiconductor devices with permanent polymer stencil and method for manufacturing the same  
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
6992398 Underfill and encapsulation of carrier substrate-mounted flip-chip components  
A method for underfilling and encapsulating flip-chip-configured semiconductor devices mounted on a carrier substrate using stereolithography (STL) to form, in situ, at least semisolid dam...
6984583 Stereolithographic method for forming insulative coatings for via holes in semiconductor devices  
A method for forming insulating precursors to via holes formed through conductive and semiconductive substrates includes use of stereolithographic processes. An unconsolidated material is...
6984544 Die to die connection method and assemblies and packages including dice so connected  
An assembly includes a first semiconductor die with bond pads arranged in an array on an active surface thereof and at least one second semiconductor die with bond pads on an active surface thereof...
6980014 Interposer and methods for fabricating same  
An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with a substrate. The fence may include edges that are configured to...
6977211 Selective consolidation processes for electrically connecting contacts of semiconductor device components  
Selectively consolidated conductive elements. The conductive elements may include multiple, mutually adhered regions that comprise conductive material, such as a thermoplastic conductive elastomer...
Matches 1 - 50 out of 91 1 2 >